Bonding equipment for chips and wafers

Abstract

The invention discloses bonding equipment for chips and wafers. The bonding equipment comprises a wafer table, a memory module, a manipulator, microscope systems and a control system. Accurate positioning is realized by adopting a motor module with multiple degrees of freedom; the poses of the chips are identified and detected through the microscope systems; the chips are picked and released by the vacuum absorption manipulator; then, applied pressure is measured through piezoelectric ceramics integrated at the rear end of the manipulator, thus, the operation precision is ensured and the proper bonding pressure is applied during the chip operation process. The end faces of two induction copper pillars are contacted with each other, thus, a vacuum sucker is prevented from naturally inclining downwards under the action of gravity, and the measurement accuracy is ensured. Moreover, the position of the vacuum sucker is induced through the two induction copper pillars, thus, the control system is informed to start to detect current output by the piezoelectric ceramics.

Description

technical field [0001] The invention relates to a bonding device for a chip and a wafer, in particular to a bonding device which can be adapted to various chips. Background technique [0002] The difference between Micro-Electro-Mechanical Systems (MEMS) devices and integrated circuits mainly includes two aspects. One is to contain movable structures, and the other is to interact with the environment. These two points bring great difficulty to packaging. , and its high packaging cost is mainly caused by these two points. Due to the movable structure, the movable structure must be protected from damage during the packaging process, so the mature integrated circuit packaging process cannot be directly used. Due to the interaction with the environment, the packaging must not only take into account the interaction with the environment, but also ensure that the performance of the device is not affected, which is very difficult to deal with. At the same time, the pre-alignment b...

AI Technical Summary

Problems solved by technology

[0004] In the chip and wafer-level packaging process, the operator is a common part in the chip pick-up and release process, which is usually in the shape of a cantilever, such as the operator in the application CN201120279898.2, and for the cantilever operator, due to the cantilever The influence of its own gravity will cause the operator's hand to deflect downward, which will lead to unfavorable force control when picking up and releasing the chip

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