61results about How to "Same material properties" patented technology

An image forming apparatus which may form first and second visual images on first and second sides of a recording medium, includes a first image bearing member, a second image bearing member, a first transfer device that transfers the first visual image formed on the first image bearing member onto the second image bearing member or the second visual image formed on the first image bearing member onto the second side of the recording medium, a second transfer device that transfers the first visual image carried by the second image bearing member onto the first side of the recording medium, and a fixing device including first and second fixing members so as to fix the second and first visual images on the second and first sides of the recording medium, respectively. Surface properties of the first fixing member and the second image bearing member are substantially the same.

The invention relates to a packaging-first and etching-later manufacturing method for a chip formal double-surface three-dimensional circuit and a packaging structure of the chip formal double-surface three-dimensional circuit. The method comprises the following technology steps of taking a metal substrate; pre-plating copper on the surface of the metal substrate; coating the surface of the metal substrate with green paint; removing a part of the green paint from the front surface of the metal substrate; electro-plating an inert metal circuit layer; electro-plating a metal circuit layer; coating the front surface of the metal substrate with the green paint; removing a part of the green paint from the front surface of the metal substrate; electro-plating the metal circuit layer; coating the front surface of the metal substrate with the green paint; removing a part of the green paint from the front surface of the metal substrate; coating a circuit screen board; pre-processing of metallization; removing the circuit screen board; electro-plating the metal circuit layer; coating bonding materials; installing a chip; bonding with metal wires; packaging; removing a part of the green paint from the back surface of the metal substrate; chemical-etching; electro-plating the metal circuit layer; electro-plating the metal circuit layer; coating the back surface of the metal substrate with the green paint; tapping on surface of the green paint; cleaning; implanting a metal ball; and cutting a finished product. The method disclosed by the invention has the beneficial effects that the manufacturing cost is lowered, the safety and the reliability of a packaging body are increased, the environment pollution is reduced, and the design and the manufacturing of a high-density circuit can be really realized.

The present invention provides a mandrel for rotational forming, the mandrel having a backing plate having a removably mounted mandrel portion and mandrel spacers, such that the mandrel is suitable for use in a variety of applications. kind of structure. Different configurations of mandrels may be used to provide different rotationally formed contoured surfaces upon which sheet metal or other rotationally formable material may be rotationally formed. The mandrel also has the ability to join individual metal sheets or multiple metal sheets into the desired rotationally formed product through friction stir welding or other suitable processing processes. The rotationally formed weld metal sheet may be trimmed to remove portions of the weld metal sheet, including the weld seams, that have significantly different material properties as a result of the welding process.

The present application discloses a novel oxide crystal, a preparation method of the oxide crystal, a conductive paint containing the oxide crystal, and an object including a substrate and the conductive paint applied to the substrate. The present application can solve the problem that the content of glass powder is too small to provide proper pulling force and reduce the reliability and durability of solar cells. It can also solve the problem that too much glass powder will hinder the firing of the conductive paint, so that the electrodes cannot form proper ohmic contact. During the conductive paint firing process, lead-tellurium-bismuth-oxide crystals are heated to liquid form, acting alone or in combination with softened glass powder, to provide proper corrosion and penetrate the anti-reflection layer on the front side of the solar cell , so that a good ohmic contact is formed between the conductive metal and the substrate, so that the fired conductive paint forms a solar cell electrode with appropriate physical properties and excellent conductivity.

The invention relates to a first packaged and then etched packaging structure with multiple chips reversedly installed and base islands buried and a preparation method of the structure. The packaging structure comprises base islands (1), pins (2) and a plurality of chips (3), wherein the chips are reversedly installed on the front faces of the base islands and the front faces of the pins; underfills (14) are arranged among the bottoms of the chips, the fronts of the base islands and the pins; plastic package materials (4) are arranged in the peripheral regions of the base islands, the regions between the base islands and the pins, the regions between the pins, the regions on the upper parts of the base islands and the pins and the regions on the lower parts of the base islands and the pins and on the peripheries of the chips; small holes (5) are formed on the plastic package materials at the backs of the pins and are communicated with the backs of the pins; and metal balls (7) are arranged in the small holes and are contacted with the backs of the pins. The packaging structure and the preparation method have the following beneficial effects that the preparation cost is reduced; the safety and reliability of the packaging body are improved; environmental pollution is reduced; and design and preparation of high-density circuits are truly achieved.