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Method for gold-plating sectional gold fingers

A gold finger and anti-gold plating technology, which is applied in the direction of removing conductive materials by chemical/electrolytic methods, secondary treatment of printed circuits, etc., can solve the problems of long processing process, remaining copper, complex process, etc., to increase copper sinking The effect of reducing the process, reducing the process and simplifying the processing flow

Active Publication Date: 2015-06-03
WUXI SHENNAN CIRCUITS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem mainly solved by the present invention is to provide a gold-plating method for segmented gold fingers, which solves the problems of long and complicated process in the current processing technology, and is prone to short circuit and residual copper

Method used

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  • Method for gold-plating sectional gold fingers
  • Method for gold-plating sectional gold fingers
  • Method for gold-plating sectional gold fingers

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Embodiment Construction

[0033] In order to describe the technical content, structural features, achieved goals and effects of the present invention in detail, the following will be described in detail in conjunction with the embodiments and accompanying drawings.

[0034] see Figure 1 to Figure 6 , the present invention provides a kind of gold plating method of segment gold finger, comprises steps:

[0035] Step 1: Make in-board graphics and segmented golden finger graphics. In one embodiment, the steps are specifically:

[0036] S01: Cover the circuit board with a dry film, expose the copper foil part on the circuit board that needs to be etched after exposure and development;

[0037] S02: Etch the circuit board, etch away the copper foil exposed in step S01 to form an in-board pattern 1 and segmented golden fingers 2; the state of the circuit board after this step is as follows figure 2 shown.

[0038] In step 1, different from the prior art where the segmented gold finger is first manufactur...

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Abstract

The invention discloses a method for gold-plating sectional gold fingers. The method includes the steps: S01, making an in-board figure and a sectional gold finger figure; S02, gold-plating gold fingers; S03, depositing a copper layer on the whole surface of a circuit board; S04, setting anti-plating ink parts at joints of the gold fingers; S05, attaching blue glue to non-plating areas to expose the sectional gold fingers, and removing the deposited copper layer on the sectional gold fingers; S06, using the copper layer covered with the blue glue as a conductive layer, and gold-plating the sectional gold fingers; S07, removing the anti-plating ink at the joints of the sectional gold fingers; and S08, removing the residual copper layer on the circuit board. The problem that short circuit and residual copper easily occur to the sectional gold fingers at present can be solved by the use of the method.

Description

technical field [0001] The invention relates to a processing technology of a circuit board, in particular to a gold plating method for segmented gold fingers. Background technique [0002] At present, more and more customers have introduced the internationally common Microtea Association standard in the design of communication systems, using segmented golden fingers to separate the current and signal integrated in the circuit system, as a general standard for subsequent broadband product design. [0003] The characteristic of segmented gold fingers is that each complete gold-plated finger network is composed of two gold fingers of different lengths; And the first outer layer etching forms all the graphics on the circuit board, in which the gold finger part is made as a complete unsegmented gold finger, and a gold-plated wire is made to connect the gold finger to the auxiliary copper edge; then the circuit board is first Expose and develop the solder resist for the first tim...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/06H05K3/22
Inventor 刘宝林崔荣武凤伍罗斌王成勇
Owner WUXI SHENNAN CIRCUITS CO LTD
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