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61results about How to "Not prone to stress deformation" patented technology
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Etching-first and packaging-later manufacturing method for chip formal double-surface three-dimensional circuit and packaging structure of chip formal double-surface three-dimensional circuit
ActiveCN102723282ALow costImprove securitySemiconductor/solid-state device detailsSolid-state devicesEtchingMetal substrate
The invention relates to an etching-first and packaging-later manufacturing method for a chip formal double-surface three-dimensional circuit and a packaging structure of the chip formal double-surface three-dimensional circuit. The method comprises the following steps of taking a metal substrate; pre-plating copper on the surface of the metal substrate; coating the surface of the metal substrate with green paint; removing a part of the green paint from the back surface of the metal substrate; electro-plating an inert metal circuit layer; electro-plating a metal circuit layer; coating the back surface of the metal substrate with the green paint; removing a part of the green paint from the back surface of the metal substrate; electro-plating the metal circuit layer; coating the back surface of the metal substrate with the green paint; removing a part of the green paint from the back surface of the metal substrate; coating a circuit screen board; pre-processing of metallization; removing the circuit screen board; electro-plating the metal circuit layer; coating the back surface of the metal substrate with the green paint; removing a part of the green paint from the front surface of the metal substrate; chemical-etching; electro-plating the metal circuit layer; coating bonding materials; installing a chip; bonding with metal wires; packaging; tapping at the back surface of the metal substrate; cleaning; implanting a metal ball; and cutting a finished product. The method disclosed by the invention has the beneficial effects that the manufacturing cost is lowered, the safety and the reliability of a packaging body are increased, the environment pollution is reduced, and the design and the manufacturing of a high-density circuit can be really realized.
Owner:JCET GROUP CO LTD
Padding supporting method for enhancing thin-walled workpiece machined rigidity
ActiveCN104259883AEasy to makeLow costPositioning apparatusMetal-working holdersAviationMachining deformation
Disclosed is a padding supporting method for enhancing thin-walled workpiece machined rigidity. Engine oil and flour are mixed according to a specific ratio and then padded into a cavity of a thin-walled workpiece, the whole rigidity of the thin-walled workpiece is improved, natural vibration frequency of the workpiece is changed, flutter is reduced, cut machined deformation of the thin-walled workpiece is reduced, the problem that workpiece surface qualities are affected due to poor rigidity and flutter can be solved, and machining accuracy and surface qualities of the thin-walled workpiece can be guaranteed. By means of the successful development of the padding supporting method, the difficulty of machining of the thin-walled workpiece during model development can be technologically solved, the machining scheme of the thin-walled workpiece and mixing ratio parameter of engine oil and flour can provide high reference value and certain guiding significance for high-efficiency precise machining of numerous thin-walled irregular workpieces which are high in accuracy requirements, complicated in structures and especially not easy to clamp in national defence industry fields of aviation, aerospace, weaponry and the like, and the padding supporting method for enhancing the thin-walled workpiece machined rigidity can be used for guiding actual production.
Owner:BEIJING SATELLITE MFG FACTORY
Stator of rotary motor
InactiveCN103683561ANot prone to stress deformationEasy to controlWindingsMagnetic circuit stationary partsElectric machinePhysics
The invention discloses a stator of a rotary motor, which comprises stator yokes, stator teeth, coils and insulators, wherein the stator teeth are provided with raised parts, and the stator yokes are provided with groove parts; the stator teeth and the groove parts of the stator yokes are arranged in the circumferential direction of the rotary motor in sequence through the raised parts; the raised parts of the stator teeth are positioned in the groove parts of the stator yokes; the coils twine on the stator teeth through the insulators. According to the stator structure, the stator teeth and the stator yokes are not easy to generate stress deformation due to the connection of the stator teeth and the stator yokes; the control of dimensional accuracy and positional accuracy is facilitated, so adverse influence cannot be generated on the performance of the rotary motor; in addition, the material utilization rate is high, the manufacture is easy, the production efficiency is high, and the manufacture of the stator of the rotary motor of a traction machine for an elevator is particularly facilitated.
