61results about How to "Not prone to stress deformation" patented technology

The invention relates to a multi-chip flip, packaging-after-etching and non-pad packaging structure and a manufacturing method thereof. The structure comprises pins (1) and a plurality of chips (2). The plurality of the chips (2) are arranged on the right sides of the pins (1) in an inverted mode; bottom filling glue (13) is arranged between the bottoms of the chips (2) and the right sides of the pins (1); molding compounds (3) are packaged in areas on the peripheries of the pins (1), among the pins (1), on the upper portions and the lower portions of the pins (1) and outside the chips (2); holes (4) are opened on the surfaces of the molding compounds (3) on the lower portions of the pins (1), and communicated with the reverse sides of the pins (1); and metal balls (6) are arranged in the holes (4) and contacted with the reverse sides of the pins (1). The multi-chip flip, packaging-after-etching and non-pad packaging structure and the manufacturing method thereof have the advantages of reducing manufacturing costs, improving safety and reliability of packaging bodies, and being capable of designing and manufacturing high-density lines.

The invention relates to a first etched and then packaged packaging structure with a single chip reversedly installed and base islands buried as well as a preparation method thereof. The packaging structure comprises base islands (1), pins (2) and a chip (3), wherein the chip is reversedly installed on the fronts of the base islands and the fronts of the pins; underfills (14) are arranged between the bottom of the chip and the fronts of the base islands and the pins; plastic package materials (4) are arranged in the peripheral regions of the base islands, the regions between the base islands and the pins, the regions between the pins, the regions on the upper parts of the base islands and the pins and the regions on the lower parts of the base islands and the pins and on the periphery of the chip; small holes (5) are arranged on the plastic package materials on the backs of the pins and are communicated with the backs of the pins; and metal balls (7) are arranged in the small holes and are contacted with the backs of the pins. The packaging structure and the preparation method have the following beneficial effects that the preparation cost is reduced; the safety and reliability of the packaging body are improved; environmental pollution is reduced; and design and preparation of high-density circuits are truly achieved.

The invention relates to a single-chip horizontal packaging, packaging-after-etching and pad-embedded packaging structure and a manufacturing method thereof. The structure comprises pads (1) and pins (2). A chip (4) is arranged on the right sides of the pads (1), and the right side of the chip (4) and the right sides of the pins (2) are connected through metal wires (5). Molding compounds (6) are packaged on the peripheries of the pads (1) and the pins (2) and outside the chip (4) and the metal wires (5). Holes (7) are opened on surfaces of the molding compounds (6) on the lower portions of the pins (2) and communicated with the reverse sides of the pins (2). Metal balls (9) are arranged in the holes (7) and contacted with the reverse sides of the pins (2). The single-chip horizontal packaging, packaging-after-etching and pad-embedded packaging structure and the manufacturing method thereof have the advantages of reducing manufacturing costs, improving safety and reliability of packaging bodies, reducing environmental pollution, and being capable of designing and manufacturing high-density lines.

The invention relates to a single-chip flip, etching-after-packaging and pad embedded packaging structure and a manufacturing method thereof. The structure comprises pads (1), pins (2) and a chip (3). The chip is arranged on the right sides of the pads and the pins in an inverted mode; bottom filling glue (14) is arranged between the bottom of the chip and the right sides of the pads and the pins; molding compounds (4) are packaged in areas on the peripheries of the pads, between the pads and the pins, among the pins, on the upper portions of the pads and the pins, on the lower portions of the pads and the pins and on the periphery of the chip; holes (5) are opened on the molding compounds on the reverse sides of the pins, and communicated with the reverse sides of the pins; and metal balls (7) are arranged in the holes and contacted with the reverse sides of the pins. The single-chip flip, etching-after-packaging and pad embedded packaging structure and the manufacturing method thereof have the advantages of reducing manufacturing costs, improving safety and reliability of packaging bodies, reducing environmental pollution, and being capable of designing and manufacturing high-density lines.

