Multi-chip front-mount packaging structure with etching first and packaging without base island and its manufacturing method

Abstract

The invention relates to a first etched and then packaged packaging structure with multiple chips normally installed and base islands buried as well as a preparation method thereof. The structure comprises base islands (1) and pins (2), wherein chips (4) are arranged on the fronts of the base islands (1); the fronts of the chips (4) and the fronts of the pins (2) are connected by metal wires (5); plastic package materials (6) are arranged in the surrounding regions of the base islands (1) and the pins (2) and outside the chips (4) and the metal wires (5); small holes (7) are arranged on the surfaces of the plastic package materials (6) on the lower parts of the pins (2); the small holes (7) are communicated with the backs of the pins (2); metal balls (9) are arranged in the small holes (7); and the metal balls (9) are contacted with the backs of the pins (2). The packaging structure and the preparation method have the following beneficial effects that the preparation cost is reduced; the safety and reliability of the packaging body are improved; environmental pollution is reduced; and design and preparation of high-density circuits are truly achieved.

Description

technical field [0001] The invention relates to a base-less island-free packaging structure and a manufacturing method thereof for multi-chip front-mounting, etching first, and then packaging. It belongs to the technical field of semiconductor packaging. Background technique [0002] The manufacturing process flow of the traditional high-density substrate package structure is as follows: [0003] Step 1, see Figure 26 , take a substrate made of glass fiber material, [0004] Step two, see Figure 27 , opening holes at desired locations on the fiberglass substrate, [0005] Step three, see Figure 28 , coated with a layer of copper foil on the back of the glass fiber substrate, [0006] Step 4, see Figure 29 , fill the conductive material in the position where the glass fiber substrate is punched, [0007] Step five, see Figure 30 , coated with a layer of copper foil on the front of the glass fiber substrate, [0008] Step six, see Figure 31 , coated with a phot...

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Problems solved by technology

[0019] 3. Glass fiber itself is a kind of foaming material, so it is easy to absorb moisture and moisture due to the storage time and environment, which directly affects the safety capability or reliability level of reliability;

[0020] 4. The surface of the glass fiber is covered with a copper foil metal layer thickness of about 50-100 μm, and the etching distance between the metal layer line and the line can only achieve an etching gap of 50-100 μm due to the characteristics of the etching factor (etching factor: minimum The best manufacturing capability is that the etching gap is approximately equal to the thickness of the object being etched, see Figure 38 ), so it is impossible to truly design and manufacture high-density circuits;

[0022]6. Also because the entire substrate material is made of glass fiber, the thickness of the glass fiber layer is obviously increased by 100~150μm, and it cannot be really ultra-thin encapsulation;

[0023]7. Due to the large difference in material characteristics (expansion coefficient) of the traditional glass fiber plus copper foil technology, it is easy to cause stress deformation in the harsh environment process, directly Affects the accuracy of component loading and the adhesion and reliability of components and substrates

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