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Substrate delivery method

A feeding method and substrate technology, applied in the direction of conveyor objects, furnaces, lighting and heating equipment, etc., can solve the problems of low processing efficiency, danger, and low yield of flexible printed circuit boards, so as to improve work efficiency and avoid Direct contact, the effect of improving product yield

Active Publication Date: 2016-04-20
DONGGUAN WERY DOOD CIRCUIT BOARD EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] Aiming at the technical problems of low processing efficiency, high cost, low yield rate and dangerousness of flexible printed circuit boards in the prior art, the present invention provides a substrate delivery method with high processing efficiency, low cost, high yield rate and high safety factor is necessary

Method used

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Embodiment Construction

[0030] The present invention will be described in detail below in conjunction with the accompanying drawings.

[0031] see figure 1 , is a schematic perspective view of the first embodiment disclosed in the present invention, using the substrate transfer pick-and-place device to put the substrate into the processing line. The processing line 1 is used to transfer the substrate 10 to be processed by the corresponding station. At the same time, a substrate transport pick-and-place device 2 is provided on the side of the processing line 1 and adjacent to the processing line 1 . The substrate conveying pick-and-place device 2 is used to put the stacked substrates 10 into the processing line 1 for processing, and the stacked substrates 10 form a stack 30 and place them at a set position. In this embodiment, the substrate 10 may be a copper-clad substrate or a semi-finished product during processing of a printed circuit board.

[0032] see figure 2 ,yes figure 1 A schematic di...

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Abstract

The invention provides an arranging method for a base plate. The arranging method comprises the following steps: providing a first laying platform, a second laying platform and a base plate process line which are arranged in parallel at intervals; providing a superposed body in which the base plate and a gasket are spaced and superposed, and arranging the superposed body on the surface of the second laying platform; providing a first mechanical arm and a second mechanical arm which are arranged in parallel at intervals, wherein the first mechanical arm and the second mechanical arm synchronously and horizontally move; the first mechanical arm moves the gasket to the second laying platform from the second laying platform; and the second mechanical arm moves the base plate to the base plate process line from the second laying platform. The arranging method for the base plate provided by the invention has the effects of convenience, high efficiency and safety.

Description

technical field [0001] The invention relates to a method for putting a substrate into an assembly line by using a manipulator. Background technique [0002] With the rapid development of the electronic industry, the manufacturing technology of printed circuit boards, which are the basic components of electronic products, is becoming more and more important. Printed circuit boards are usually processed using copper clad substrates. For the processing technology of rigid printed circuit boards, printed circuit boards are generally made of copper-clad substrates through a series of processes such as cutting, drilling, etching, exposure, development, lamination, and molding. [0003] Generally, in the process of processing printed circuit boards, the process line needs to pass through the above-mentioned cutting station, drilling station, etching station, exposure station, development station, pressing station, forming station, etc., each The surface of the copper-clad substra...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B65G49/06B65G47/91
Inventor 冉彦祥管运刚罗春泉
Owner DONGGUAN WERY DOOD CIRCUIT BOARD EQUIP
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