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Preparation method of organosilicon conductive adhesive containing nanorod-shaped zinc oxide

A nano-rod-shaped, zinc oxide technology, applied in conductive adhesives, adhesive additives, non-polymer adhesive additives, etc., can solve problems such as unfavorable conductive properties of adhesives, limited practical application range, poor mechanical strength of adhesives, etc. , to achieve the effect of superior reinforcement performance, improved mechanical and mechanical properties, and improved electrical conductivity

Inactive Publication Date: 2013-08-07
JIANGSU DONGTAI FINE CHEM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Silicone can bond metals, plastics, rubber, ceramics, etc., however its low mechanical strength further limits its range of applications
[0003] A silicone conductive adhesive (country: China, publication number: 101412851, publication date: 2009-4-22) discloses a silicone conductive adhesive prepared with silicone resin, organic solvent and silver powder as main components, and the obtained adhesive The mechanical strength has been improved, and the electrical conductivity is superior, but this method uses silver powder as the conductive filler, and its main disadvantage is the high cost.
[0004] Polyaniline conductive adhesive (country: China, publication number: 1778856, publication date: 2006-5-31) discloses a silicone rubber emulsion, conductive polyaniline, n-butanol, butyl acetate, dibutyl dilauric acid Tin is used as a raw material to prepare a conductive adhesive. Although this method reduces the production cost, its disadvantages are: 1) The problem of low strength of the adhesive itself is ignored, and with the addition of conductive polyaniline, the mechanical properties of the adhesive are reduced. The strength becomes worse; 2) This method uses a blending method to directly add conductive filler polyaniline to the silicone rubber emulsion, which is not conducive to improving the conductivity of the adhesive, thereby limiting the actual application range of the product

Method used

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  • Preparation method of organosilicon conductive adhesive containing nanorod-shaped zinc oxide

Examples

Experimental program
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Effect test

Embodiment 1

[0026] Example 1: (1) 1 kg of water-soluble polymer silane coupling agent was added to 50 kg of deionized water, and the pH value of the system was adjusted to 6 with a formic acid solution with a mass concentration of 5%, to obtain a water-soluble polymer silane coupling agent. Combined agent hydrolyzate, then the system was heated up to 95 ° C, adding 15 kg of rod-shaped zinc oxide with an aspect ratio of 5 and a diameter of 50 nanometers, and kept stirring for 1 hour to prepare a modified rod-shaped zinc oxide dispersion;

[0027] (2) Take 10 kg of the obtained modified rod-shaped zinc oxide dispersion, add 5 kg of pentamethylpentavinylcyclopentasiloxane, 2.25 kg of chloroprene, 0.1 kg of octylphenol polyoxygen Vinyl ether, keep the system temperature at 85°C, continue to stir for 30 minutes, add 0.5 kg of dodecylbenzenesulfonic acid and 14.5 kg of ammonium persulfate, and keep the temperature for 2 hours;

[0028] (3) Add 5 kg of pyrrole to the system prepared in step (2) ...

Embodiment 2

[0029] Example 2: (1) 0.75 kg of water-soluble polymer silane coupling agent was added to 50 kg of deionized water, and the pH value of the system was adjusted to 4.5 with an oxalic acid solution with a mass concentration of 7.5%, to obtain a water-soluble polymer Silane coupling agent hydrolyzate, then the system was heated up to 70°C, 5.62 kg of rod-shaped zinc oxide with an aspect ratio of 20 and a diameter of 10 nanometers was added, and kept stirring for 4 hours to obtain a modified rod-shaped zinc oxide dispersion;

[0030] (2) Get 10 kilograms of the prepared modified rod-shaped zinc oxide dispersion, add 4.5 kilograms of trimethyltrivinylcyclotrisiloxane, 1.13 kilograms of chloroprene, and 0.068 kilograms of polyvinyl alcohol successively while stirring, keeping The temperature of the system is 80°C, after continuing to stir for 50 minutes, add 0.36 kg of p-toluenesulfonic acid and 8.4 kg of ammonium persulfate, and keep the temperature for 3 hours;

[0031] (3) Add 2....

Embodiment 3

[0032] Example 3: (1) 0.25 kg of water-soluble polymer silane coupling agent was added to 50 kg of deionized water, and the pH value of the system was adjusted to 4 with an oxalic acid solution with a mass concentration of 15%, to obtain a water-soluble polymer Silane coupling agent hydrolyzate, then the system was heated up to 60°C, 1.25 kg of rod-shaped zinc oxide with an aspect ratio of 15 and a diameter of 20 nanometers was added, and kept stirring for 5 hours to obtain a modified rod-shaped zinc oxide dispersion;

[0033] (2) Take 10 kg of the prepared modified rod-shaped zinc oxide dispersion, add 3 kg of trimethyltrivinylcyclotrisiloxane, 0.45 kg of chloroprene, 0.015 kg of nonylphenol polyoxygen Vinyl ether, keep the system temperature at 65°C, continue to stir for 90 minutes, add 0.015 kg of p-toluenesulfonic acid, 0.015 kg of camphorsulfonic acid and 1.73 kg of ammonium persulfate, and keep the temperature for 6 hours;

[0034] (3) Add 1.5 kg of pyrrole to the system...

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Abstract

The invention discloses a preparation method of an organosilicon conductive adhesive containing nanorod-shaped zinc oxide, which comprises the following steps: preparing a modified rod-shaped zinc oxide dispersion liquid, adding an organic monomer into the modified rod-shaped zinc oxide dispersion liquid to carry out polymerization reaction, and adding a conductive polymer monomer to carry out polymerization reaction, thereby obtaining the organosilicon conductive adhesive containing nanorod-shaped zinc oxide. The organosilicon conductive adhesive has the advantages of excellent conductivity,excellent mechanical properties and low production cost.

Description

technical field [0001] The invention relates to a preparation method of organic silicon conductive glue, in particular to a preparation method of organic silicon conductive glue containing nano-rod zinc oxide. Background technique [0002] Organic silica gel is widely used in various industries such as electronics, communication, and chemical industry due to its good high and low temperature resistance, weather resistance, corrosion resistance, small permanent deformation, and non-toxicity. Silicone silicone can bond metals, plastics, rubber, ceramics, etc., however its low mechanical strength further limits its range of applications. [0003] A silicone conductive adhesive (country: China, publication number: 101412851, publication date: 2009-4-22) discloses a silicone conductive adhesive prepared with silicone resin, organic solvent and silver powder as main components, and the obtained adhesive The mechanical strength is improved, and the electrical conductivity is super...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J143/04C09J179/02C09J179/04C09J11/04C09J9/02C08F230/08C08F236/18C08F2/24C08G73/02C08G73/06
Inventor 姚超杨运胡静怡冯建渡左士祥朱洪波
Owner JIANGSU DONGTAI FINE CHEM
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