Owner:SHANGHAI MITSUBISHI ELEVATOR CO LTD
Normal chip single-faced three-dimensional circuit manufacture method by encapsulation prior to etching and normal chip single-faced three-dimensional circuit encapsulation structure
ActiveCN102723289ALow costImprove securitySemiconductor/solid-state device detailsSolid-state devicesEtchingHigh density
The invention relates to a normal chip single-faced three-dimensional circuit manufacture method by encapsulation prior to etching. The method includes: taking a metal substrate; preplating copper to the metal substrate surface; coating with green paint; partially removing the green paint on the front of the metal substrate; electroplating inert a metal circuit layer; electroplating a metal circuit layer; coating with green paint; partially removing the green paint on the front of the metal substrate; electroplating a metal circuit layer; coating with green paint; partially removing the green paint on the front of the metal substrate; coating a circuit screen plate; performing metallization pretreatment; removing the circuit screen plate; electroplating metal circuit layer; coating bonding material; mounting a chip; performing metal circuit bonding; encapsulating; partially removing the green paint on the back of the metal substrate; performing chemical etching; electroplating a metal circuit layer; coating with green paint; reserving holes on the green paint; cleaning; attaching balls; and cutting finished products. The normal chip single-faced three-dimensional circuit manufacture method by encapsulation prior to etching has the advantages that manufacture cost is lowered, safety and reliability of encapsulation are enhanced, environmental pollution is reduced, and design and manufacture of high density circuit are really achieved.
Owner:JCET GROUP CO LTD
First packaged and then etched packaging structure with single chip normally installed and base islands buried and preparation method of structure
ActiveCN102856283ALow costImprove securitySemiconductor/solid-state device detailsSolid-state devicesSmall holeElectrical and Electronics engineering
The invention relates to a first packaged and then etched packaging structure with a single chip normally installed and base islands buried and a preparation method of the structure. The structure comprises base islands (1) and pins (2), wherein a chip (4) is arranged on the fronts of the base islands (1); the front face of the chip (4) and the front faces of the pins (2) are connected by metal wires (5); plastic package materials (6) are arranged in the surrounding regions of the base islands (1) and the pins (2) and outside the chip (4) and the metal wires (5); small holes (7) are formed on the surfaces of the plastic package materials (6) on the lower parts of the pins (2); the small holes (7) are communicated with the backs of the pins (2); metal balls (9) are arranged in the small holes (7); and the metal balls (9) are contacted with the backs of the pins (2). The packaging structure and the preparation method have the following beneficial effects that the preparation cost is reduced; the safety and reliability of the packaging body are improved; environmental pollution is reduced; and design and preparation of high-density circuits are truly achieved.
Owner:JCET GROUP CO LTD
Packaging-first and etching-later manufacturing method for chip formal double-surface three-dimensional circuit and packaging structure of chip formal double-surface three-dimensional circuit
ActiveCN102723287ALow costImprove securitySemiconductor/solid-state device detailsSolid-state devicesHigh densityEtching
The invention relates to a packaging-first and etching-later manufacturing method for a chip formal double-surface three-dimensional circuit. The method comprises the following technology steps of taking a metal substrate; pre-plating copper material on the surface of the metal substrate; carrying out the operation of pasting a photo-resisting film; removing a part of the photo-resisting film from the front surface of the metal substrate; electro-plating an inert metal circuit layer; electro-plating a metal circuit layer; packaging; carrying out the operation of pasting the photo-resisting film; tapping on the surface of plastic package material; electro-plating the metal circuit layer; coating bonding materials; installing a chip; bonding with metal wires; packaging; carrying out the operation of pasting the photo-resisting film; chemical-etching; electro-plating the metal circuit layer; packaging; tapping on the surface of plastic package material; digging a groove on the surface of the plastic package material; electro-plating the metal circuit layer; coating a circuit screen plate; pre-processing of metallization; removing the metal screen plate; electro-plating the metal circuit layer; packaging; tapping on the surface of plastic package material; cleaning; implanting a metal ball; and cutting a finished product. The method disclosed by the invention has the beneficial effects that the manufacturing cost is lowered, the safety and the reliability of a packaging body are increased, the environment pollution is reduced, and the design and the manufacturing of a high-density circuit can be really realized.
Owner:JCET GROUP CO LTD
First etched and then packaged packaging structure with single chip reversedly installed and base islands buried as well as preparation method thereof
ActiveCN102856290ALow costImprove securitySemiconductor/solid-state device detailsSolid-state devicesHigh densitySingle chip
The invention relates to a first etched and then packaged packaging structure with a single chip reversedly installed and base islands buried as well as a preparation method thereof. The packaging structure comprises base islands (1), pins (2) and a chip (3), wherein the chip is reversedly installed on the fronts of the base islands and the fronts of the pins; underfills (14) are arranged between the bottom of the chip and the fronts of the base islands and the pins; plastic package materials (4) are arranged in the peripheral regions of the base islands, the regions between the base islands and the pins, the regions between the pins, the regions on the upper parts of the base islands and the pins and the regions on the lower parts of the base islands and the pins and on the periphery of the chip; small holes (5) are arranged on the plastic package materials on the backs of the pins and are communicated with the backs of the pins; and metal balls (7) are arranged in the small holes and are contacted with the backs of the pins. The packaging structure and the preparation method have the following beneficial effects that the preparation cost is reduced; the safety and reliability of the packaging body are improved; environmental pollution is reduced; and design and preparation of high-density circuits are truly achieved.
