Two-sided flexible printed circuit (FPC) roll-type material-receiving production process

A production process, roll-type technology, applied in the field of double-sided FPC roll-type splicing production technology, can solve the problems of poor chemical resistance, polluted environment resistance to electroplating, high price of splicing materials, etc., to achieve low price, chemical resistance Good performance, good anti-plating performance

Inactive Publication Date: 2013-03-20
欣兴同泰科技(昆山)有限公司
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention provides a double-sided FPC roll splicing production process to solve the problem of high price of splicing materials used in the double-sided FPC roll splicing production process in the prior art, polluting the environment, and poor resistance to electroplating and chemical solutions The problem

Method used

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  • Two-sided flexible printed circuit (FPC) roll-type material-receiving production process
  • Two-sided flexible printed circuit (FPC) roll-type material-receiving production process

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Embodiment Construction

[0021] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings. It should be noted that all the drawings of the present invention are in simplified form and use inaccurate scales, and are only used to facilitate and clearly assist the purpose of illustrating the embodiments of the present invention.

[0022] The double-sided FPC roll-type splicing production technology provided by the present invention, such as figure 2 As shown, the steps include: FCCL cutting into slices; FCCL drilling; FCCL development; splicing, wherein the splicing material is an epoxy adhesive covering film; roll baking; roll copper plating; and post-production. The present invention adopts the epoxy glue-based covering film to replace the acrylic glue-based covering film in the prior art, the price is relatively low, it can n...

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Abstract

The invention relates to a two-sided flexible printed circuit (FPC) roll-type material-receiving production process. The two-sided FPC roll-type material-receiving production process comprises the following steps: flexible copper clad laminate (FCCI) piece cutting; FCCI drilling; FCCI developing; receiving materials, wherein the material of the receving material is an epoxy glue series covering membrane; roll-type baking; roll-type copper plating and later making. According to the two-sided FPC roll-type material-receiving production process, an epoxy glue series covering membrane is adopted to replace an acrylic adhesive series covering membrane which is adopted by the prior art, and the two-sided FPC roll-type material-receiving production process has the advantage that the price is relatively low. According to the two-sided FPC roll-type material-receiving production process, not only pollution to environment can be avoided through avoiding using halogen, but also good electroplating performance and chemical liquid-resisting performance are achieved. Further, due to the fact that the step of roll-type baking is added correspondingly, the binding force is much good, and tensile property of products becomes much good too.

Description

technical field [0001] The invention relates to the field of flexible circuit board production, in particular to a double-sided FPC roll-type splicing production process. Background technique [0002] The traditional double-sided flexible circuit board (FPC) roll operation process is as follows: figure 1 As shown, including: cutting FCCL (soft copper foil substrate, English full name: Flexible Copper Clad Laminate) into slices, slice drilling, slice development (Shadow), splicing, coil copper plating, and then It is made after entering, and the receiving material mostly adopts acrylic glue-based covering film, which is relatively expensive; it contains halogen, which has certain pollution to the environment; some receiving materials are attacked by wet process potions, and the receiving part There will be poor material breaking, which will cause the finished product to be scrapped; some of the connecting materials have poor electrical conductivity, and the copper thickness ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
Inventor 穆俊杰钱令习赖永伟仝波勾雪晨王红姣
Owner 欣兴同泰科技(昆山)有限公司
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