Photoresist recovery system

Abstract

The invention provides a photoresist recovery system, and belongs to the field of color film substrate and array substrate manufacture. The photoresist recovery system comprises a substrate chassis and a top cover thereof, a substrate rotating disc disposed on the substrate chassis, a substrate locking groove disposed on the substrate rotating disc and used for accommodating a substrate, and a thrown photoresist storage groove used for receiving photoresist thrown off from the substrate during the rotation of the substrate rotating disc, and also comprises: a filtering device which is connected with the thrown photoresist storage groove through a pipeline provided with a valve and is used for filtering photoresist which flows out from the thrown photoresist storage groove and flows in through the pipeline; a cleaning device which is used for cleaning the thrown photoresist storage groove; a control device which is used for controlling the valve to be open in a photoresist recovery phase and controlling the cleaning device to stop cleaning the thrown photoresist storage groove, and controlling the valve to be close in a cleaning phase and controlling the cleaning device to clean the thrown photoresist storage groove. The embodiments of the invention can recover photoresist thrown off in photolithographic technology.

Description

technical field [0001] The invention relates to the field of manufacturing color filter substrates and array substrates, in particular to a photoresist recovery system. Background technique [0002] In the photolithography process for manufacturing color filter substrates and array substrates, the commonly used gluing methods generally include direct squeegee coating (Slit) and squeegee coating followed by spin coating (Slit+Spin). Using the Slit+Spin method can achieve better film thickness uniformity and surface smoothness, which is better than the single Slit method in terms of surface uniformity. [0003] figure 1 Shown is a schematic diagram of the device structure of the spin-coated photoresist in the Slit+Spin mode in the prior art, wherein the substrate rotating disk 2 is located in the substrate chassis 1, and the substrate clamping groove 4 is located on the substrate rotating disk 2, driven by the substrate rotating disk 2. During the high-speed rotation of the ...

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Problems solved by technology

[0004] In the prior art, after the upper cover of the substrate chassis is opened after the glue has been thrown, the substrate rotating disk 2 and the glue storage tank 3 will be exposed to the air, and the photoresist will be polluted by particles in the air, and the photoresist will be polluted during the discharge process. The glue will also be polluted, which makes the photoresist unable to be recycled. The large amount of photoresist not only pollutes the environment, but also causes waste of photoresist, which increases the cost of producing color filter substrates and array substrates.

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