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Glue injection method for inductance component

An inductive component and glue injection technology, which is applied in electrical components, inductance/transformer/magnet manufacturing, circuits, etc., can solve the problems of high manufacturing cost, easy to pierce tape, poor phase, etc. Cost and inductance value stabilization effect

Active Publication Date: 2014-11-26
广州易力日拓电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Traditional injection molding process equipment systems generally have high costs, including expensive high-pressure injection molding machines, and must also have water cooling systems and relatively expensive steel molds. Generally, high-pressure injection molding processes require extremely high pressure due to poor fluidity of plastic raw materials. High pressure (350bar to 1300bar) can force the injection, so it is easy to pierce the tape, squeeze the coil to shift and crush the coil, etc., resulting in low resistance / inductance, high ratio difference, poor phase and other defects, and the product yield is low. , increased the manufacturing cost of the industry, especially after long-term use, the latent sequelae are gradually exposed, which is a hidden worry in the industry, and because the cooling time of plastic raw materials is long, the production is time-consuming, the output is low, and the manufacturing cost is high.

Method used

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  • Glue injection method for inductance component
  • Glue injection method for inductance component
  • Glue injection method for inductance component

Examples

Experimental program
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Effect test

Embodiment

[0025] see Figure 1 to Figure 5 As shown, the low-pressure glue injection method of the inductance element in this embodiment includes the inner ring positioning glue injection in the first stage and the outer ring package glue injection in the second stage:

[0026] The inner ring positioning glue injection is to install an inner ring positioning mold in the vertical low-pressure glue injection machine, and place the inductance element 10 with the iron cover 1 in the inner ring positioning mold (the setting of the iron cover 1 can effectively prevent Electromagnetic interference, inject glue after the electromagnetic coil is covered with an iron cover), put the inductance coil lead wire 2 of the inductance element 10 into the mold channel and lead out of the steel inner ring positioning mold, and operate the vertical low pressure injection machine to cover the inner ring positioning mold , inject the hot melt adhesive OM646 under the pressure of 5-40bar, and fill the inner r...

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Abstract

The invention discloses a glue injection method for an inductance component. According to the internal ring located glue injection, at least one layer of annular glue matched with a through hole in shape is injected in the through hole of the inductance component, wherein the two ends of the annular glue extend out of the two end faces of the inductance component, the peripheral surfaces of the extension ends are wavy, and the semi-finished inductance component is obtained; and according to the external ring encapsulated glue injection, glue is injected outside the semi-finished inductance component, and the glue layer at least covers the area not injected with glue except the area covered by the internal ring located glue injection, so that the two kinds of glue are jointed at a wavy interface. The inductance component manufactured with the method disclosed by the invention can resist high temperature, low temperature and high humidity, and is good in insulativity, stable in inductance value and low in cost.

Description

technical field [0001] The present invention is a low-pressure injection molding process for inductive components. This manufacturing process injects the hot melt adhesive of the packaging material into the mold with a very low injection pressure (2-40bar) and quickly solidifies and molds it (5-40 seconds). Achieve insulation, high temperature resistance, low temperature resistance, impact resistance, anti-electromagnetic interference, vibration reduction, moisture-proof, waterproof, anti-shedding, dust-proof, chemical corrosion resistance, etc., mainly used in the packaging and protection of precision and sensitive electronic components, especially It is suitable for the manufacture of current sensors and current transformers. Background technique [0002] Traditional injection molding process equipment systems generally have high costs, including expensive high-pressure injection molding machines, and must also have water cooling systems and relatively expensive steel mold...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01F41/00B29C45/14
Inventor 吕金宝
Owner 广州易力日拓电子科技有限公司