Owner:JCET GROUP CO LTD
Multi-chip horizontal packaging, etching-after-packaging and pad exposed packaging structure and manufacturing method thereof
ActiveCN102856287ALow costImprove securitySemiconductor/solid-state device detailsSolid-state devicesHigh densityBiomedical engineering
The invention relates to a multi-chip horizontal packaging, etching-after-packaging and pad exposed packaging structure and a manufacturing method thereof. The structure comprises pads (1) and pins (2). A plurality of chips (4) are arranged on the right sides of the pads (1), and the right sides of the chips (4) and the pins (2) are connected through metal wires (5). Molding compounds (6) are packaged on the peripheries of the pads (1) and the pins (2) and outside the chips (4) and the metal wires (5). Holes (7) are opened on the surfaces of the molding compounds (6) on the lower portions of the pads (1) and the pins (2). Metal balls (9) are arranged in the holes (7) and contacted with the reverse sides of the pads (1) or the pins (2). The multi-chip horizontal packaging, etching-after-packaging and pad exposed packaging structure and the manufacturing method thereof have the advantages of reducing manufacturing costs, improving safety and reliability of packaging bodies, reducing environmental pollution, and being capable of designing and manufacturing high-density lines.
Owner:星科金朋半导体(江阴)有限公司
X-ray tube housing, X-ray bulb tube and CT device
ActiveCN109727836AImprove structural strengthStable structureX-ray tube vessels/containerComputerised tomographsOperating temperaturePhysics
The invention relates to a ray tube housing, an X-ray bulb tube and a CT device. The X-ray tube housing includes: a housing body, wherein the housing body is a hollow cylinder, and the material of thehousing body comprises stainless steel; a window formed on the side wall of the housing body, wherein a copper window is disposed at the window and is provided with an outlet for emitting out the rays emitted by the X-ray tube; and a titanium plate disposed at the outlet. The X-ray tube housing, the X-ray bulb tube and the CT device uses the stainless steel housing body, the window is formed on the housing body, the copper window is arranged at the window, and the outlet formed by the titanium plate is disposed on the copper window. The stainless steel has high structural strength and is notprone to stress deformation. The titanium is high in penetrability and high in strength. The copper is high in thermal conductivity. Thus, the operating temperature of the X-ray bulb tube can be greatly reduced without affecting the emission rate of the X-ray bulb tube, and the structural strength and the service life of the X-ray bulb tube are greatly enhanced.
Owner:SHANGHAI UNITED IMAGING HEALTHCARE
Multi-chip reversely-arranged etched-encapsulated base island-exposed encapsulating structure and manufacturing method thereof
ActiveCN102867802ALow costImprove securitySemiconductor/solid-state device detailsSolid-state devicesHigh densityAdhesive
The invention relates to a multi-chip reversely-arranged etched-encapsulated base island-exposed encapsulating structure and a manufacturing method thereof. The structure comprises a base island (1), a pin (2) and a plurality of chips (3), wherein the chips (3) are reversely arranged on the front faces of the base island (1) and the pin (2); bottom filling adhesives (14) are arranged between the bottoms of the chips (3) and the front faces of the base island (1) and the pin (2); plastic sealing materials (4) are enveloped in a region on the periphery of the base island (1), a region between the base island (1) and the pin (2) and a region between adjacent pins (2) and outside the chips (3); the surfaces of the plastic sealing materials (4) on the lower parts of the base island (1) and the pin (2) are provided with small holes (5); and metal balls (7) are arranged in the small holes (5). The multi-chip reversely-arranged etched-encapsulated base island exposing encapsulating structure has the beneficial effects that the manufacturing cost is lowered, the safety and the reliability of an encapsulating body are enhanced, environmental pollution is lowered, and design and manufacturing of a high-density circuit are realized truly.
