Tackiness adhesive sheet for thin-film substrate fixing

Abstract

The present invention provides a manufacturing method for efficiently and stably forming a pattern on a thin-film substrate. A thin-film substrate, a tackiness adhesive sheet for thin-film substrate fixing, and a hard substrate are laminated in this order and a porous base material functioning as a core material of the tackiness adhesive sheet for thin-film substrate fixing has bore holes. Therefore, even if preliminary heating and drying is not applied, air bubbles are not generated between the thin-film substrate and the tackiness adhesive sheet for fixing during pattern formation on the thin-film substrate. This makes it possible to stably and efficiently form a pattern.

Description

technical field [0001] The present invention relates to an adhesive sheet for fixing a film substrate and a method for forming a pattern on a film substrate, more specifically, to a flexible circuit board (FPC), a base substrate of an organic EL panel, or electronic paper, flexible Adhesive sheets for fixing film substrates used for pattern formation on film substrates in the manufacture of drive circuits for displays, passive matrices or color filters, circuit substrates for touch panels, and film-forming processes for solar cells, and in Pattern formation method on thin film substrate. Background technique [0002] Conventionally, substrates such as circuit boards, organic EL panel base substrates, and color filters have rigidity due to their thickness. Therefore, when pattern formation is performed on these substrates, the substrate can be fixed at an accurate position without troublesome handling such as fixing and moving. Pattern formation is performed on these substra...

AI Technical Summary

Problems solved by technology

[0004] In this case, the driving circuit, passive matrix, color filter, touch panel circuit board, etc. need to be patterned on a so-called heat-resistant metal foil or plastic substrate instead of a conventional glass substrate. These metal foils, Since the plastic substrate is a thin film, it is difficult to accurately fix and transport problems.

[0005] In particular, when patterning is performed, positional shifts occur due to slight strain on the substrate, resulting in a significant decrease in yield

In addition, even if the substrate is fixed by an adsorption plate using a porous plate, the position is shifted due to the minute depression of the adsorption part, resulting in problems such as a decrease in yield.

[0006] Therefore, in order to develop the α-Si TFT-EPD display, Philips Corporation (Philips Corporation) proposed the method that the polyimide substrate is separated from the glass by transfer printing technology after polyimide is coated on the glass, and this In some cases, laser annealing is required to remove the glass substrate, and as a result, there are problems in that new equipment is required, and an inexpensive thin-film substrate cannot be used from the viewpoint of heat resistance.

In addition, there is a serious problem that even if pre-drying is performed once, if the patterning process is not passed within 30 minutes to 1 hour, moisture will be absorbed through the cross section of the tape, and if pre-drying is not performed again, the above-mentioned bubble problem will occur.

Furthermore, in the pattern forming process in this field, when each layer is formed, it is necessary to pass through a chemical solution treatment process called a so-called development process for removing unnecessary parts, and moisture will inevitably be absorbed in this process, so it is necessary to As a result, there is a serious problem of going through a preheating process before pattern formation of each layer: the operating rate of expensive pattern formation equipment will be reduced, and the cost will become very high

Images