61results about How to "Same material properties" patented technology

The present invention provides a novel crystalline oxide, a process for producing the crystalline oxides, a conductive paste comprising the crystalline oxides and an article comprising a substrate and an abovementioned conductive paste applied on the substrate. The present application can solve the problem that the content of the glass powder is too small to provide an appropriate pulling force and the reliability and durability of the solar cell are reduced. It is also possible to solve the problem that excessive glass powder will prevent the firing of the conductive paint and prevent the electrode from forming proper ohmic contact. During the firing of the conductive paint, the lead-tellurium-bismuth oxide crystals are heated and turned into liquid form, either alone or in combination with softened glass powder, providing appropriate corrosion and penetrating the anti-reflective layer on the front side of the solar cell, so that a good ohmic contact is formed between the conductive metal and the substrate and the conductive paint after firing forms a solar cell electrode having an appropriate physical property and excellent electrical conductivity.

An image forming apparatus which may form first and second visual images on first and second sides of a recording medium, includes a first image bearing member, a second image bearing member, a first transfer device that transfers the first visual image formed on the first image bearing member onto the second image bearing member or the second visual image formed on the first image bearing member onto the second side of the recording medium, a second transfer device that transfers the first visual image carried by the second image bearing member onto the first side of the recording medium, and a fixing device including first and second fixing members so as to fix the second and first visual images on the second and first sides of the recording medium, respectively. Surface properties of the first fixing member and the second image bearing member are substantially the same.

The invention relates to a multi-chip flip, etching-after-packaging and pad exposed packaging structure and a manufacturing method thereof. The structure comprises pads (1), pins (2) and a plurality of chips (3). The plurality of the chips (3) are arranged on the right sides of the pads (1) and the pins (2) in an inverted mode. Bottom filling glue (14) is arranged between the bottoms of the plurality of the chips (3) and the right sides of the pads (1) and the pins (2). Molding compounds (4) are packaged in areas on the peripheries of the pads (1), between the pads (1) and the pins (2), among the pins (2) and outside the plurality of the chips (3). Holes (5) are opened on the surfaces of the molding compounds (4) on the lower portions of pads (1) and the pins (2), and metal balls (7) are arranged in the holes (5). The multi-chip flip, etching-after-packaging and pad exposed packaging structure and the manufacturing method thereof have the advantages of reducing manufacturing costs, improving safety and reliability of packaging bodies, reducing environmental pollution, and being capable of designing and manufacturing high-density lines.

The invention relates to a packaging-first and etching-later manufacturing method for a chip formal single-surface three-dimensional circuit. The method comprises the following technology steps of taking a metal substrate; pre-plating copper material on the surface of the metal substrate; carrying out the operation of pasting a photo-resisting film; removing a part of the photo-resisting film from the front surface of the metal substrate; electro-plating an inert metal circuit layer; electro-plating a metal circuit layer; carrying out the operation of pasting a photo-resisting film; removing a part of the photo-resisting film from the front surface of the metal substrate; electro-plating the metal circuit layer; removing the photo-resisting film on the surface of the metal substrate; packaging; pre-processing of metallization; electro-plating the metal circuit layer; removing the photo-resisting film on the surface of the metal substrate; coating bonding materials; installing a chip; bonding with metal wires; packaging; carrying out the operation of pasting the photo-resisting film; removing a part of the photo-resisting film from the back surface of the metal substrate; chemical-etching; removing the photo-resisting film on the surface of the metal substrate; electro-plating the metal circuit layer; packaging; tapping on the surface of plastic package material; cleaning; implanting a metal ball; and cutting a finished product. The method disclosed by the invention has the beneficial effects that the manufacturing cost is lowered, the safety and the reliability of a packaging body are increased, the environment pollution is reduced, and the design and the manufacturing of a high-density circuit can be really realized.

The invention relates to a multi-chip flip, packaging-after-etching and non-pad packaging structure and a manufacturing method thereof. The structure comprises pins (1) and a plurality of chips (2). The plurality of the chips (2) are arranged on the right sides of the pins (1) in an inverted mode; bottom filling glue (13) is arranged between the bottoms of the chips (2) and the right sides of the pins (1); molding compounds (3) are packaged in areas on the peripheries of the pins (1), among the pins (1), on the upper portions and the lower portions of the pins (1) and outside the chips (2); holes (4) are opened on the surfaces of the molding compounds (3) on the lower portions of the pins (1), and communicated with the reverse sides of the pins (1); and metal balls (6) are arranged in the holes (4) and contacted with the reverse sides of the pins (1). The multi-chip flip, packaging-after-etching and non-pad packaging structure and the manufacturing method thereof have the advantages of reducing manufacturing costs, improving safety and reliability of packaging bodies, and being capable of designing and manufacturing high-density lines.