Owner:JCET GROUP CO LTD
Multi-chip flip, etching-after-packaging and pad exposed packaging structure and manufacturing method thereof
ActiveCN102856284ALow costImprove securitySemiconductor/solid-state device detailsSolid-state devicesHigh densityBiomedical engineering
The invention relates to a multi-chip flip, etching-after-packaging and pad exposed packaging structure and a manufacturing method thereof. The structure comprises pads (1), pins (2) and a plurality of chips (3). The plurality of the chips (3) are arranged on the right sides of the pads (1) and the pins (2) in an inverted mode. Bottom filling glue (14) is arranged between the bottoms of the plurality of the chips (3) and the right sides of the pads (1) and the pins (2). Molding compounds (4) are packaged in areas on the peripheries of the pads (1), between the pads (1) and the pins (2), among the pins (2) and outside the plurality of the chips (3). Holes (5) are opened on the surfaces of the molding compounds (4) on the lower portions of pads (1) and the pins (2), and metal balls (7) are arranged in the holes (5). The multi-chip flip, etching-after-packaging and pad exposed packaging structure and the manufacturing method thereof have the advantages of reducing manufacturing costs, improving safety and reliability of packaging bodies, reducing environmental pollution, and being capable of designing and manufacturing high-density lines.
Owner:JCET GROUP CO LTD
Multi-chip reversely-arranged etched-encapsulated base island-buried encapsulating structure and manufacturing method thereof
ActiveCN102867791ALow costImprove securitySemiconductor/solid-state device detailsSolid-state devicesHigh densityAdhesive
The invention relates to a multi-chip reversely-arranged etched-encapsulated base island-buried encapsulating structure and a manufacturing method thereof. The structure comprises a base island (1), a pin (2) and a plurality of chips (3), wherein the chips (3) are reversely arranged on the front faces of the base island and the pin; bottom filling adhesives (14) are arranged between the bottoms of the chips and the front faces of the base island and the pin; plastic sealing materials (4) are enveloped in a region on the periphery of the base island, a region between the base island and the pin, a region between adjacent pins, regions on the upper parts of the base island and the pin, regions on the lower parts of the base island and the pin and the peripheries of the chips; the plastic sealing materials on the back face of the pin are provided with small holes (5); and metal balls (7) are arranged in the small holes (5), and are contacted with the back face of the pins. The multi-chip reversely-arranged etched-encapsulated base island-buried encapsulating structure has the beneficial effects that the manufacturing cost is lowered, the safety and the reliability of an encapsulating body are enhanced, environmental pollution is lowered, and design and manufacturing of a high-density circuit are realized truly.
Owner:JCET GROUP CO LTD
Single-side three-dimensional circuit chip upside-down-charging packaging-before-etching method and packaging structure thereof
ActiveCN102760668ALow costImprove securitySemiconductor/solid-state device detailsSolid-state devicesPlastic packagingHigh density
The invention relates to a single-side three-dimensional circuit chip upside-down-charging packaging-before-etching method, which comprises the following process steps: taking a metal baseplate; pre-plating copper on the surface of the metal baseplate; pasting light resistant films; removing part of the light resistant films on the front surface of the metal baseplate; electroplating an inert metal circuit layer; electroplating a metal circuit layer; pasting light resistant films; removing part of the light resistant films on the front surface of the baseplate; electroplating a metal circuit layer; removing the light resistant films on the surface of the metal baseplate; encapsulating; processing before metallization; electroplating a metal circuit layer; removing the light resistant films on the surface of the metal baseplate; mounting a chip and filling the bottom of the chip; encapsulating; chemically etching; removing the light resistant films on the surface of the metal baseplate; electroplating a metal circuit layer; encapsulating; cutting holes in the surface of plastic packaging materials; washing; mounting balls; and cutting finished products. The method and the structure disclosed by the invention has the benefits that the manufacture cost is lowered, the safety and reliability of the packaged body are improved, and the environment pollution is reduced, so that design and manufacture of high-density circuits are realized actually.
Owner:JCET GROUP CO LTD
Packaging-first and etching-later manufacturing method for chip formal single-surface three-dimensional circuit and packaging structure of chip formal single-surface three-dimensional circuit
ActiveCN102723290ALow costImprove securitySemiconductor/solid-state device detailsSolid-state devicesHigh densityEtching
The invention relates to a packaging-first and etching-later manufacturing method for a chip formal single-surface three-dimensional circuit. The method comprises the following technology steps of taking a metal substrate; pre-plating copper material on the surface of the metal substrate; carrying out the operation of pasting a photo-resisting film; removing a part of the photo-resisting film from the front surface of the metal substrate; electro-plating an inert metal circuit layer; electro-plating a metal circuit layer; carrying out the operation of pasting a photo-resisting film; removing a part of the photo-resisting film from the front surface of the metal substrate; electro-plating the metal circuit layer; removing the photo-resisting film on the surface of the metal substrate; packaging; pre-processing of metallization; electro-plating the metal circuit layer; removing the photo-resisting film on the surface of the metal substrate; coating bonding materials; installing a chip; bonding with metal wires; packaging; carrying out the operation of pasting the photo-resisting film; removing a part of the photo-resisting film from the back surface of the metal substrate; chemical-etching; removing the photo-resisting film on the surface of the metal substrate; electro-plating the metal circuit layer; packaging; tapping on the surface of plastic package material; cleaning; implanting a metal ball; and cutting a finished product. The method disclosed by the invention has the beneficial effects that the manufacturing cost is lowered, the safety and the reliability of a packaging body are increased, the environment pollution is reduced, and the design and the manufacturing of a high-density circuit can be really realized.
