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Leadless packaged metal film pressure sensor and preparation method thereof

A technology of pressure sensor and metal thin film, which is applied in the field of thin film special sensors, can solve the problems of large volume of strain gauge pressure sensor, easy condensation of metal wire connection, and unreliability, so as to reduce unreliable factors, reduce external dimensions, and be reliable Applied effect

Active Publication Date: 2014-11-19
48TH RES INST OF CHINA ELECTRONICS TECH GROUP CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The strain gauge pressure sensor of this invention has a large volume, and the internal lead wires have been transferred many times, which has certain unreliability, and the metal wire connection is prone to condensation and frost, resulting in short circuit or other failures

Method used

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  • Leadless packaged metal film pressure sensor and preparation method thereof
  • Leadless packaged metal film pressure sensor and preparation method thereof

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] see figure 1 and figure 2 , the metal thin film pressure sensor 1 of the leadless package includes a metal thin film pressure sensor chip 2, a glass sealing cover 3, a conductive metal pin 4 and a conductive metal material 5; the metal thin film pressure sensor chip 2 includes a stainless steel cup 21, and the The stainless steel mirror ring 24 on the stainless steel cup 21; the area other than the stainless steel mirror ring 24 on the surface of the stainless steel cup 21 is provided with a multilayer film 22; the multilayer film 22 includes a lead pad 23; There is a through hole 31 corresponding to the lead pad 23; the glass sealing cover 3 is bonded to the stainless steel mirror ring 24 on the stainless steel cup 21; the through hole 31 is filled with conductive metal material 5, and the conductive metal pin 4 is inserted and filled with In the through hole 31 of the conductive metal material 5 , the metallization of the through hole 31 is realized through the cond...

Embodiment 2

[0027] A metal thin film pressure sensor process method without lead packaging according to the present invention comprises the following steps:

[0028] (1) Process the glass sealing cover, and form through holes corresponding to the lead pads on the glass sealing cover;

[0029] (2) Polishing, cleaning, and drying stainless steel cups and glass sealing covers;

[0030] (2) Set the stainless steel cup with the stainless steel mirror ring mask and place it on the planetary frame of the deposition coating system;

[0031] (3) Deposit multi-layer thin films on the surface of the stainless steel cup in turn to make a metal thin film pressure sensor chip;

[0032] (4) Install the metal thin film pressure sensor chip and the glass sealing cover according to the through hole and the lead pad, and pressurize and bond the ring area where the glass sealing cover contacts the stainless steel mirror ring;

[0033] (6) Inject a conductive metal material into the through hole of the glas...

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Abstract

The invention discloses a leadless packaged metal film pressure sensor and a preparation method thereof. The leadless packaged metal film pressure sensor comprises a metal film pressure sensor chip, a glass sealing cover, a conductive metal pin and a conductive metal material. According to the invention, a plurality of technical steps of leading, adapting, packaging and the like in the traditional process are replaced; the making process of the film pressure sensor is greatly simplified; the outside dimension of the film pressure sensor is greatly reduced; and reliable assurance is provided to special applications of pressure measurements of ultralow temperature mediums and the like of the film pressure sensor; and moreover, the preparation method for the leadless packaged metal film pressure sensor, disclosed by the invention, has the advantages of simple process and reliable structure.

Description

Technical field [0001] The present invention is a thin film special sensor technology field, which involves a metal film pressure sensor and its preparation methods that are not packaged.By adopting the key -syndicate and vacuum annealing process in semiconductor technology, the non -lead packaging of metal film pressure sensors is achieved. The process is simple and small, and the volume is small, which avoids the unreliable factors of the traditional lead method. Background technique [0002] As a "third -generation sensor", metal film pressure sensors have canceled the adhesion of traditional variable films, less creep, strong anti -vibration and impact, good stability, and high reliability.Preferably sensor. [0003] In some special occasions, such as the measurement of the rocket engine liquid hydrogen and liquid oxygen fuel pressure, the measurement of the burning pressure parameters of the missile engine, the pressure sensor needs the characteristics of ultra -low temperat...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01L9/04
Inventor 谢锋何迎辉景涛张琦
Owner 48TH RES INST OF CHINA ELECTRONICS TECH GROUP CORP