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Method and device for measuring linear shrinkage rate and thermal stress of metal solidification process

A technology of metal solidification and linear shrinkage, which is applied in the investigation stage/state change, etc., can solve problems such as difficult testing and uneven temperature, and achieve accurate and reasonable solidification shrinkage characteristics, low axial temperature gradient, linear shrinkage and thermal The effect of accurate stress value

Active Publication Date: 2015-07-01
SHANGHAI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The present invention adopts an accurate measurement device for metal solidification shrinkage rate and thermal stress, which measures shrinkage rate and thermal stress simultaneously through in-situ melting and solidification methods combined with displacement sensors and stress sensors to solve the current problem of metal solidification line shrinkage rate and thermal stress Problems of uneven temperature and difficult testing during measurement

Method used

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  • Method and device for measuring linear shrinkage rate and thermal stress of metal solidification process
  • Method and device for measuring linear shrinkage rate and thermal stress of metal solidification process
  • Method and device for measuring linear shrinkage rate and thermal stress of metal solidification process

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Embodiment 1

[0030] refer to Figure 1~Figure 6 , the linear shrinkage rate and thermal stress measurement method during the metal solidification process. Put the metal material in the crucible, fix the crucible on the horizontal support, put the crucible in the heating furnace under the protection of vacuum or set atmosphere to heat; after the metal reaches the preset melting temperature and keep warm, remove the heating furnace, measure the line The shrinkage rate and thermal stress sensors are in full contact with the molten metal through the transmission mechanism, and measure the linear shrinkage rate and thermal stress of the metal under different cooling rates. It is characterized by:

[0031] 1) The samples (13, 14) are solidified after in-situ melting in the crucible (7), which can realize solidification under different cooling conditions;

[0032] 2) During the cooling process, the sample is uniformly solidified, the axial temperature gradient is low, and the measured linear sh...

Embodiment 2

[0035] refer to Figure 1~Figure 6 , the measuring device for shrinkage rate and thermal stress during the metal solidification process mainly includes heating and atmosphere protection system, temperature control and temperature acquisition system, linear shrinkage rate and thermal stress acquisition system, transmission system, data display and processing system, etc. system. Using this device to measure the shrinkage rate and thermal stress during the metal solidification process is as follows:

[0036] 1. Make a block of the metal sample to be tested into a suitable size, and put it in the thermal stress sample crucible (13) and the shrinkage sample crucible (14). The size of the two sample crucibles is 200mm long and 10mm wide , 20mm high. The two sample crucibles (13, 14) prevent the formation of a crucible (7) on the crucible insulation layer base (15), and the crucible (7) is fixed on the horizontally fixed crucible support (6). The whole crucible is initially place...

Embodiment 3

[0043] refer to Figure 1~Figure 6 , the measuring device for shrinkage rate and thermal stress in the metal solidification process is applied to the above method for measurement, including heating and atmosphere protection system, crucible (7), temperature control and temperature acquisition system, linear shrinkage rate and thermal stress acquisition system, The transmission system, data display and processing system are characterized as follows:

[0044]1) The heating and atmosphere protection system: the main body of the system is a silicon-molybdenum rod box-type atmosphere protection resistance furnace (5); the heating curve can be set arbitrarily within the tolerance range of the heating body; the resistance furnace (5) passes through the pulley (8) Installed on the guide rail (9), driven by the transmission system, to realize horizontal movement, so that the crucible (7) fixedly installed on the crucible support (6) moves in and out from the furnace mouth of the resist...

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Abstract

The invention relates to a method and a device for measuring a linear shrinkage rate and a thermal stress of a metal solidification process, which can solve the problems that the temperature is not uniform and the test is difficult in the existing method for measuring the shrinkage rate and the thermal stress of a black metal solidification process. The method comprises the following steps of: after smelting a sample in a crucible in situ, solidifying to realize the solidification under different cooling conditions; uniformly solidifying the sample in a temperature reducing process, wherein an axial temperature gradient is low and the measured linear shrinkage rate and thermal stress are accurate; and simultaneously measuring the linear shrinkage rate and the thermal stress in the solidification process through a stress sensor and a displacement sensor to realize continuous real-time measurement and correspond to those in an actual solidification process. According to the method and the device disclosed by the invention, the solidification and shrinkage properties of the metal can be accurately and reasonably measured, and the method and the device have important meanings of determining a casting and continuous casting process, improving relative equipment parameters and accelerating the quality and the yield of a casting blank and a casting piece.

Description

technical field [0001] The invention relates to a method and device for studying the line shrinkage rate and thermal stress measurement of metal solidification process under different cooling conditions, and belongs to the field of physical property measurement of metal solidification process. Background technique [0002] The invention mainly relates to the technical field of solidification such as casting and continuous casting. Solidification shrinkage will occur during the solidification process of the metal. As the solidification proceeds, the volume of the metal will change, and the objects in contact with it or the metal itself will produce stress, which sometimes leads to hot cracking and cold cracking of the casting. [0003] Linear shrinkage and thermal stress are usually measured using linear shrinkage and thermal cracking instruments. The molten metal is poured into the mold to solidify, and the measurement of solidification line shrinkage and thermal stress...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N25/02
Inventor 仲红刚孙卿卿曹欣陈湘茹李仁兴翟启杰
Owner SHANGHAI UNIV
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