The invention relates to a packaging-first and etching-later manufacturing method for a chip formal double-surface three-dimensional circuit and a packaging structure of the chip formal double-surface three-dimensional circuit. The method comprises the following technology steps of taking a metal substrate; pre-plating copper on the surface of the metal substrate; coating the surface of the metal substrate with green paint; removing a part of the green paint from the front surface of the metal substrate; electro-plating an inert metal circuit layer; electro-plating a metal circuit layer; coating the front surface of the metal substrate with the green paint; removing a part of the green paint from the front surface of the metal substrate; electro-plating the metal circuit layer; coating the front surface of the metal substrate with the green paint; removing a part of the green paint from the front surface of the metal substrate; coating a circuit screen board; pre-processing of metallization; removing the circuit screen board; electro-plating the metal circuit layer; coating bonding materials; installing a chip; bonding with metal wires; packaging; removing a part of the green paint from the back surface of the metal substrate; chemical-etching; electro-plating the metal circuit layer; electro-plating the metal circuit layer; coating the back surface of the metal substrate with the green paint; tapping on surface of the green paint; cleaning; implanting a metal ball; and cutting a finished product. The method disclosed by the invention has the beneficial effects that the manufacturing cost is lowered, the safety and the reliability of a packaging body are increased, the environment pollution is reduced, and the design and the manufacturing of a high-density circuit can be really realized.

The invention relates to a multi-chip positive packaging structure for embedding a basic island by first packaging and second etching, and a manufacturing method for the multi-chip positive packaging structure. The multi-chip positive packaging structure comprises the basic island (1) and pins (2), wherein chips (4) are arranged on the front face of the basic island (1); the front faces of the chips (4) are connected with the front faces of the pins (2) through metal wires (5); plastic materials (6) wrap the surrounding regions of the basic island (1) and the pins (2) as well as the chips (4) and the metal wires (5); small holes (7) are formed in the surfaces of the plastic materials (6) on the lower parts of the pins (2) and are communicated with the back faces of the pins (2); and metal balls (9) are arranged in the small holes (7) and are in contact with the back faces of the pins (2). The multi-chip positive packaging structure has the advantages that the manufacturing cost is reduced, the safety and the reliability of a package body are improved, the environment pollution is reduced, and design and manufacturing of a high-density line can be really realized.

The invention relates to a first etched and then packaged packaging structure with multiple chips normally installed and base islands buried as well as a preparation method thereof. The structure comprises base islands (1) and pins (2), wherein chips (4) are arranged on the fronts of the base islands (1); the fronts of the chips (4) and the fronts of the pins (2) are connected by metal wires (5); plastic package materials (6) are arranged in the surrounding regions of the base islands (1) and the pins (2) and outside the chips (4) and the metal wires (5); small holes (7) are arranged on the surfaces of the plastic package materials (6) on the lower parts of the pins (2); the small holes (7) are communicated with the backs of the pins (2); metal balls (9) are arranged in the small holes (7); and the metal balls (9) are contacted with the backs of the pins (2). The packaging structure and the preparation method have the following beneficial effects that the preparation cost is reduced; the safety and reliability of the packaging body are improved; environmental pollution is reduced; and design and preparation of high-density circuits are truly achieved.

The invention relates to a first packaged and then etched packaging structure with multiple chips reversedly installed and base islands buried and a preparation method of the structure. The packaging structure comprises base islands (1), pins (2) and a plurality of chips (3), wherein the chips are reversedly installed on the front faces of the base islands and the front faces of the pins; underfills (14) are arranged among the bottoms of the chips, the fronts of the base islands and the pins; plastic package materials (4) are arranged in the peripheral regions of the base islands, the regions between the base islands and the pins, the regions between the pins, the regions on the upper parts of the base islands and the pins and the regions on the lower parts of the base islands and the pins and on the peripheries of the chips; small holes (5) are formed on the plastic package materials at the backs of the pins and are communicated with the backs of the pins; and metal balls (7) are arranged in the small holes and are contacted with the backs of the pins. The packaging structure and the preparation method have the following beneficial effects that the preparation cost is reduced; the safety and reliability of the packaging body are improved; environmental pollution is reduced; and design and preparation of high-density circuits are truly achieved.