The invention relates to a first etched and then packaged packaging structure with a single chip reversedly installed and base islands buried as well as a preparation method thereof. The packaging structure comprises base islands (1), pins (2) and a chip (3), wherein the chip is reversedly installed on the fronts of the base islands and the fronts of the pins; underfills (14) are arranged between the bottom of the chip and the fronts of the base islands and the pins; plastic package materials (4) are arranged in the peripheral regions of the base islands, the regions between the base islands and the pins, the regions between the pins, the regions on the upper parts of the base islands and the pins and the regions on the lower parts of the base islands and the pins and on the periphery of the chip; small holes (5) are arranged on the plastic package materials on the backs of the pins and are communicated with the backs of the pins; and metal balls (7) are arranged in the small holes and are contacted with the backs of the pins. The packaging structure and the preparation method have the following beneficial effects that the preparation cost is reduced; the safety and reliability of the packaging body are improved; environmental pollution is reduced; and design and preparation of high-density circuits are truly achieved.

The invention relates to a single-chip horizontal packaging, packaging-after-etching and pad-embedded packaging structure and a manufacturing method thereof. The structure comprises pads (1) and pins (2). A chip (4) is arranged on the right sides of the pads (1), and the right side of the chip (4) and the right sides of the pins (2) are connected through metal wires (5). Molding compounds (6) are packaged on the peripheries of the pads (1) and the pins (2) and outside the chip (4) and the metal wires (5). Holes (7) are opened on surfaces of the molding compounds (6) on the lower portions of the pins (2) and communicated with the reverse sides of the pins (2). Metal balls (9) are arranged in the holes (7) and contacted with the reverse sides of the pins (2). The single-chip horizontal packaging, packaging-after-etching and pad-embedded packaging structure and the manufacturing method thereof have the advantages of reducing manufacturing costs, improving safety and reliability of packaging bodies, reducing environmental pollution, and being capable of designing and manufacturing high-density lines.

The invention relates to a single-chip flip, etching-after-packaging and pad embedded packaging structure and a manufacturing method thereof. The structure comprises pads (1), pins (2) and a chip (3). The chip is arranged on the right sides of the pads and the pins in an inverted mode; bottom filling glue (14) is arranged between the bottom of the chip and the right sides of the pads and the pins; molding compounds (4) are packaged in areas on the peripheries of the pads, between the pads and the pins, among the pins, on the upper portions of the pads and the pins, on the lower portions of the pads and the pins and on the periphery of the chip; holes (5) are opened on the molding compounds on the reverse sides of the pins, and communicated with the reverse sides of the pins; and metal balls (7) are arranged in the holes and contacted with the reverse sides of the pins. The single-chip flip, etching-after-packaging and pad embedded packaging structure and the manufacturing method thereof have the advantages of reducing manufacturing costs, improving safety and reliability of packaging bodies, reducing environmental pollution, and being capable of designing and manufacturing high-density lines.

The invention relates to a packaging-first and etching-later manufacturing method for a chip formal double-surface three-dimensional circuit and a packaging structure of the chip formal double-surface three-dimensional circuit. The method comprises the following technology steps of taking a metal substrate; pre-plating copper on the surface of the metal substrate; coating the surface of the metal substrate with green paint; removing a part of the green paint from the front surface of the metal substrate; electro-plating an inert metal circuit layer; electro-plating a metal circuit layer; coating the front surface of the metal substrate with the green paint; removing a part of the green paint from the front surface of the metal substrate; electro-plating the metal circuit layer; coating the front surface of the metal substrate with the green paint; removing a part of the green paint from the front surface of the metal substrate; coating a circuit screen board; pre-processing of metallization; removing the circuit screen board; electro-plating the metal circuit layer; coating bonding materials; installing a chip; bonding with metal wires; packaging; removing a part of the green paint from the back surface of the metal substrate; chemical-etching; electro-plating the metal circuit layer; electro-plating the metal circuit layer; coating the back surface of the metal substrate with the green paint; tapping on surface of the green paint; cleaning; implanting a metal ball; and cutting a finished product. The method disclosed by the invention has the beneficial effects that the manufacturing cost is lowered, the safety and the reliability of a packaging body are increased, the environment pollution is reduced, and the design and the manufacturing of a high-density circuit can be really realized.

