Method for inhibiting secondary electron emission of microwave component surface by adopting nanostructure plating layer

Abstract

The invention relates to a method for inhibiting secondary electron emission of a microwave component surface by adopting a nanostructure plating layer. According to the method, a microwave component is subjected to necessary washing, and then is coated with a protection glue to protect the surface requiring no treatment; phosphoric acid is adopted to carry out an electrochemical etching treatment, such that a porous alumina film layer with a hole size of about 100 nm and a depth-to-width ratio more than 10 is formed on the surface of an aluminum alloy; repeated washing is performed to remove the protection glue; a layer of a silver layer with a thickness of about 50 nm is plated on the oxidation film through evaporation plating; and finally a vacuum heating treatment is performed. With the treatment of the method of the present invention, binding force of the plating layer and the substrate can be improved, and the characteristic of the significantly-reduced melting point of the nano-silver is adopted, such that the nano-silver is self-assembled on the surface of the oxidation layer to form a nano-trap structure while the continuity of the silver plating layer can be maintained well; and inhibition of secondary electron emission is achieved based on assurance of a certain electrical conductivity. The method of the present invention provides good cohesion for the existing microwave component treatment process, and the secondary electron emission coefficient of the microwave component surface is significantly inhibited.

Description

Technical field:

[0001] The patent of the invention relates to the field of surface treatment of satellite microwave components, in particular to a method for suppressing secondary electron emission on the surface of microwave components by using a nanostructured coating. Background technique:

[0002] At present, most of the microwave passive components in the satellite payload system are based on aluminum alloy. In order to reduce the loss of the device, the most commonly used method is the surface electrochemical silver plating. In actual use, these silver-plated parts are prone to multiplier discharge effect under the condition of high-power electromagnetic wave transmission, which is called micro-discharge phenomenon. Micro-discharge breakdown of microwave components is one of the main factors that determine the reliability and life of satellites. With the expansion of the operating range of microwave components, the need to suppress micro-discharge is becoming more an...

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