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Special anti-radiant waterproof interface agent for insulation board

An inorganic thermal insulation board, waterproof technology, applied in the direction of adhesives, adhesive types, adhesive additives, etc., to achieve the effect of reducing thermal conductivity, long service life, and good firm performance

Inactive Publication Date: 2013-02-06
上海丰慧节能环保科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The invention provides a special interface agent for anti-radiation and waterproof inorganic insulation boards. The technical problem to be solved is to make the existing interface agent have waterproof performance and anti-radiation performance at the same time, and make the adhesion of inorganic insulation boards on the existing market stronger. Reduce its thermal conductivity, thereby increasing service life

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] Example 1 (expressed in parts by weight)

[0019] Configure 100 copies of special interface agent for anti-radiation waterproof inorganic insulation board:

[0020] Copolymer emulsion 47.9 parts

[0021] 10 parts of mica metal oxide

[0022] 20 parts water glass

[0023] 0.1 part of methyl cellulose ether thickener

[0024] 2 parts of sodium methyl silicate

[0025] 20 parts water

[0026] Mica metal oxide group: 2 parts of mica, TiO 2 5 parts, Fe 2 O 3 1 part, Al 2 O 3 1 part, CuO 1 part.

[0027] Crush 10 parts of the mica metal oxide component to obtain each component between 50 and 120 mesh, add the pulverized mica metal oxide component to 47.9 parts of the copolymer emulsion, stir at room temperature, and add 20 water glass Copies.

[0028] Using the invention to paste the inorganic thermal insulation board, the final thermal conductivity is 0.045W / (m.k).

Embodiment 2

[0029] Example 2 (in parts by weight)

[0030] Configure 100 copies of special interface agent for anti-radiation waterproof inorganic insulation board:

[0031] 25 parts of copolymer emulsion

[0032] 15 parts of mica metal oxide

[0033] 10 parts water glass

[0034] 0.3 parts of methyl cellulose ether thickener

[0035] 1 part of sodium methyl silicate

[0036] 48.7 parts water

[0037] Mica metal oxide group: 3 parts of mica, TiO 2 6 parts, Fe 2 O 3 2 parts, Al 2 O 3 2 parts, CuO 2 parts.

[0038] Crush 15 parts of the mica metal oxide component to 50-120 meshes, add the pulverized mica metal oxide component to 25 parts of the copolymer emulsion, stir at room temperature, and add water glass 10 Copies.

[0039] Using the invention to paste the inorganic thermal insulation board, the final thermal conductivity is 0.048W / (m.k).

Embodiment 3

[0040] Example 3 (in parts by weight)

[0041] Configure 200 copies of special interface agent for anti-radiation waterproof inorganic insulation board:

[0042] 80 parts of copolymer emulsion

[0043] 30 parts of mica metal oxide

[0044] 40 parts water glass

[0045] 0.6 parts of methyl cellulose ether thickener

[0046] 2 parts of sodium methyl silicate

[0047] 47.4 parts of water

[0048] Mica metal oxide group: 6 parts of mica, TiO 2 10 parts, Fe 2 O 3 4 parts, Al 2 O 3 It is 6 parts and CuO is 4 parts.

[0049] Crush the 30 parts of the mica metal oxide component to 50-120 meshes, add the pulverized mica metal oxide component to 80 parts of the copolymer emulsion, stir at room temperature, and add 40 water glass Copies.

[0050] Using the invention to paste the inorganic thermal insulation board, the final thermal conductivity is 0.043W / (m.k).

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PUM

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Abstract

The invention discloses a special anti-radiant waterproof interface agent for an insulation board, and is characterized by comprising 20%-50% of copolymer emulsion, 10%-15% of mica metal oxide group, 10%-20% of water glass, 20%-50% of water and 0.1%-0.3% of thickening agent, wherein the copolymer emulsion is a mixture of propionic acid and styrene-acrylic emulsion, and the mica metal oxide group consists of mica, TiO2, Fe2O3, Al2O3 and CuO. The mica metal oxide group, provided by the invention, has the advantages of good waterproofness, anti-radiation performance and adhesive property, and strong ageing resistance.

Description

Technical field [0001] The invention relates to a special interface agent for inorganic thermal insulation boards, belonging to the technical field of chemistry and building materials, in particular to a special interface agent for anti-radiation waterproof inorganic thermal insulation boards. Background technique [0002] The interface agent should have good adhesion, weather resistance and water retention. The existing technology has greatly improved the waterproof and anti-radiation performance of inorganic insulation boards. In order to make the inorganic insulation boards better bond with the external wall, the waterproof and anti-radiation performance of the interface agent has been improved, which has also been obtained in the field of architectural decoration. Attention. [0003] The common components of the existing waterproof interface agent are a mixture of copolymer solution, Portland cement and fine sand, and then water-proof components such as PVA and cellulose ether...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J125/14C09J11/04C09J11/06C09J9/00
Inventor 贾铭琳毕立新贾薏臻
Owner 上海丰慧节能环保科技有限公司