Preparation method of Ti5Si3 particle reinforced TiAl-based composite material plate
A particle-reinforced, composite material technology, which is applied in the field of preparation of TiAl-based composite material sheets, can solve the problems of complex preparation process and uneven distribution of reinforcements, and achieve the effects of good bonding, enhanced mechanical properties, and uniform structure.
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specific Embodiment approach 1
[0015] Specific implementation mode one: present implementation mode Ti 5 Si 3 The preparation method of the particle-reinforced TiAl-based composite material plate is carried out according to the following steps:
[0016] 1. Alternately stack Al-Si alloy plates and pure Ti plates in a vacuum hot-press sintering furnace. First, vacuum the vacuum hot-press sintering furnace to a vacuum degree of 0.01Pa, then raise the temperature to 300-500°C, and apply Hot pressing at a pressure of 10-30MPa for 0.5-2h, and then hot-rolling at 300-500°C to prepare Al-Si / Ti multilayer composite plates;
[0017] 2. The multi-layer composite plate prepared in step 1 is placed in a vacuum hot-pressing sintering furnace, heat-treated at 500-700°C for 5-30 hours, and then at 900-1200°C for 5-40 hours to obtain Ti 5 Si 3 Particle-reinforced TiAl-based composite sheet.
[0018] This embodiment adopts Ti rolled and heat-treated to prepare 5 Si 3 Particle-reinforced TiAl-based composite sheet, incl...
specific Embodiment approach 2
[0023] Specific embodiment 2: The difference between this embodiment and specific embodiment 1 is that in step 1, the number of Al-Si alloys and Ti plates alternately laminated is 2n+1 layers, n is a positive integer less than 200, and the outermost The layers are all pure Ti plates. Others are the same as in the first embodiment.
specific Embodiment approach 3
[0024] Embodiment 3: This embodiment differs from Embodiment 1 or Embodiment 2 in that: in step 1, the thickness of the Al—Si alloy and the pure Ti plate are not more than 1 mm. Others are the same as in the first or second embodiment.
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