The invention relates to a multi-chip positive packaging structure for embedding a basic island by first packaging and second etching, and a manufacturing method for the multi-chip positive packaging structure. The multi-chip positive packaging structure comprises the basic island (1) and pins (2), wherein chips (4) are arranged on the front face of the basic island (1); the front faces of the chips (4) are connected with the front faces of the pins (2) through metal wires (5); plastic materials (6) wrap the surrounding regions of the basic island (1) and the pins (2) as well as the chips (4) and the metal wires (5); small holes (7) are formed in the surfaces of the plastic materials (6) on the lower parts of the pins (2) and are communicated with the back faces of the pins (2); and metal balls (9) are arranged in the small holes (7) and are in contact with the back faces of the pins (2). The multi-chip positive packaging structure has the advantages that the manufacturing cost is reduced, the safety and the reliability of a package body are improved, the environment pollution is reduced, and design and manufacturing of a high-density line can be really realized.

The present invention provides a mandrel for rotational forming, the mandrel having a backing plate having a removably mounted mandrel portion and mandrel spacers, such that the mandrel is suitable for use in a variety of applications. kind of structure. Different configurations of mandrels may be used to provide different rotationally formed contoured surfaces upon which sheet metal or other rotationally formable material may be rotationally formed. The mandrel also has the ability to join individual metal sheets or multiple metal sheets into the desired rotationally formed product through friction stir welding or other suitable processing processes. The rotationally formed weld metal sheet may be trimmed to remove portions of the weld metal sheet, including the weld seams, that have significantly different material properties as a result of the welding process.

The invention relates to a first etched and then packaged packaging structure with a single chip normally installed and base islands buried as well as a preparation method thereof. The structure comprises base islands (1) and pins (2), wherein a chip (4) is arranged on the fronts of the base islands (1); the front of the chip (4) and the fronts of the pins (2) are connected by metal wires (5); plastic package materials (6) are arranged in the surrounding regions of the base islands (1) and the pins (2) and outside the chip (4) and the metal wires (5); small holes (7) are arranged on the surfaces of the plastic package materials (6) on the lower parts of the pins (2); the small holes (7) are communicated with the backs of the pins (2); metal balls (9) are arranged in the small holes (7); and the metal balls (9) are contacted with the backs of the pins (2). The packaging structure and the preparation method have the following beneficial effects that the preparation cost is reduced; the safety and reliability of the packaging body are improved; environmental pollution is reduced; and design and preparation of high-density circuits are truly achieved.

The invention relates to a multi-chip flip, etching-after-packaging and pad exposed packaging structure and a manufacturing method thereof. The structure comprises pads (1), pins (2) and a plurality of chips (3). The plurality of the chips (3) are arranged on the right sides of the pads (1) and the pins (2) in an inverted mode. Bottom filling glue (14) is arranged between the bottoms of the plurality of the chips (3) and the right sides of the pads (1) and the pins (2). Molding compounds (4) are packaged in areas on the peripheries of the pads (1), between the pads (1) and the pins (2), among the pins (2) and outside the plurality of the chips (3). Holes (5) are opened on the surfaces of the molding compounds (4) on the lower portions of pads (1) and the pins (2), and metal balls (7) are arranged in the holes (5). The multi-chip flip, etching-after-packaging and pad exposed packaging structure and the manufacturing method thereof have the advantages of reducing manufacturing costs, improving safety and reliability of packaging bodies, reducing environmental pollution, and being capable of designing and manufacturing high-density lines.

The invention relates to a first packaged and then etched packaging structure with a single chip normally installed and base islands buried and a preparation method of the structure. The structure comprises base islands (1) and pins (2), wherein a chip (4) is arranged on the fronts of the base islands (1); the front face of the chip (4) and the front faces of the pins (2) are connected by metal wires (5); plastic package materials (6) are arranged in the surrounding regions of the base islands (1) and the pins (2) and outside the chip (4) and the metal wires (5); small holes (7) are formed on the surfaces of the plastic package materials (6) on the lower parts of the pins (2); the small holes (7) are communicated with the backs of the pins (2); metal balls (9) are arranged in the small holes (7); and the metal balls (9) are contacted with the backs of the pins (2). The packaging structure and the preparation method have the following beneficial effects that the preparation cost is reduced; the safety and reliability of the packaging body are improved; environmental pollution is reduced; and design and preparation of high-density circuits are truly achieved.

