Red LED packaging method

An LED packaging, red light technology, applied in electrical components, circuits, semiconductor devices, etc., can solve problems such as difficulty in ensuring product quality in mass production, low red light color rendering index, and large color area dispersion, and achieves a wide range of benefits. Promote application, ensure product quality, and achieve high comprehensive performance

Inactive Publication Date: 2012-12-19
DONGGUAN JUJING PHOTOELECTRIC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Although the existing red light LED can achieve the effect of emitting red light, the packaging process is cumbersome and the cost is high. Moreover, the red light produced by it has a low color r

Method used

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  • Red LED packaging method

Examples

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Example Embodiment

[0019] Example: see figure 1 This embodiment provides a red light LED packaging method, which includes the following steps: (1) preparing a red light chip; (2) making a support, and a bowl for placing the red light chip is provided on the top of the support; ( 3) Prepare white glue, dot the white glue on the bottom of the bowl, then place the red light chip on the white glue, and then fix it on the bowl; (4) The first baking will fix the red light chip Move the bracket to the oven. The temperature of the oven is set to 140-160℃, and the baking time is set to 1.5-2.5 hours; (5) Wire bonding: prepare the gold wire, and weld one end of the gold wire to the On the red light chip, the other end is welded on the bracket to realize the connection between the red light chip and the bracket; (6) Dispensing glue, prepare silver light glue, and pour the silver light glue into the bowl of the bracket until it is clicked The surface of the silver gloss glue in the bowl is flush with the mo...

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Abstract

The invention discloses a red LED packaging method which comprises the following steps of: 1, preparing for a red light chip; 2, manufacturing a bracket; 3, preparing for white glue; 4, carrying out first-time baking; 4, welding a line; 6, dispensing; 7, carrying out secondary baking; and 8, carrying out glue sealing to obtain a red LED product. The red LED packaging method provided by the invention is easy in manufacture process, low in cost, easy to realize, and ensures product quality, and meets the requirement of massive production; and the red chip is preferentially selected from a AlGaInP four-element chip, raw material components and proportions of silver light glue and epoxy packaging sealing glue are scientifically and reasonably blended, thus the concentricity, the color rendering index and the light flux of a red light region can be improved, the discreteness is reduced, the service life is greatly prolonged, the comprehensive property is high, and wide popularization and application are facilitated.

Description

technical field [0001] The invention belongs to the field of LEDs, and in particular relates to a red LED packaging method. Background technique [0002] Light Emitting Diode (LED for short) is a component made of semiconductor materials. Because it can convert electrical energy into light, it is a tiny solid-state light source. It not only has small size, long life, and high driving voltage. It is low in weight, fast in response, and excellent in shock resistance, and can meet the design requirements of lightness, thinness, shortness, and smallness, and is widely used in various products in daily life. [0003] At present, the most commonly used is the white light LED. Its principle is to mix and energize the blue chip and phosphor to emit white light. This white light will gradually replace incandescent and fluorescent lamps in the future. [0004] However, in the actual application process, some lighting facilities require red light effects, such as various indoor lighti...

Claims

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Application Information

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IPC IPC(8): H01L33/48H01L33/50
Inventor 王德勋
Owner DONGGUAN JUJING PHOTOELECTRIC
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