Glue injection method for inductance component
A technology of inductive components and glue injection, which is applied in the manufacture of electrical components, inductors/transformers/magnets, circuits, etc., can solve the problems of high manufacturing cost, easy to pierce the tape, poor phase, etc., so that it is not easy to interfere with external forces and reduce manufacturing. The effect of cost and inductance stabilization
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[0025] see Figure 1 to Figure 5 As shown, the low-pressure glue injection method of the inductance element in this embodiment includes the inner ring positioning glue injection in the first stage and the outer ring package glue injection in the second stage:
[0026] The inner ring positioning glue injection is to install an inner ring positioning mold in the vertical low-pressure glue injection machine, and place the inductance element 10 with the iron cover 1 in the inner ring positioning mold (the setting of the iron cover 1 can effectively prevent Electromagnetic interference, inject glue after the electromagnetic coil is covered with an iron cover), put the inductance coil lead wire 2 of the inductance element 10 into the mold channel and lead out of the steel inner ring positioning mold, and operate the vertical low pressure injection machine to cover the inner ring positioning mold , inject the hot melt adhesive OM646 under the pressure of 5-40bar, and fill the inner r...
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Abstract
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