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Wafer testing system and wafer testing method

A technology of wafer testing and testing methods, which is applied in the direction of single semiconductor device testing, measuring electricity, measuring devices, etc., can solve the problem of reducing the true rate and accuracy of wafer test results, chip manufacturers' reputation and economic losses, and chip burnout and other issues to achieve the effect of improving test efficiency, improving accuracy and authenticity, and timing

Active Publication Date: 2016-05-11
SHANGHAI HUAHONG GRACE SEMICON MFG CORP
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AI Technical Summary

Problems solved by technology

[0005] However, in the long-term process of the probe card, there is a huge error between the test results and the predetermined results, which reduces the true rate and accuracy of the wafer test results, and even burns the chip in severe cases.
If inaccurate test data is provided to customers, it will eventually bring reputation and economic loss to chip manufacturers

Method used

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  • Wafer testing system and wafer testing method
  • Wafer testing system and wafer testing method
  • Wafer testing system and wafer testing method

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Embodiment Construction

[0043]The inventor conducted research on the problem of inaccurate wafer test results, and found that: in the prior art, after a long period of use, the probe, especially the needle tip, will be oxidized by the oxygen in the air and will An oxide layer forms on the surface of the needle. Using the probe with the oxide layer to continue the electrical test results in a huge error in the test results. Therefore, in view of the above shortcomings, in the prior art, there is an improvement of polishing the probe to remove the oxide layer on the probe. In specific production, a fixed probe polishing frequency is usually set, that is, after a certain number of chips or wafers are tested, for example, after 100 chips or wafers are tested, the probes are polished. However, there is no precise standard for setting a fixed probe grinding frequency. That is to say, after how many wafer tests are performed, or how many chip tests are performed on a wafer, the probe polishing process is ...

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Abstract

The invention provides a wafer test system and a wafer test method. The wafer test system comprises a probe card and a probe polishing device, as well as a wafer tester, wherein the wafer tester comprises a control unit; the probe card is used for receiving a test signal sent by the wafer tester, testing a chip to be tested in a wafer and feeding the test result back to the wafer tester, and the test result comprises source drain forward voltage drop VFSD to be tested of the chip to be tested; when the VFSD to be tested is higher than or lower than the standard source drain forward voltage drop VFSD to be tested continuously, the test is stopped, and the control unit controls the probe polishing device to polish the probe card; and after polishing, the next chip to be tested is tested. According to the invention, the probe polishing time is precise, the influence of an oxidizing layer of the probe on the test result is avoided more accurately, the accuracy and the truth of the test result of the wafer are further improved, and the test efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to the field of wafer testing. Background technique [0002] The semiconductor testing process belongs to the key field of the semiconductor industry. Semiconductor testing includes CP (Circuit Probe) testing. CP (Circuit Probe) testing is also called wafer testing (wafertest). The bad chips in the chip are picked out. [0003] Generally, a wafer refers to a silicon wafer used for making integrated circuits. After all the integrated circuits on the wafer are fabricated, the wafer contains several chips. In the wafer testing step, the chip needs to be electrically tested to ensure that the chip on the wafer is a qualified product before packaging. Therefore, wafer testing is one of the key steps to improve the yield of semiconductor devices. [0004] In the prior art, a probe card with several probes is usually used, and the probes of the probe card are electrically contacte...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R31/26G01R1/073
Inventor 王善屹
Owner SHANGHAI HUAHONG GRACE SEMICON MFG CORP