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Modified epoxide resin with thermal driving shape memory function and preparation method thereof

An epoxy resin, thermally driven technology, applied in the field of modified epoxy resin and preparation, shape memory polymer, can solve the problems of long response time, high thermal response temperature, difficult to achieve saturated shape memory effect, etc., to achieve the response time The effect of short, low thermal response temperature

Inactive Publication Date: 2014-09-24
ZHONGBEI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Epoxy resin is a main resin matrix of aerospace composite materials. The Chinese patent "A liquid crystal epoxy resin with shape memory effect and its preparation method and application" (publication number CN102504202A) discloses that after heating and melting epoxy resin Pour it into a preheated mold, heat and cure, first cure at 40~170°C for 4~8 hours, and then cure at 200~220°C for 0.5~2 hours; Chinese patent "An epoxy resin shape memory polymer material and its preparation method" (publication number CN101195701A) discloses that the liquid crystal epoxy resin monomer and curing agent are dissolved, and then a curing accelerator is added, pre-cured at 50-120°C for 5-12 hours in vacuum, and then cured at a medium temperature of 150-160°C 4-6 hours, 180-220°C curing for 1-2 hours, to obtain epoxy resin shape memory materials; the epoxy resin shape memory polymer reported by the above method is difficult to achieve saturated shape memory effect, and the thermal response temperature is high, Long response time, low deformation angle and low shape recovery

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Get 100g polyethylene glycol 200, weigh 2-mercaptoacetic acid as 1:2 by the molar ratio of polyethylene glycol 200 and 2-mercaptoacetic acid, drop in the 500ml four-necked flask that oil-water separator is housed, add 50ml benzene, 1% p-toluenesulfonic acid in the total mass of the reactants is heated to boiling, and the water generated by the reaction is separated through an oil-water separator. After the esterification reaction is completed, the intermediate product polyethylene glycol-terminated thioglycolate is obtained.

[0029] Take by weighing 90g epoxy resin E-44, take by weighing the polyethylene glycol-terminated thioglycolate synthesized in the previous step by the mol ratio of mercapto-terminated glycol ester and epoxy resin 5:100, then drop into the reactor equipped with stirring Inside, heated to 40°C and reacted for 2 hours to obtain the corresponding modified epoxy resin.

[0030] Weigh 34g amino-terminated polyether D-400 and 2.4g amino-terminated polye...

Embodiment 2

[0033] Take by weighing 90g epoxy resin E-44, take by weighing the polyethylene glycol-terminated thioglycolate synthesized in the last step by the mol ratio of mercapto-terminated glycol ester and epoxy resin 15:100, drop into the reactor with stirring, Heating to 40°C and reacting for 2 hours to obtain the corresponding modified epoxy resin.

[0034] Weigh 30g of amino-terminated polyether D-400 and 2.8g of amino-terminated polyether T-403, take the modified epoxy resin obtained in the previous step and the above-mentioned amine curing agent ratio, the unreacted epoxy group in the epoxy resin The molar ratio of amino group to amine curing agent is 2:1, transferred to another open reactor, stirred vigorously and mixed evenly, immersed in the molding mold, cured at 120°C for 2 hours, and the modified product with shape memory function was obtained. test piece of epoxy resin. The thermal response temperature of the obtained test piece was measured to be 40° C., and the tensile...

Embodiment 3

[0037] Take by weighing 90g epoxy resin E-44, take by weighing the polyglycol-terminated thioglycolate synthesized in the previous step by the mol ratio of mercapto-terminated glycol ester and epoxy resin 20:100, drop into the reactor equipped with stirring , heated to 40°C, and reacted for 2 hours to obtain the corresponding modified epoxy resin.

[0038] Take by weighing 32g amino-terminated polyether D-400, take the modified epoxy resin obtained in the previous step and the ratio of the above-mentioned amine curing agent, the amino molar ratio of the unreacted epoxy group in the epoxy resin to the amine curing agent 2:1, transferred to another open reactor, vigorously stirred and mixed evenly, immersed in the molding mold, cured at 120°C for 2 hours, and the modified epoxy resin specimen with shape memory function was obtained. The thermal response temperature of the obtained test piece was measured to be 32° C., and the tensile strength thereof was 46 MPa.

[0039] After ...

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Abstract

The invention relates to a modified epoxide resin with a shape memory function and a preparation method of the modified epoxide resin, belonging to the technical field of a functional high molecular material. The response temperature of the modified epoxide resin material provided by the invention can be adjusted within the range of 32-60 DEG C, the material can be bent at a large angle of 720 degrees at the temperature more than the thermal response temperature, and the shape fixed rate and recovery rate of the modified epoxide resin reach 100%. The preparation method of the modified epoxide resin comprises the following steps of: firstly, preparing end sulfydryl dihydric alcohol ester; secondly, preparing modified epoxide resin; and thirdly, preparing the modified epoxide resin with the shape memory function. Compared with the existing shape memory material, the modified epoxide resin has the advantages of being simple in preparation technology, capable of meeting a green environment protection requirement, low in thermal response temperature, capable of being adjusted, capable of realizing saturated solidifying, low in solidifying temperature, short in solidifying time, short in thermal response time, large in sample flexible angle, and high in shape recovery rate.

Description

technical field [0001] The invention belongs to the technical field of functional polymer materials. The invention relates to a shape-memory polymer, in particular to a modified epoxy resin with heat-driven shape-memory function and a preparation method thereof. Background technique [0002] Shape memory polymer (Shape Memory Polymer, SMP) refers to a polymer that has an initial shape, and after being deformed and fixed, the external conditions can be changed by heating or other methods to restore the original shape. It is a stimulating-inductive new functional polymer material, which has the characteristic of being able to change its shape in response to external stimuli. Since the discovery of the shape memory effect of nickel-titanium alloys in the early 1960s, the research on memory alloys has made great progress. Compared with shape memory alloys, shape memory polymer materials have incomparable characteristics such as low density, high shape recovery rate, wide memor...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G59/50C08G59/20C08G59/16
Inventor 程原赵本波邓平乔宗文袁晓艳朱福田
Owner ZHONGBEI UNIV
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