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Total space white light LED (light emitting diode) device

A LED device, full-space technology, applied in the direction of electric solid-state devices, semiconductor devices, electrical components, etc., can solve the problems of chip heating up, weakening light output, etc., and achieve the effects of preventing heating degradation, reducing light loss, and improving luminous efficiency

Active Publication Date: 2015-05-20
杭州天柱科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

At the same time, nearly half of the light emitted from one side of the chip is reflected back by the phosphor glue, which further weakens the light output of the LED.
And the reflected light is absorbed, causing the side effect of further heating of the chip, etc.

Method used

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  • Total space white light LED (light emitting diode) device

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Embodiment Construction

[0011] The present invention will be further described below in conjunction with accompanying drawing.

[0012] refer to figure 1 , the full-space white LED device of the present invention comprises a quartz substrate 3, one side of the quartz substrate 3 is coated with a phosphor powder glue 5, the thickness of the phosphor powder glue can be adjusted according to different needs, and the other side of the quartz substrate 3 adopts The method of CN1850589 or CN101565822 grows a cubic boron nitride film 2, and a reflective bowl 6 is placed on the cubic boron nitride film 2 to form a closed cavity. In the cavity, n LED chips 1 connected in parallel or in series are fixed on the cubic nitrogen film with transparent heat-conducting adhesive. On the boron film 2, n≥1, the illustration shows an LED chip, and the LED chip can be mounted upside down or upside down. The two electrodes 7 of the LED chip are led out of the cavity by wires 4, and a radiator 8 connected with the cubic bo...

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Abstract

The invention discloses a total space white light LED (light emitting diode) device, which comprises a quartz substrate, wherein one surface of the quartz substrate is provided with phosphor adhesive, the other surface of the quartz substrate is provided with a three-dimensional boron nitride thin film, a sealing cavity is formed in the way that a reflective bowl covers the three-dimensional boron nitride thin film, the inside of the cavity is provided with n parallel or serial LED chips, the LED chips are fixedly arranged on the three-dimensional boron nitride thin film, n is greater than or equal to 1, two electrodes of each LED chip are led out of the cavity by conducting wires, and the outer side of the cavity is provided with a heat radiator connected with the three-dimensional boron nitride thin film. The LED device has the advantages that the structure is simple, both surfaces of the chips emit light by utilizing the transparence of the quartz and the three-dimensional boron nitride, the light emitted from the back side of the reflective bowl and the reflective light reflected from the surface of the phosphor adhesive are reflected to the phosphor adhesive layer, then the light loss is reduced, and the light emitting efficiency of the LED is improved; the high heat conductivity of the three-dimensional boron nitride thin film and the low heat conductivity of quartz sheets are utilized, so the heating deterioration of the phosphor adhesive is avoided, and the service life is prolonged.

Description

technical field [0001] The invention relates to an LED light source device, in particular to a full-space white light LED device which uses a quartz substrate grown with a cubic boron nitride thin film to separate fluorescent powder glue and a chip. Background technique [0002] Light-emitting diodes (LEDs) are considered to be the fourth generation of light sources after incandescent lamps, fluorescent lamps, and high-intensity gas discharge lamps. [0003] In traditional LEDs, the chip is mounted on a circuit board with a heat dissipation aid design, and then, the phosphor glue is directly covered on the LED chip. Because the circuit board is opaque, the LED can only emit light from one side, which directly reduces the light emission efficiency of the LED. At the same time, nearly half of the light emitted from one side of the chip is reflected back by the phosphor glue, further reducing the light output of the LED. In addition, the reflected light is absorbed, causing a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48H01L33/60H01L33/64
CPCH01L2224/48091H01L2224/48465H01L2224/49107H01L2224/73265H01L2924/10155H01L2924/181
Inventor 杨杭生
Owner 杭州天柱科技有限公司
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