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Packaging structure and packaging process

A technology of packaging technology and chip loading machine, which is applied in the direction of electrical components, electrical solid devices, circuits, etc., and can solve the problem of high cost of insulating film manufacturers with diverse chip sizes, fixed thickness of insulating film blocks, and waste of insulating film blocks and other issues to achieve the effect of avoiding ultraviolet light exposure, avoiding side leakage, and saving costs

Active Publication Date: 2016-01-20
成都集佳科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Defects of this mode: special UV film and UV irradiation equipment need to be used, and the cost is high; the insulation film block cannot be larger than the chip size, and the insulation effect is reduced; the thickness of the insulation film block is fixed, and it cannot be superimposed to strengthen the insulation effect; Since the insulating film is attached to the back of the wafer, the insulating film block under the ink dot chip on the wafer is wasted
Defects of this mode: additional devices need to be added to the chip loading equipment; the width of the insulating film is fixed, if the width needs to be changed, it is necessary to replace the insulating film with other width specifications, and the diversity of chip sizes gives the insulating film Producers incur high costs

Method used

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  • Packaging structure and packaging process
  • Packaging structure and packaging process

Examples

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no. 1 example

[0067] The following combination figure 1 as well as Figure 2a-Figure 2d The encapsulation cutting structure and encapsulation cutting process in this embodiment will be described in detail. in, figure 1 It is a flow chart of the encapsulation and cutting process in an embodiment of the present invention, Figure 2a-Figure 2d It is a schematic diagram of the encapsulation cutting process in an embodiment of the present invention.

[0068] Firstly, go to step S11, paste the blue film 102 on the wafer ring 101 of the dicing machine, wherein the blue film 102 can be a common blue film, and the dicing machine can be an ordinary dicing machine.

[0069] Next, proceed to step S12, paste the insulating adhesive film 103 on the blue film 102 to form a Figure 2a shown in the structure, Figure 2b for Figure 2a Sectional view along cutting line A-A'. Wherein, the insulating adhesive film 103 has a large-scale size to facilitate cutting. Preferably, the cross-sectional size of ...

no. 2 example

[0080] Please refer to the following Figure 5 Specifically describe the package structure, wherein, Figure 5 It is a schematic diagram of the encapsulation process in another embodiment of the present invention. The second embodiment is based on the first embodiment, and the difference is that in the packaging structure of the second embodiment, more than two insulating adhesive film blocks 104 are stacked.

[0081] In this embodiment, after step S25 in the packaging process, step S24 and step S25 are repeated, and more than two insulating adhesive film blocks 104 are stacked on the carrier 108, and the chip 109 is loaded on the On the topmost layer of the insulating film block 104, such as Figure 5 As shown, the isolation between the carrier 108 and the chip 109 is increased by stacking the insulating adhesive film block 104, so that the thicker insulating adhesive film block 104 can be replaced according to The insulation between the carrier 108 and the chip 109 needs ...

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Abstract

The invention discloses a packaging technology, which comprises the following steps: pasting a blue film on a wafer ring of a wafer scriber; pasting an insulated adhesive film on the blue film; cutting the insulated adhesive film into a plurality of insulated adhesive film blocks; separating the insulated adhesive film blocks from the blue film; filling the separated insulated adhesive film blocks on a carrier; and loading a chip on the insulated adhesive film blocks on the carrier. The invention further discloses a packaging and cutting structure which comprises the insulated adhesive film blocks, a packaging and cutting technology to prepare the packaging and cutting structure and a packaging structure formed by the packaging technology. The packaging technology can conveniently control the sizes of the insulated adhesive film blocks and improve the insulation effect of the insulated adhesive film blocks.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging structure and semiconductor technology, in particular to a packaging structure and packaging technology. Background technique [0002] In the process of semiconductor packaging, in order to achieve the positional bonding between the chip and the carrier or other chips, but at the same time need to block the electrical connection with the carrier or other chips, it is necessary to paste the chip to the carrier or other chips through an insulating adhesive film block. chip surface. [0003] The size and thickness of the insulating film block are the main technical indicators to measure the insulation capacity. There are two cutting and assembling modes for the traditional insulating film block. [0004] Mode 1: Paste the insulating adhesive film on the UV (ultraviolet light) film, then paste the unscribed wafer on the insulating adhesive film, and scribe the insulating adhesive film...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/31H01L21/56
CPCH01L2224/75
Inventor 周润宝李学敏
Owner 成都集佳科技有限公司
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