Vacuum processing device, method for moving substrate and alignment mask, alignment method, and film forming method

Abstract

Provided is a vacuum processing device capable of replacing an alignment mask without exposing the inside of a vacuum chamber to air. A plate (23), into which a substrate lifting and lowering pin (46) and a mask lifting and lowering pin (45) that is longer in a vertical direction than the substrate lifting and lowering pin (46) are inserted, is disposed below a gas introduction device (12). A pin supporting member (24) is disposed below the plate (23). The pin supporting member (24) is structured so that when the distance from the plate (23) is made to be close to a first distance or less, the substrate lifting and lowering pin (46) and the mask lifting and lowering pin (45) can be each vertically mounted on the pin supporting member (24). The substrate lifting and lowering pin (46) and the mask lifting and lowering pin (45) are each provided with a locking member (47). The locking member (47) is used for suspending the substrate lifting and lowering pin (46) and the mask lifting and lowering pin (45) by the plate (23), above the pin supporting member (24), apart from the pin supporting member (24), when the distance between the plate (23) and the pin supporting member (24) is set to a second distance or more having a wider separation than the first distance.

Description

technical field [0001] The invention relates to a vacuum processing device, a moving method of a substrate and an alignment mask, an alignment method, and a film forming method. Background technique [0002] Organic EL elements have high luminous efficiency and can be assembled into thin light-emitting devices, so they have attracted attention in recent years for use in large-area display devices and lighting equipment. [0003] In the manufacturing process of an organic EL element, a lower electrode, an organic light-emitting layer, and an upper electrode are formed on a substrate, and then a protective film of silicon nitride or silicon oxide is formed on the substrate. [0004] Since the organic light-emitting layer is easily damaged by heat, a plasma CVD (PE-CVD) method capable of forming a film at a lower temperature than the thermal CVD method is used as a method of forming the protective film. [0005] For example, it is necessary to form a protective film in a state...

AI Technical Summary

Problems solved by technology

Therefore, there is a problem that particle management in the vacuum tank is difficult to manage

In addition, the downtime of the equipment is longer and manual operation is required

[0007] Furthermore, since the alignment mask must be changed ac

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