Owner:JCET GROUP CO LTD
Lamp fixing device
ActiveCN112178595ASolve the inconvenience of disassemblyEasy to unscrewLighting support devicesElectric circuit arrangementsAxial displacementEngineering
The invention relates to the field of lighting devices, and provides a lamp mounting device. According to the lamp fixing device, ejecting objects located at different circumferential positions are arranged to abut against the same hard plate, so that when a user pushes a connecting base upwards, even though stress at the different positions of the connecting base is uneven, various protruding blocks can still keep the same axial displacement, the protruding blocks can be conveniently screwed out of mounting grooves at the same time, and the problem that a lamp is inconvenient to disassemble is solved.
Owner:PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
Single-chip flip, etching-after-packaging and pad exposed packaging structure and manufacturing method thereof
ActiveCN102856269ALow costImprove securitySemiconductor/solid-state device detailsSolid-state devicesBiomedical engineeringHigh density
The invention relates to a single-chip flip, etching-after-packaging and pad exposed packaging structure and a manufacturing method thereof. The structure comprises pads (1), pins (2) and a chip (3). The chip (3) is arranged on the right sides of the pads (1) and the pins (2) in an inverted mode. Bottom filling glue (14) is arranged between the bottom of the chip (3) and the right sides of the pads (1) and the pins (2). Molding compounds (4) are packaged in areas on the peripheries of the pads (1), between the pads (1) and the pins (2), among the pins (2) and outside the chip (3). Holes (5) are opened on the surfaces of the molding compounds (4) on lower portions of the pads (1) and the pins (2), and metal balls (7) are arranged in the holes (5). The single-chip flip, etching-after-packaging and pad exposed packaging structure and the manufacturing method thereof have the advantages of reducing manufacturing costs, improving safety and reliability of packaging bodies, reducing environmental pollution, and being capable of designing and manufacturing high-density lines.
Owner:JCET GROUP CO LTD
Multi-chip flip-chip etching first packaging structure without base island and its manufacturing method
ActiveCN102856271BLow costImprove securitySemiconductor/solid-state device detailsSolid-state devicesHigh densityBiochemical engineering
The invention relates to a multi-chip flip, packaging-after-etching and non-pad packaging structure and a manufacturing method thereof. The structure comprises pins (1) and a plurality of chips (2). The plurality of the chips (2) are arranged on the right sides of the pins (1) in an inverted mode; bottom filling glue (13) is arranged between the bottoms of the chips (2) and the right sides of the pins (1); molding compounds (3) are packaged in areas on the peripheries of the pins (1), among the pins (1), on the upper portions and the lower portions of the pins (1) and outside the chips (2); holes (4) are opened on the surfaces of the molding compounds (3) on the lower portions of the pins (1), and communicated with the reverse sides of the pins (1); and metal balls (6) are arranged in the holes (4) and contacted with the reverse sides of the pins (1). The multi-chip flip, packaging-after-etching and non-pad packaging structure and the manufacturing method thereof have the advantages of reducing manufacturing costs, improving safety and reliability of packaging bodies, and being capable of designing and manufacturing high-density lines.
Owner:JCET GROUP CO LTD
First etched and then packaged packaging structure with single chip reversedly installed and base islands buried as well as preparation method thereof
ActiveCN102856290BLow costImprove securitySemiconductor/solid-state device detailsSolid-state devicesHigh densitySingle chip
The invention relates to a first etched and then packaged packaging structure with a single chip reversedly installed and base islands buried as well as a preparation method thereof. The packaging structure comprises base islands (1), pins (2) and a chip (3), wherein the chip is reversedly installed on the fronts of the base islands and the fronts of the pins; underfills (14) are arranged between the bottom of the chip and the fronts of the base islands and the pins; plastic package materials (4) are arranged in the peripheral regions of the base islands, the regions between the base islands and the pins, the regions between the pins, the regions on the upper parts of the base islands and the pins and the regions on the lower parts of the base islands and the pins and on the periphery of the chip; small holes (5) are arranged on the plastic package materials on the backs of the pins and are communicated with the backs of the pins; and metal balls (7) are arranged in the small holes and are contacted with the backs of the pins. The packaging structure and the preparation method have the following beneficial effects that the preparation cost is reduced; the safety and reliability of the packaging body are improved; environmental pollution is reduced; and design and preparation of high-density circuits are truly achieved.
