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Mask alignment adaptive scanning method

A scanning method and mask alignment technology, applied in the field of self-adaptive scanning for mask alignment, can solve problems such as poor alignment effect, horizontal and vertical scanning optimization, etc.

Active Publication Date: 2012-10-17
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem solved by the present invention is that the existing mask alignment scanning method improves the efficiency while the alignment effect deteriorates and the horizontal and vertical scanning cannot be optimized at the same time

Method used

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  • Mask alignment adaptive scanning method

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Embodiment Construction

[0034] Specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0035] see figure 1 As shown, a mask alignment adaptive scanning method of the present invention includes the following steps:

[0036] First, step 101 is executed to determine the maximum effective value and the minimum effective value of the vertical and horizontal aerial images of the mask mark. The maximum effective value eff_max_z and the minimum effective value eff_min_z of the vertical aerial image, and the maximum effective value eff_max_x and the minimum effective value eff_min_x of the horizontal aerial image. These values ​​are calculated by empirical formulas when they are used for the first time.

[0037] Next, execute step 102 to perform mask alignment scanning. According to the number of sampling points in the mask mark space image, the maximum effective value and the minimum effective value of the vertical space image of the m...

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Abstract

The invention discloses a mask alignment adaptive scanning method. The mask alignment adaptive scanning method comprises the following steps of 1, determining a maximum effective value and a minimum effective value of mark space images in a vertical direction and a horizontal direction, 2, carrying out mask alignment scanning, and calculating the number of sampling points in a vertical direction and in a horizontal direction according to the maximum effective value and the minimum effective value of the space images in a vertical direction and a horizontal direction, and the number of sampling points in the space images, 3, after mask alignment scanning, calculating the height and the width of measured space images according to data obtained by a sensor, and 4, when the height and the width of the measured space images are in a threshold range, calculating index forgetting factors in a vertical direction and a horizontal direction, and returning to the step 2 after updating the maximum effective value and the minimum effective value of the mark space images in a vertical direction and a horizontal direction according to the index forgetting factors in a vertical direction and a horizontal direction, or when the height and the width of the measured space images are not in the threshold range, directly returning the step 2. The mask alignment adaptive scanning method improves production efficiency, guarantees alignment precision, and realizes optimization of the number of sampling points in a vertical direction and a horizontal direction.

Description

technical field [0001] The invention relates to an adaptive scanning technology, in particular to an adaptive scanning method applied to mask alignment. Background technique [0002] In the process of sampling lithography machines for integrated circuit chip production, in order to achieve the desired accuracy index of the lithography machine, it is necessary to accurately establish the relationship between the coordinate systems of the lithography machine, so that the mask, mask stage, projection objective lens, silicon wafer , Wafer stage can work in a unified calibration system. Alignment is finding the exact position of the mask or the mark on the mask table imaged under the lens by the alignment marks on the wafer stage. Use the sensor to scan and sample the light intensity in the horizontal and vertical directions, and find the position of the point of maximum light intensity by fitting and calculating the light intensity data, which is the alignment position. [000...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/20G03F9/00
Inventor 胡明辉李运锋
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD