Multi-chip reversely-arranged etched-encapsulated base island-exposed encapsulating structure and manufacturing method thereof

A technology of packaging structure and manufacturing method, which is applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc., can solve problems such as great differences in material characteristics, stress deformation, and reliability levels that affect reliability and safety capabilities. Achieve the effects of not being easy to stress and deform, reducing environmental pollution, and improving safety
CN102867802AActive Publication Date: 2013-01-09JCET GROUP CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
JCET GROUP CO LTD
Publication Date
2013-01-09

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Abstract

The invention relates to a multi-chip reversely-arranged etched-encapsulated base island-exposed encapsulating structure and a manufacturing method thereof. The structure comprises a base island (1), a pin (2) and a plurality of chips (3), wherein the chips (3) are reversely arranged on the front faces of the base island (1) and the pin (2); bottom filling adhesives (14) are arranged between the bottoms of the chips (3) and the front faces of the base island (1) and the pin (2); plastic sealing materials (4) are enveloped in a region on the periphery of the base island (1), a region between the base island (1) and the pin (2) and a region between adjacent pins (2) and outside the chips (3); the surfaces of the plastic sealing materials (4) on the lower parts of the base island (1) and the pin (2) are provided with small holes (5); and metal balls (7) are arranged in the small holes (5). The multi-chip reversely-arranged etched-encapsulated base island exposing encapsulating structure has the beneficial effects that the manufacturing cost is lowered, the safety and the reliability of an encapsulating body are enhanced, environmental pollution is lowered, and design and manufacturing of a high-density circuit are realized truly.
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Description

[0001] technical field

[0002] The invention relates to a multi-chip flip chip packaging structure exposed by etching first and then packaging base islands and a manufacturing method thereof, belonging to the technical field of semiconductor packaging. Background technique

[0003] The manufacturing process flow of the traditional high-density substrate package structure is as follows:

[0004] Step 1, see Figure 28 , take a substrate made of glass fiber material,

[0005] Step two, see Figure 29 , opening holes at desired locations on the fiberglass substrate,

[0006] Step three, see Figure 30 , coated with a layer of copper foil on the back of the glass fiber substrate,

[0007] Step 4, see Figure 31 , fill the conductive material in the position where the glass fiber substrate is punched,

[0008] Step five, see Figure 32 , coated with a layer of copper foil on the front of the glass fiber substrate,

[0009] Step six, see Figure 33 , coated with a photor...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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