Owner:JCET GROUP CO LTD
Single-chip horizontal packaging, packaging-after-etching and pad-embedded packaging structure and manufacturing method thereof
ActiveCN102856294BLow costImprove securitySemiconductor/solid-state device detailsSolid-state devicesHigh densityEngineering
The invention relates to a single-chip horizontal packaging, packaging-after-etching and pad-embedded packaging structure and a manufacturing method thereof. The structure comprises pads (1) and pins (2). A chip (4) is arranged on the right sides of the pads (1), and the right side of the chip (4) and the right sides of the pins (2) are connected through metal wires (5). Molding compounds (6) are packaged on the peripheries of the pads (1) and the pins (2) and outside the chip (4) and the metal wires (5). Holes (7) are opened on surfaces of the molding compounds (6) on the lower portions of the pins (2) and communicated with the reverse sides of the pins (2). Metal balls (9) are arranged in the holes (7) and contacted with the reverse sides of the pins (2). The single-chip horizontal packaging, packaging-after-etching and pad-embedded packaging structure and the manufacturing method thereof have the advantages of reducing manufacturing costs, improving safety and reliability of packaging bodies, reducing environmental pollution, and being capable of designing and manufacturing high-density lines.
Owner:JCET GROUP CO LTD
Single-chip flip-chip first encapsulation and then etching base island embedded encapsulation structure and manufacturing method thereof
ActiveCN102856285BLow costImprove securitySemiconductor/solid-state device detailsSolid-state devicesSpin-flipHigh density
The invention relates to a single-chip flip, etching-after-packaging and pad embedded packaging structure and a manufacturing method thereof. The structure comprises pads (1), pins (2) and a chip (3). The chip is arranged on the right sides of the pads and the pins in an inverted mode; bottom filling glue (14) is arranged between the bottom of the chip and the right sides of the pads and the pins; molding compounds (4) are packaged in areas on the peripheries of the pads, between the pads and the pins, among the pins, on the upper portions of the pads and the pins, on the lower portions of the pads and the pins and on the periphery of the chip; holes (5) are opened on the molding compounds on the reverse sides of the pins, and communicated with the reverse sides of the pins; and metal balls (7) are arranged in the holes and contacted with the reverse sides of the pins. The single-chip flip, etching-after-packaging and pad embedded packaging structure and the manufacturing method thereof have the advantages of reducing manufacturing costs, improving safety and reliability of packaging bodies, reducing environmental pollution, and being capable of designing and manufacturing high-density lines.
Owner:JCET GROUP CO LTD
Packaging-first and etching-later manufacturing method for chip formal double-surface three-dimensional circuit and packaging structure of chip formal double-surface three-dimensional circuit
ActiveCN102723286BLow costImprove securitySemiconductor/solid-state device detailsSolid-state devicesHigh densityEtching
Owner:JCET GROUP CO LTD
Multi-chip positive packaging structure for embedding basic island by first packaging and second etching, and manufacturing method for multi-chip positive packaging structure
ActiveCN102881670ALow costImprove securitySemiconductor/solid-state device detailsSolid-state devicesEtchingHigh density
The invention relates to a multi-chip positive packaging structure for embedding a basic island by first packaging and second etching, and a manufacturing method for the multi-chip positive packaging structure. The multi-chip positive packaging structure comprises the basic island (1) and pins (2), wherein chips (4) are arranged on the front face of the basic island (1); the front faces of the chips (4) are connected with the front faces of the pins (2) through metal wires (5); plastic materials (6) wrap the surrounding regions of the basic island (1) and the pins (2) as well as the chips (4) and the metal wires (5); small holes (7) are formed in the surfaces of the plastic materials (6) on the lower parts of the pins (2) and are communicated with the back faces of the pins (2); and metal balls (9) are arranged in the small holes (7) and are in contact with the back faces of the pins (2). The multi-chip positive packaging structure has the advantages that the manufacturing cost is reduced, the safety and the reliability of a package body are improved, the environment pollution is reduced, and design and manufacturing of a high-density line can be really realized.
