Thermo-plastic hot-melt-adhesive active disassembling structure and disassembling method

Abstract

The invention discloses a thermo-plastic hot-melt adhesive active disassembling structure. The thermo-plastic hot-melt adhesive active disassembling structure is characterized in that a thermo-plastic hot-melt adhesive layer with high melting point and high strength is used as a connecting unit between parts of a product; and a driving component which can be used for applying an acting force to a connecting component by a connected component at the temperature under which the thermo-plastic hot-melt adhesive layer is softened is arranged, so as to disable the connecting unit and actively separate the parts. By adopting the thermo-plastic hot-melt adhesive active disassembling structure, the active disassembling structure can be simplified, the designing and manufacturing costs of the active disassembling structure can be reduced, the disassembling efficiency can be improved, and active disassembling can be realized.

Description

technical field [0001] The invention relates to a thermoplastic hot-melt adhesive active disassembly structure and a disassembly method, especially as a connection structure between parts of electronic and electrical products. Background technique [0002] With the gradual popularization of circular economy and sustainable development concepts, domestic and foreign requirements for the recycling of electronic products after they are discarded at the end of life are becoming more and more stringent. At present, electronic products are mainly pretreated by manual disassembly or mechanical crushing. The former is very inefficient, and the latter will destroy reusable parts or components. In response to these problems, foreign experts have proposed the concept of active disassembly. This improves the disassembly performance of the product and improves the disassembly efficiency of the product at the end of the life cycle, which is of great significance to saving energy, protecti...

AI Technical Summary

Problems solved by technology

At present, electronic products are mainly pretreated by manual disassembly or mechanical crushing. The former is very inefficient, and the latter will destroy reusable parts or components. In response to these problems, foreign experts have proposed the concept of active disassembly. This improves the disassembly performance of the product and improves the disassembly efficiency of the product at the end of the life cycle, which is of great significance to energy saving, environmental protection and sustainable development.

[0003] The inventor of the present application has previously proposed the active disassembly structure and its excitation method for electrothermal excitation (ZL201010602800.2), which uses electrothermal excitation to activate the SMP buckle (SMP refers to the polymer material Shape Memory Polymer with shape memory properties) Or use electric heating to fuse the thermoplastic buckle, and activate the SMA driving part (SMA refers to Shape Memory Alloy) with electric heating to generate driving force to realize active disassembly; the inventor also proposed active disassembly based on ADSM technology, but its The manufacture of the studied active disassembly structure needs to go through two molding stages of the first molding and the second molding. The cost of molding is greatly increased, often the cost of the secondary molding stage accounts for 80% of the manufacturing cost of the entire active disassembly structure, the process is complex, and the manufacturing cost is high; the active disassembly structure is relatively complex, the design cost is high, the reliability is low, and the deformation recovery The speed is relatively slow, which seriously hinders its industrial application

[0004] Therefore, there is an urgent need for an active disassembly structure and its disassembly method with simple processing technology, low design and manufacturing costs, simple structure, and high disassembly efficiency, so as to reduce the design and manufacture cost of the active disassembly structure. There is no public report of the relevant technology so far.

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