Material level detection method based on linear array temperature sensor

A temperature sensor and detection method technology, applied in the direction of liquid level indicator for physical variable measurement, etc., can solve the problems of inapplicability, inability to measure material level data, poor low temperature resistance of sensors, etc., and achieve low manufacturing cost and theoretical reliability , the effect of simple structure

Inactive Publication Date: 2013-02-13
SOUTHEAST UNIV
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0004] Under some extreme conditions, such as the extremely low temperature and low pressure environment in the north and south poles, the requirements for the low temperature resistance and low pressure environment of the sensor are very high. The accuracy in the barometric environment is poor and cannot be applied
There have been many incidents where the liquid level sensor failed under low temperature conditions and the level data could not be measured in a low pressure environment
[0005] There is currently a lack of proven methods for measuring level at extreme temperatures

Method used

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  • Material level detection method based on linear array temperature sensor
  • Material level detection method based on linear array temperature sensor
  • Material level detection method based on linear array temperature sensor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034]Embodiment 1: The data collection and processing terminal 5 adopts Samkoon Company with RS485 interface, Modbus communication protocol, and 3.5-inch touch-type man-machine interface. The human-machine interface can run programs written in C language to realize data communication and data processing functions; the temperature sensor line array 1 consists of a group (typically 10 per meter) of digital temperature sensors with single-bus data communication capabilities Composed of DS18b20 and a microprocessor (MCU) capable of communicating with single bus and capable of communicating with data acquisition and processing terminal 5 through Modbus protocol (such as Nuvoton's W79E824), its peripheral circuits (such as power supply circuit, etc.) and RS485 communication interface , The digital temperature sensor DS18b20 is evenly spaced, armored on the rod of a poor thermal conductor of appropriate length, and ensures good thermal contact with the measured medium.

[0035] Its ...

Embodiment 2

[0036] Embodiment 2: The temperature sensor line array 1 is composed of multiple (such as 24) digital temperature measuring elements DS18b20, which are evenly distributed in the vertical direction for armoring. The armored rods have good heat conduction in the horizontal direction where the temperature measuring elements are installed. The interval direction of the adjacent temperature measuring element is insulated, the armor is sealed inside and outside, and a microprocessor (MCU) is used to collect temperature signal data. Through the RS485 of the microprocessor (MCU), the upper intelligent controller (data acquisition and processing) terminal) to output the temperature digital signal sequence collected at each point, the circuit principle is as follows Figure 4 shown.

[0037] The upper intelligent controller (data acquisition and processing terminal) takes the 51-core MCU as the core, connects the armored level sensor through the RS485 interface, and obtains the temperat...

Embodiment 3

[0039] Example 3: When the temperature of the measured medium is lower (lower than -55°C) and the temperature of the measured medium is higher (greater than 125°C), the temperature measuring element uses platinum resistance. Multiple (such as 24) platinum resistors are evenly distributed in the vertical direction for armoring. The armored rod has good heat conduction in the horizontal direction where the temperature measuring element is installed, and the space between adjacent temperature measuring elements is insulated. seal. For every 8 temperature measuring platinum resistance thermometers, use one MSC1210 (51 core) microprocessor (MCU) with 8-channel 24bit Σ-ΔADC, and use a four-wire bridge to collect temperature signals. A total of 3 MSC1210 microprocessors are used ( MCU) (chip1, chip2 and chip3), bridge each other through the RS232 interface, each microprocessor (MCU) transmits data to the upper MCU, through the RS485 interface of the end microprocessor (MCU), the uppe...

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Abstract

The invention discloses a material level detection method based on a linear array temperature sensor. The square deviation of the temperature variation of various points of a linear array is calculated under the induction of external periodic temperature change of a container and through temperatures which are measured by the linear array temperature sensor, of a gas and a measured medium inside the container, and two points corresponding to a maximal square deviation difference of two adjacent points are found, so that a material level can be judged to be positioned between the two points. The material level detection method disclosed by the invention is suitable for measuring the interface of gas-liquid or gas-solid phases under the conditions of extreme temperature environment and uncertain environment pressure and has the advantages of low cost, high reliability and simple structure.

Description

technical field [0001] The invention belongs to the technical field of thermal engineering and chemical process detection instruments, and particularly relates to and aims at a material level measurement method under extreme temperature and special air pressure conditions. Background technique [0002] Level measurement generally refers to measuring the height of the liquid or object interface in a container (water tank, oil tank, storage tank). Measuring the height of the object interface is very important in industrial and agricultural production processes and scientific research. The level measurement technology belongs to the technical field of thermal and chemical detection instruments. [0003] There are many ways to detect the level in the container. According to the measurement principle, there are: capacitive level gauge, static pressure level gauge, radio frequency level gauge, magnetic to telescopic level gauge, 3D level scanner, float Type level gauge, ultrason...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01F23/22
Inventor 邱实张辉陈从颜
Owner SOUTHEAST UNIV
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