Temperature compensation current reference circuit applied to integrated circuit

Abstract

The invention provides a temperature compensation current reference circuit applied to an integrated circuit, wherein a sixth transistor, a seventh transistor and an eighth transistor are mutually matched current mirrors, and the proportion of the current mirrors is 1:1:1; a ninth transistor and a tenth transistor are mutually matched current mirrors, the proportion of the current mirrors is 1:1; a first transistor and a second transistor are mutually matched NPN triodes; a third transistor and a fourth transistor are mutually matched; and a first resistor utilizes a high-value polycrystal resistor, and a second resistor utilizes a P-type ion injection resistor. Positive temperature coefficient current and negative temperature coefficient current are added to obtain temperature compensation reference current, and then the temperature compensation reference current is provided for other circuits by utilizing the current mirrors. The temperature compensation current reference circuit applied to the integrated circuit, disclosed by the invention, has the advantages that the reference current changes very tiny in a certain temperature change range (minus 40-130 DEG C).

Description

technical field [0001] The invention relates to a current reference circuit of an integrated circuit, in particular to a temperature compensation current reference circuit applied to an integrated circuit. Background technique [0002] It is often difficult to generate a temperature-independent reference current in an integrated circuit, because in the integrated circuit manufacturing process, resistors are usually manufactured by diffusion or ion implantation, and this resistor has a specific temperature coefficient. , which means that the resistance value will change as the operating temperature of the IC changes. The temperature dependence of the resistance value causes the reference current value to vary with temperature. [0003] In order to overcome the above-mentioned problem that the reference current varies with temperature, an external resistor R11 and a bandgap voltage reference Bandgap can be used to form a temperature-independent current source, such as figure...

AI Technical Summary

Problems solved by technology

However, in the current integrated circuit manufacturing process, the resistor with a low temperature coefficient has a very small resistance value per unit area. In order to obtain a microampere-level reference current inside the chip, a large amount of integrated circuit area is required to manufacture the resistor, which will also increase integration. circuit cost

Moreover, the low temperature coefficient resistor is manufactured by diffusion process, and its absolute value is difficult to control

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