Hot rolling process for high-performance tantalum target

Abstract

The invention relates to a hot rolling process for a high-performance tantalum target. The method comprises the following steps of: preheating a forged blank to 900-1,200 DEG C; rolling; and performing acid cleaning till tantalum metal luster occurs, and mottles are eliminated. A high-performance tantalum target which comprises uniform and consistent texture components (over 50 percent) with superior textures along the thickness direction (100) of the target and meets the use requirements of a high-end sputtering base can be obtained by using a high-performance tantalum target rolling blank produced by heating and rolling. Compared with a normal tantalum target, the high-performance tantalum target has the advantages that: texture components of over 50 percent of textures along the thickness direction (100) of the target are realized, higher requirement on the uniformity of the textures is met, and a consistent sputtering rate in a using process is ensured.

Description

technical field [0001] The invention relates to the technical field of non-ferrous metal metallurgy, in particular to a hot rolling process for a high-performance tantalum target. Background technique [0002] Tantalum targets are mainly used in the semiconductor coating industry. [0003] Physical vapor deposition (PVD) is one of the most critical processes in the production process of semiconductor chips. Its purpose is to deposit metal or metal compounds in the form of thin films on silicon wafers or other substrates, and then through photolithography and corrosion etc. The cooperation of the process finally forms the complex wiring structure in the semiconductor chip. Physical vapor deposition is accomplished through sputtering machines, and the sputtering target is a very important key consumable used in the above process. Common sputtering targets include high-purity Ta, as well as non-ferrous metals such as Ti, Al, Co and Cu. [0004] As the wafer size increases fr...

AI Technical Summary

Problems solved by technology

[0005] In the prior art, the tantalum target is mainly obtained by cold rolling or cold forging process, and the texture components in the thickness direction of the obtained target are not uniform, which is mainly manifested in the upper and lower layers of the target (100) texture is dominant, The (111) texture is dominant in the middle. This type of target can be used in machines with low requirements, but the uneven sputtering rate when used in high-end machines such as 12" is unacceptable.