Optoelectronic component and method for producing an opto-electronic component

Abstract

The invention relates to an optoelectronic component comprising at least one inorganic optoelectronically active semiconductor component (10) having an active region (3) suitable for emitting or receiving light during operation, and a sealing material (6) applied to at least one surface region (7) by means of atomic layer deposition, covering the surface region (7) in a hermetically sealing manner. The invention further relates to a method for producing an opto-electronic component.

Description

technical field [0001] The invention proposes an optoelectronic component and a method for producing an optoelectronic component. Background technique [0002] Optoelectronic semiconductor devices such as light-emitting diodes (LEDs), edge-emitting lasers, vertical-cavity surface-emitting lasers (VCSELs), laser arrays, photodiodes, solar cells, phototransistors, etc. are increasingly used in lighting technology, projection, Central components in data storage, printing technology, energy harvesting and many other applications. [0003] Material systems based on AlInGaN, InGaAlP and AlGaAs can cover the entire spectral range from ultraviolet to infrared for emitting or detecting semiconductor devices. Light sources based in particular on so-called semiconductor systems have advantages over competing solutions such as incandescent lamps or halogen light sources in terms of their compactness and high service life. [0004] In this case, innovative technical developments, such ...

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Problems solved by technology

[0011] However, the layers deposited by the above commonly used methods have, for example, the disadvantage that with this method only an insufficiently uniform coverage of steep and locally unevenly shaped side walls on all sides can be achieved.

The disadvantages of this method are, on the one hand, the high assembly complexity associated with additional costs and, on the other hand, the inability to prevent damage caused by leaks in the housing and / or residual moisture in the housing. Damage to the laser diode and thus the risk of failure of the laser diode

[0014] Expensive and often insufficient measures of encapsulating the laser diode in a hermetically sealed housing in order to thereby increase the stability of the component have additional, significant disadvantages which are related to the limited structural shape and size. The compactness is associated with the low flexibility regarding the integration of other optical components

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