Method for co-plating metallization of blind holes and through hole of printed circuit board

Abstract

The invention discloses a method for co-plating metallization of blind holes and a through hole of a printed circuit board and belongs to the technical field of printed circuit boards. The method includes: firstly, drilling the blind holes on a substrate of the printed circuit board by laser light so that the required blind holes are formed; secondly, using conductive adhesives to partially block the blind holes to form a blind hole half-filled conductive adhesive state, and curing the conductive adhesives; thirdly, mechanically drilling; and finally, co-plating copper for the through hole and the blind holes so that metallization is completed. According to the method, blind hole copper filling recesses can be eliminated, and the problems of overlarge blind hole copper filling recess values during co-plating of blind holes and a through hole of an HDI (high density interconnect) printed circuit board and detects of small aperture and the like caused by single copper filling of the blind holes are solved, so that productivity and production efficiency of the HDI printed circuit boards are improved, and production cost is reduced.

Description

technical field [0001] The invention belongs to the technical field of printed circuits, and relates to a metallization method for through holes and blind holes of a printed circuit board (PCB). Background technique [0002] The development of electronic products in the direction of light, thin, short and small has higher requirements for the reliability of printed circuit board high density interconnect (High Density Interconnect, HDI). The connection mainly relies on through holes and blind holes. The metallization process of the through hole is realized by copper plating, while the metallization of the blind hole is done by electroplating copper filling or directly blocking the conductive glue. When the through hole and the blind hole are co-plated, the metallization of the through hole is often completed, but the blind hole If the hole cannot be filled, a large sag value will be generated, which will affect the reliability of the printed circuit board if the sag value i...

AI Technical Summary

Problems solved by technology

[0005] The present invention aims to provide a method for co-plating metallization of through-holes and blind holes of printed circuit boards. The method co-plats through-holes and blind holes, which can eliminate copper filling depressions in blind holes and solve blind holes in HDI printed boards. When co-plating, blind hole copper filling depression value is too large and blind hole single copper filling will lead to defects such as small hole diameter, improve HDI printed circuit board production capacity and production efficiency, and reduce production costs

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