Special anti-radiant waterproof interface agent for insulation board
An inorganic thermal insulation board, waterproof technology, applied in the direction of adhesives, adhesive types, adhesive additives, etc., to achieve the effect of reducing thermal conductivity, long service life, and good firm performance
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Embodiment 1
[0018] Example 1 (expressed in parts by weight)
[0019] Configure 100 copies of special interface agent for anti-radiation waterproof inorganic insulation board:
[0020] Copolymer emulsion 47.9 parts
[0021] 10 parts of mica metal oxide
[0022] 20 parts water glass
[0023] 0.1 part of methyl cellulose ether thickener
[0024] 2 parts of sodium methyl silicate
[0025] 20 parts water
[0026] Mica metal oxide group: 2 parts of mica, TiO 2 5 parts, Fe 2 O 3 1 part, Al 2 O 3 1 part, CuO 1 part.
[0027] Crush 10 parts of the mica metal oxide component to obtain each component between 50 and 120 mesh, add the pulverized mica metal oxide component to 47.9 parts of the copolymer emulsion, stir at room temperature, and add 20 water glass Copies.
[0028] Using the invention to paste the inorganic thermal insulation board, the final thermal conductivity is 0.045W / (m.k).
Embodiment 2
[0029] Example 2 (in parts by weight)
[0030] Configure 100 copies of special interface agent for anti-radiation waterproof inorganic insulation board:
[0031] 25 parts of copolymer emulsion
[0032] 15 parts of mica metal oxide
[0033] 10 parts water glass
[0034] 0.3 parts of methyl cellulose ether thickener
[0035] 1 part of sodium methyl silicate
[0036] 48.7 parts water
[0037] Mica metal oxide group: 3 parts of mica, TiO 2 6 parts, Fe 2 O 3 2 parts, Al 2 O 3 2 parts, CuO 2 parts.
[0038] Crush 15 parts of the mica metal oxide component to 50-120 meshes, add the pulverized mica metal oxide component to 25 parts of the copolymer emulsion, stir at room temperature, and add water glass 10 Copies.
[0039] Using the invention to paste the inorganic thermal insulation board, the final thermal conductivity is 0.048W / (m.k).
Embodiment 3
[0040] Example 3 (in parts by weight)
[0041] Configure 200 copies of special interface agent for anti-radiation waterproof inorganic insulation board:
[0042] 80 parts of copolymer emulsion
[0043] 30 parts of mica metal oxide
[0044] 40 parts water glass
[0045] 0.6 parts of methyl cellulose ether thickener
[0046] 2 parts of sodium methyl silicate
[0047] 47.4 parts of water
[0048] Mica metal oxide group: 6 parts of mica, TiO 2 10 parts, Fe 2 O 3 4 parts, Al 2 O 3 It is 6 parts and CuO is 4 parts.
[0049] Crush the 30 parts of the mica metal oxide component to 50-120 meshes, add the pulverized mica metal oxide component to 80 parts of the copolymer emulsion, stir at room temperature, and add 40 water glass Copies.
[0050] Using the invention to paste the inorganic thermal insulation board, the final thermal conductivity is 0.043W / (m.k).
PUM
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