The invention relates to a multi-chip positive packaging structure for embedding a basic island by first packaging and second etching, and a manufacturing method for the multi-chip positive packaging structure. The multi-chip positive packaging structure comprises the basic island (1) and pins (2), wherein chips (4) are arranged on the front face of the basic island (1); the front faces of the chips (4) are connected with the front faces of the pins (2) through metal wires (5); plastic materials (6) wrap the surrounding regions of the basic island (1) and the pins (2) as well as the chips (4) and the metal wires (5); small holes (7) are formed in the surfaces of the plastic materials (6) on the lower parts of the pins (2) and are communicated with the back faces of the pins (2); and metal balls (9) are arranged in the small holes (7) and are in contact with the back faces of the pins (2). The multi-chip positive packaging structure has the advantages that the manufacturing cost is reduced, the safety and the reliability of a package body are improved, the environment pollution is reduced, and design and manufacturing of a high-density line can be really realized.

The invention relates to a first etched and then packaged packaging structure with multiple chips normally installed and base islands buried as well as a preparation method thereof. The structure comprises base islands (1) and pins (2), wherein chips (4) are arranged on the fronts of the base islands (1); the fronts of the chips (4) and the fronts of the pins (2) are connected by metal wires (5); plastic package materials (6) are arranged in the surrounding regions of the base islands (1) and the pins (2) and outside the chips (4) and the metal wires (5); small holes (7) are arranged on the surfaces of the plastic package materials (6) on the lower parts of the pins (2); the small holes (7) are communicated with the backs of the pins (2); metal balls (9) are arranged in the small holes (7); and the metal balls (9) are contacted with the backs of the pins (2). The packaging structure and the preparation method have the following beneficial effects that the preparation cost is reduced; the safety and reliability of the packaging body are improved; environmental pollution is reduced; and design and preparation of high-density circuits are truly achieved.

The present application discloses a novel oxide crystal, a preparation method of the oxide crystal, a conductive paint containing the oxide crystal, and an object including a substrate and the conductive paint applied to the substrate. The present application can solve the problem that the content of glass powder is too small to provide proper pulling force and reduce the reliability and durability of solar cells. It can also solve the problem that too much glass powder will hinder the firing of the conductive paint, so that the electrodes cannot form proper ohmic contact. During the conductive paint firing process, lead-tellurium-bismuth-oxide crystals are heated to liquid form, acting alone or in combination with softened glass powder, to provide proper corrosion and penetrate the anti-reflection layer on the front side of the solar cell , so that a good ohmic contact is formed between the conductive metal and the substrate, so that the fired conductive paint forms a solar cell electrode with appropriate physical properties and excellent conductivity.

The invention relates to a first packaged and then etched packaging structure with multiple chips reversedly installed and base islands buried and a preparation method of the structure. The packaging structure comprises base islands (1), pins (2) and a plurality of chips (3), wherein the chips are reversedly installed on the front faces of the base islands and the front faces of the pins; underfills (14) are arranged among the bottoms of the chips, the fronts of the base islands and the pins; plastic package materials (4) are arranged in the peripheral regions of the base islands, the regions between the base islands and the pins, the regions between the pins, the regions on the upper parts of the base islands and the pins and the regions on the lower parts of the base islands and the pins and on the peripheries of the chips; small holes (5) are formed on the plastic package materials at the backs of the pins and are communicated with the backs of the pins; and metal balls (7) are arranged in the small holes and are contacted with the backs of the pins. The packaging structure and the preparation method have the following beneficial effects that the preparation cost is reduced; the safety and reliability of the packaging body are improved; environmental pollution is reduced; and design and preparation of high-density circuits are truly achieved.

The invention relates to a flip chip single-faced three-dimensional circuit manufacture method by encapsulation prior to etching. The method includes: taking a metal substrate; preplating copper to the metal substrate surface; coating with green paint; partially removing the green paint on the front of the metal substrate; electroplating an inert metal circuit layer; electroplating a metal circuit layer; coating with green paint; partially removing the green paint on the front of the metal substrate; electroplating metal circuit layer; coating with green paint; partially removing the green paint on the front of the metal substrate; coating a circuit screen plate; performing metallization pretreatment; removing the circuit screen plate; electroplating a metal circuit layer; mounting a chip and filling the bottom of the chip; encapsulating; partially removing the green paint on the back of the metal substrate; performing chemical etching; electroplating a metal circuit layer; coating with green paint; reserving holes on the green paint; cleaning; attaching balls; and cutting finished products. The flip chip single-faced three-dimensional circuit manufacture method by encapsulation prior to etching has the advantages that manufacture cost is lowered, safety and reliability of encapsulation are enhanced, environmental pollution is reduced, and design and manufacture of high density circuit are really achieved.