Passive wireless temperature and humidity integrated sensor

A temperature sensor and integrated sensor technology, which is applied in the field of humidity integrated sensor and passive wireless temperature, can solve the problems of large system size and large power consumption, and achieve the effects of small size, low power consumption and low cost

Active Publication Date: 2013-02-27
SOUTHEAST UNIV
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  • Abstract
  • Description
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  • Application Information

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Problems solved by technology

This passive wireless sensor can measure a variety of environmental parameters, but the system is bulky, consumes a lot of power, and cannot be used in harsh environments

Method used

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  • Passive wireless temperature and humidity integrated sensor
  • Passive wireless temperature and humidity integrated sensor
  • Passive wireless temperature and humidity integrated sensor

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Embodiment Construction

[0024] The present invention will be further described below in conjunction with drawings and embodiments.

[0025] figure 1 It is a layered schematic diagram of the sensor of the present invention. figure 2 It is a cross-sectional view of the sensor of the present invention. The passive wireless temperature and humidity integrated sensor of the present invention adopts a cantilever beam capacitive temperature sensor and an interdigital capacitive humidity sensor, and includes a semiconductor substrate 1, a lower dielectric layer 2, a lower metal layer 3, a middle The dielectric layer 4 , the middle metal layer 5 , the upper dielectric layer 6 , and the upper metal interconnection line 7 and the moisture sensitive material 8 located on the upper surface of the upper dielectric layer 6 . The semiconductor substrate 1 includes a base, a lower electrode 11 of a temperature sensor with a cantilever beam structure arranged on the upper surface of the base, a lead 12 located on o...

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Abstract

The invention discloses a passive wireless temperature and humidity integrated sensor. A cantilever beam capacitive temperature sensor and an interdigital capacitive humidity sensor are adopted, and the passive wireless temperature and humidity integrated sensor comprises a semiconductor substrate, a lower dielectric layer, a lower metal layer, an intermediate dielectric layer, an intermediate metal layer, an upper dielectric layer, and an upper metal interconnecting line and humidity-sensitive material positioned on the upper surface of the upper dielectric layer. The cantilever beam capacitive temperature sensor, an inductance loop and interdigital capacitive humidity sensor and an inductance loop work in a frequency division mode, the temperature and humidity are wirelessly measured, and the passive wireless temperature and humidity integrated sensor can be applied to measuring and acquiring two parameters, namely the temperature and humidity, in a closed environment or severe conditions. The sensor is manufactured by a complementary metal oxide semiconductor (CMOS) micro-electromechanical system (MEMS) process, and has high performance and low cost.

Description

technical field [0001] The invention belongs to the field of micro-electromechanical systems, and relates to a passive wireless temperature and humidity integrated sensor composed of all passive components. Background technique [0002] For wireless sensors, sensor signal telemetry methods include active telemetry and passive telemetry. Active telemetry means that the sensing system has a power supply. This telemetry method can transmit sensor signals in two directions over long distances, but the size is large and the battery needs to be replaced. ;Passive telemetry means that there is no power supply in the sensing system, and the signal is acquired by inductive coupling or radio frequency (RF) reflection modulation. This telemetry method has a short signal transmission distance, but it is small in size and does not need to replace the battery. It is especially suitable for applications in sealed environments such as the interior of the human body, food containers, sealed ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01K7/34G01N27/22
Inventor 黄见秋黄庆安张聪
Owner SOUTHEAST UNIV
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