Owner:JCET GROUP CO LTD
Single-chip front-mount etch-before-package substrate-free packaging structure and manufacturing method thereof
ActiveCN102856293BLow costImprove securitySemiconductor/solid-state device detailsSolid-state devicesHigh densitySingle chip
The invention relates to a first etched and then packaged packaging structure with a single chip normally installed and base islands buried as well as a preparation method thereof. The structure comprises base islands (1) and pins (2), wherein a chip (4) is arranged on the fronts of the base islands (1); the front of the chip (4) and the fronts of the pins (2) are connected by metal wires (5); plastic package materials (6) are arranged in the surrounding regions of the base islands (1) and the pins (2) and outside the chip (4) and the metal wires (5); small holes (7) are arranged on the surfaces of the plastic package materials (6) on the lower parts of the pins (2); the small holes (7) are communicated with the backs of the pins (2); metal balls (9) are arranged in the small holes (7); and the metal balls (9) are contacted with the backs of the pins (2). The packaging structure and the preparation method have the following beneficial effects that the preparation cost is reduced; the safety and reliability of the packaging body are improved; environmental pollution is reduced; and design and preparation of high-density circuits are truly achieved.
Owner:JCET GROUP CO LTD
Multi-chip flip-chip packaging first, then etching base island to expose packaging structure and manufacturing method thereof
ActiveCN102856284BLow costImprove securitySemiconductor/solid-state device detailsSolid-state devicesHigh densityBiochemical engineering
The invention relates to a multi-chip flip, etching-after-packaging and pad exposed packaging structure and a manufacturing method thereof. The structure comprises pads (1), pins (2) and a plurality of chips (3). The plurality of the chips (3) are arranged on the right sides of the pads (1) and the pins (2) in an inverted mode. Bottom filling glue (14) is arranged between the bottoms of the plurality of the chips (3) and the right sides of the pads (1) and the pins (2). Molding compounds (4) are packaged in areas on the peripheries of the pads (1), between the pads (1) and the pins (2), among the pins (2) and outside the plurality of the chips (3). Holes (5) are opened on the surfaces of the molding compounds (4) on the lower portions of pads (1) and the pins (2), and metal balls (7) are arranged in the holes (5). The multi-chip flip, etching-after-packaging and pad exposed packaging structure and the manufacturing method thereof have the advantages of reducing manufacturing costs, improving safety and reliability of packaging bodies, reducing environmental pollution, and being capable of designing and manufacturing high-density lines.
Owner:JCET GROUP CO LTD
First packaged and then etched packaging structure with single chip normally installed and base islands buried and preparation method of structure
ActiveCN102856283BLow costImprove the level ofSemiconductor/solid-state device detailsSolid-state devicesHigh densityEngineering
The invention relates to a first packaged and then etched packaging structure with a single chip normally installed and base islands buried and a preparation method of the structure. The structure comprises base islands (1) and pins (2), wherein a chip (4) is arranged on the fronts of the base islands (1); the front face of the chip (4) and the front faces of the pins (2) are connected by metal wires (5); plastic package materials (6) are arranged in the surrounding regions of the base islands (1) and the pins (2) and outside the chip (4) and the metal wires (5); small holes (7) are formed on the surfaces of the plastic package materials (6) on the lower parts of the pins (2); the small holes (7) are communicated with the backs of the pins (2); metal balls (9) are arranged in the small holes (7); and the metal balls (9) are contacted with the backs of the pins (2). The packaging structure and the preparation method have the following beneficial effects that the preparation cost is reduced; the safety and reliability of the packaging body are improved; environmental pollution is reduced; and design and preparation of high-density circuits are truly achieved.
Owner:JCET GROUP CO LTD
Multi-chip positive packaging structure for embedding basic island by first packaging and second etching, and manufacturing method for multi-chip positive packaging structure
ActiveCN102881670BLow costImprove securitySemiconductor/solid-state device detailsSolid-state devicesEtchingHigh density
The invention relates to a multi-chip positive packaging structure for embedding a basic island by first packaging and second etching, and a manufacturing method for the multi-chip positive packaging structure. The multi-chip positive packaging structure comprises the basic island (1) and pins (2), wherein chips (4) are arranged on the front face of the basic island (1); the front faces of the chips (4) are connected with the front faces of the pins (2) through metal wires (5); plastic materials (6) wrap the surrounding regions of the basic island (1) and the pins (2) as well as the chips (4) and the metal wires (5); small holes (7) are formed in the surfaces of the plastic materials (6) on the lower parts of the pins (2) and are communicated with the back faces of the pins (2); and metal balls (9) are arranged in the small holes (7) and are in contact with the back faces of the pins (2). The multi-chip positive packaging structure has the advantages that the manufacturing cost is reduced, the safety and the reliability of a package body are improved, the environment pollution is reduced, and design and manufacturing of a high-density line can be really realized.
