A method for detecting the accuracy of the mask plate light-shielding plate of a photolithography machine

Abstract

The invention belongs to the semiconductor manufacturing technical field and in particular relates to a method for detecting the accuracy of the mask plate hood of a photoetching machine. The method comprises the following steps of: S1, preparing a test mask plate, wherein an actual pattern region is formed on the test mask plate and the actual pattern region comprises an actual pattern which comprises a main pattern; S2, performing exposure on a silicon wafer by means of the test mask plate, wherein the hood shields redundant light in the exposure process and only exposes the actual pattern region needing to be exposed; and S3, measuring the actual size of the exposed pattern on the silicon wafer, and calculating the offset between the actual size and the predetermined size, thereby determining the accuracy of the mask plate hood. The method is characterized in that once the test mask plate is fabricated, the test mask plate is suitable for testing various different types of photoetching machines, and no measurement pattern needs to be fabricated on the silicon chip in advance; therefore, the proposal is more flexible and convenient and capable of improving the detection accuracy of the hood.

Description

technical field [0001] The invention belongs to the technical field of semiconductor manufacturing, in particular to a method for detecting the precision of a mask plate light-shielding plate of a photolithography machine, and its function is to improve the detection ability of the precision of the mask plate light-shielding plate of a photolithography machine. Background technique [0002] With the continuous improvement of integrated circuit manufacturing technology and the continuous shrinking of line width in lithography technology, the area of ​​semiconductor devices is becoming smaller and smaller. The layout of semiconductors has evolved from ordinary single-function separation devices to integrated high-density multi-functional Integrated circuit; from the initial IC (integrated circuit) to LSI (large-scale integrated circuit), VLSI (very large-scale integrated circuit), until today's ULSI (ultra-large-scale integrated circuit), the area of ​​the device is further red...

AI Technical Summary

Problems solved by technology

It can directly determine the positioning accuracy of the mask shading plate, but due to the limitations of the naked eye, it cannot accurately express the accuracy of the mask shading plate, and because the exposure silicon wafer needs to be prepared in advance and the specific size is defined, so it cannot be customized according to the customer. According to the actual needs, flexibly adjust the size of the measurement graph to determine whether the accuracy of the size of the graph of different products can meet the requirements

[0007] So, in other words, this method is imperfect

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