Unlock instant, AI-driven research and patent intelligence for your innovation.

Adhesive tape for manufacturing semiconductor devices and method for manufacturing semiconductor devices by using adhesive tape

An adhesive tape and semiconductor technology, which is applied in the fields of semiconductor/solid-state device manufacturing, semiconductor devices, electric solid-state devices, etc., can solve the problems of difficult to find joint damage and processing, and achieve easy processing, reduce defect rate, and prevent leakage. Effect

Inactive Publication Date: 2013-02-06
TORAY ADVANCED MATERIALS KOREA
View PDF3 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

During the manufacturing process, it is difficult to find damage on the joint part, and it is also difficult to rework the damaged part

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Adhesive tape for manufacturing semiconductor devices and method for manufacturing semiconductor devices by using adhesive tape
  • Adhesive tape for manufacturing semiconductor devices and method for manufacturing semiconductor devices by using adhesive tape
  • Adhesive tape for manufacturing semiconductor devices and method for manufacturing semiconductor devices by using adhesive tape

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0065] Prepared solution A (curing agent): with respect to every 100 parts by weight of carboxylated rubber resin, to 1 part by weight of dicumyl peroxide, 4 parts by weight of cyanoguanidine and 0.01 parts by weight of 2-methylimidazole 5 parts by weight of ethyl acetate (EA) was added, and the resulting solution was stirred for 1 hour.

[0066] Prepared solution B (additive): For every 100 parts by weight of carboxylated rubber resin, 80 parts by weight of ethyl acetate was added to 70 parts by weight of silane-modified epoxy resin and 10 parts by weight of bisphenol A novolac ester (EA), and the resulting solution was stirred for 1 hour.

[0067] After completing the preparation of solutions A and B as described above, 100 parts by weight of a carboxylated rubber resin having a molecular weight of 90000 was mixed with 200 parts by weight of methyl ethyl ketone (MEK) and the resulting solution was stirred for 1 hour. Then, the prepared solution A (curing agent) was added to...

Embodiment 2

[0069] Similar to Example 1, Prepared Solution A and Prepared Solution B were prepared in advance. 100 parts by weight of a carboxylated rubber resin having a molecular weight of 450,000 was mixed with 200 parts by weight of methyl ethyl ketone (MEK), followed by stirring for 1 hour. Then, the prepared solution A (curing agent) was added and stirred for 1 hour, and thereafter, the prepared solution B was added and stirred for another 1 hour, thereby obtaining an adhesive composition for an adhesive tape for manufacturing a semiconductor device. The adhesive composition was coated on a polyimide film (SKC Kolon, LN100) with a thickness of 25 μm, then dried at 130° C. for 3 minutes, and then a PET peeling film (Korean Toray Advanced Technology Co., Ltd.) with a thickness of 38 μm was applied. Materials Co., Ltd., XD5BR) was laminated on the dried polyimide film and aged at 45° C. for 48 hours, thereby obtaining an adhesive tape having an adhesive layer with a thickness of 6 μm. ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
glass transition temperatureaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

The present invention provides an adhesive tape for manufacturing semiconductor devices and a method for manufacturing semiconductor devices by using the adhesive tape. The adhesive tape comprises a substrate and an adhesive layer coated on at least one surface of the substrate. The adhesive layer is formed by an adhesive composition. The adhesive composition contains, based on 100 parts by weight of a carboxyl group-containing rubber resin, about 0.01-10 parts by weight of a curing agent and about 60-100 parts by weight of additives. The adhesive tape maintains low adhesive strength at room temperature during lamination after the installation process as the high-temperature process, so that when lamination defects occurs, re-processing can be easily performed and the product yield is improved, and the tackiness on the surface of a lead frame is improved of the adhesive tape the pre-curing process after the laminate, thereby effectively preventing the leakage of resin in the sealing process and residues are not to be left on the adhering surface when removing the adhesive tape, and thus contributing to the processing and reducing the defect rate.

Description

[0001] Cross References to Related Applications [0002] This application claims priority from Korean Patent Application No. 10-2011-0077081 filed Aug. 2, 2011, which is hereby incorporated by reference for all purposes as if set forth herein in its entirety. technical field [0003] The present invention relates to an adhesive tape for manufacturing a semiconductor device and a method of manufacturing a semiconductor device using the adhesive tape. More particularly, the present invention relates to an adhesive tape which maintains a low temperature at room temperature during lamination after a mounting process which is a high-temperature semiconductor manufacturing process, and a method of manufacturing a semiconductor device using the same. Adhesive strength, thereby allowing easy rework and improved product yield in the event of lamination defects, and the adhesive tape improves adhesion to leadframe surfaces during the pre-cure process after lamination properties, thereb...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/02C09J113/00C09J163/00C09J161/06C09J11/06H01L21/58H01L21/56
CPCH01L2224/92247H01L2924/181H01L2224/32245H01L2224/48091H01L2224/48247H01L2224/73265Y02P20/141H01L2924/00014H01L2924/00H01L2924/00012H01L24/50H01L24/26C09J163/00H01L21/6836H01L21/67132
Inventor 朴允敏崔城焕沈昌勋文基祯金演秀
Owner TORAY ADVANCED MATERIALS KOREA
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com