Owner:JCET GROUP CO LTD
Multi-chip front-mount packaging structure with etching first and packaging without base island and its manufacturing method
ActiveCN102856291BLow costImprove securitySemiconductor/solid-state device detailsSolid-state devicesHigh densityEngineering
The invention relates to a first etched and then packaged packaging structure with multiple chips normally installed and base islands buried as well as a preparation method thereof. The structure comprises base islands (1) and pins (2), wherein chips (4) are arranged on the fronts of the base islands (1); the fronts of the chips (4) and the fronts of the pins (2) are connected by metal wires (5); plastic package materials (6) are arranged in the surrounding regions of the base islands (1) and the pins (2) and outside the chips (4) and the metal wires (5); small holes (7) are arranged on the surfaces of the plastic package materials (6) on the lower parts of the pins (2); the small holes (7) are communicated with the backs of the pins (2); metal balls (9) are arranged in the small holes (7); and the metal balls (9) are contacted with the backs of the pins (2). The packaging structure and the preparation method have the following beneficial effects that the preparation cost is reduced; the safety and reliability of the packaging body are improved; environmental pollution is reduced; and design and preparation of high-density circuits are truly achieved.
Owner:JCET GROUP CO LTD
First etched and then packaged packaging structure with single chip reversedly installed and base islands exposed and preparation method of structure
ActiveCN102856289ALow costImprove securitySemiconductor/solid-state device detailsSolid-state devicesHigh densityEngineering
The invention relates to a first etched and then packaged packaging structure with a single chip reversedly installed and base islands exposed and a preparation method of the structure. The structure comprises base islands (1), pins (2) and a chip (3), wherein the chip (3) is reversedly installed on the front faces of the base islands (1) and the pins (2); underfills (14) are arranged among the bottom of the chip (3), the fronts of the base islands (1) and the pins (2); plastic package materials (4) are arranged in the peripheral regions of the base islands (1), the regions between the base islands (1) and the pins (2) and the regions between the pins (2) and outside the chip (3); small holes (5) are formed on the surfaces of the plastic package materials (4) on the lower parts of the base islands (1) and the pins (2); and metal balls (7) are arranged in the small holes (5). The packaging structure and the preparation method have the following beneficial effects that the preparation cost is reduced; the safety and reliability of the packaging body are improved; environmental pollution is reduced; and design and preparation of high-density circuits are truly achieved.
Owner:JCET GROUP CO LTD
First packaged and then etched packaging structure with multiple chips reversedly installed and base islands buried and preparation method of structure
ActiveCN102856267BLow costImprove securitySemiconductor/solid-state device detailsSolid-state devicesHigh densityEngineering
Owner:江阴芯智联电子科技有限公司
Manufacture method of flip chip single-faced three-dimensional circuit manufactured by encapsulation prior to etching and flip chip single-faced three-dimensional circuit encapsulation structure
ActiveCN102723288BLow costImprove securitySemiconductor/solid-state device detailsSolid-state devicesEtchingHigh density
The invention relates to a flip chip single-faced three-dimensional circuit manufacture method by encapsulation prior to etching. The method includes: taking a metal substrate; preplating copper to the metal substrate surface; coating with green paint; partially removing the green paint on the front of the metal substrate; electroplating an inert metal circuit layer; electroplating a metal circuit layer; coating with green paint; partially removing the green paint on the front of the metal substrate; electroplating metal circuit layer; coating with green paint; partially removing the green paint on the front of the metal substrate; coating a circuit screen plate; performing metallization pretreatment; removing the circuit screen plate; electroplating a metal circuit layer; mounting a chip and filling the bottom of the chip; encapsulating; partially removing the green paint on the back of the metal substrate; performing chemical etching; electroplating a metal circuit layer; coating with green paint; reserving holes on the green paint; cleaning; attaching balls; and cutting finished products. The flip chip single-faced three-dimensional circuit manufacture method by encapsulation prior to etching has the advantages that manufacture cost is lowered, safety and reliability of encapsulation are enhanced, environmental pollution is reduced, and design and manufacture of high density circuit are really achieved.
Owner:JCET GROUP CO LTD
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