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Improved component characteristics through optimized process management in laser sintering

A laser, selective technology, applied in the structural details of semiconductor lasers, chemical instruments and methods, processing and manufacturing, etc., can solve the problems of polymer molecular weight decomposition, device discoloration, etc.

Active Publication Date: 2013-01-23
EVONIK OPERATIONS GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Elevated temperature induced by power peaks can lead to molecular weight decomposition of polymers
Discoloration of the device may occur through thermal damage

Method used

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  • Improved component characteristics through optimized process management in laser sintering
  • Improved component characteristics through optimized process management in laser sintering

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0038] Example 1 (not according to the invention)

[0039] Synrad Firestar t100W used as laser (CO 2 , wavelength 10.6 μm). Use Synrad's UC-2000 to control the power of the laser. Synrad's DC-100 DC was used as the power supply. A scanner Scanlab powerSCAN50 with varioSCAN 60 is used. 5 kHz with a duty cycle of 20% is chosen as the pulse width modulation (PWM) clock frequency. The energy input of the laser is 60mJ / mm 2 (Laser power 21.2W, scan speed 1178mm / s, distance from exposure line 0.3mm). The viscosity of the solution according to ISO 307 was determined to be 1.52 for the device sample.

example 2

[0040] Example 2 (not according to the invention)

[0041] The ULR-50 from Universal Laser Systems Co., Ltd. is used as a laser (CO 2 , wavelength 10.6 μm). Use MCA Micro Controller Applications' Laser-Multi Controller LCT3001 to control the power of the laser. The power supply is a Synrad DC-5. A scanner Scanlab powerSCAN50 with varioSCAN 60 is used. The pulse width modulation (PWM) clock pulse frequency is 5kHz and the duty ratio is 40%. The energy input of the laser is 60mJ / mm 2 (The laser power is 20.6W, the scanning speed of the laser beam is 1144mm / s, and the distance from the exposure line is 0.3mm). The solution viscosity according to ISO 307 was determined to be 1.55 for the device sample.

example 3

[0042] Example 3 (not according to the invention)

[0043] The ULR-50 from Universal Laser Systems Co., Ltd. is used as a laser (CO 2 , wavelength 10.6 μm). The power of the laser is controlled by a laser multi-controller LCT3001 from MCA Micro Controller Applications. The power supply is a Synrad DC-5. A scanner Scanlab powerSCAN50 with varioSCAN 60 is used. The pulse width modulation (PWM) clock pulse frequency is 1kHz and the duty ratio is 40%. The energy input of the laser is 60mJ / mm 2 (Laser power 20.6W, scanning speed 1144mm / s, distance from exposure line 0.3mm). The viscosity of the solution according to ISO 307 was determined to be 1.52 for the device sample.

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PUM

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Abstract

The present invention relates to an apparatus for producing three-dimensional objects layer by layer, to a method for layerwise production and a corresponding molded body.

Description

technical field [0001] The invention relates to a device for the layer-by-layer production of three-dimensional objects, a method for the layer-by-layer production, and corresponding shaped bodies. Background technique [0002] Delivering prototypes smoothly is a frequently posed task these days. The method that enables this is known as Rapid Prototyping / Rapid Manufacturing or also as Additive Manufacturing method. Particularly suitable are processes based on pulverulent raw materials and processes in which the desired structure is produced layer by layer by selective melting and solidification. In this case, it is possible to dispense with a supporting structure for overhanging and undercutting, since the powder bed surrounding the fused region provides sufficient supporting effect. The additional work of removing the support is also canceled. These methods are also suitable for manufacturing small batches. The construction space temperature is chosen such that no defor...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C67/04H01S5/02C08J5/00C08J3/28
CPCB29C67/0077B32B27/16B29C35/08B29C64/153Y10T428/24479B33Y30/00B33Y10/00B33Y70/00B29C64/182
Inventor M.格雷贝S.蒙沙伊默W.迪克曼J.克吕茨
Owner EVONIK OPERATIONS GMBH