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Preparation method of high-thermal conductivity diamond/aluminum composite material

An aluminum composite material and diamond technology, which is applied in the field of high thermal conductivity diamond/aluminum composite material preparation, can solve problems such as surface oxidation, internal crystal cracking, diamond graphitization, etc., achieve performance improvement, increase activity, and avoid graphitization.

Active Publication Date: 2015-02-11
AVIC BEIJING INST OF AERONAUTICAL MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Excessive holding time described in this patent usually leads to diamond graphitization, surface oxidation, internal crystal cracking and other phenomena, which have a great impact on the properties of the final prepared composite material

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0007] Implementation example 1:

[0008] Choose the diamond particle of 91 micron MBD type, the diamond particle is prepared into prefabricated body, prefabricated body is put into the mould, the Al-Si alloy of 1.5 times of diamond preformed body volume is placed on the preformed body, wherein, the mass content of Si is 15%, then put it into a heating furnace, and keep it at 900°C for 30 minutes under the protection of high-purity nitrogen, and then a high thermal conductivity diamond / aluminum composite material can be prepared. The thermal conductivity of the composite material is 852W / (m K), and the linear expansion coefficient 4.46×10 -6 / K.

[0009] Implementation example 2:

[0010] Choose the diamond particle of 100 micron MBD type, diamond particle is prepared into prefabricated body, prefabricated body is put into the mould, the Al-Si alloy of 1.3 times of diamond preformed body volume is placed on the preformed body, wherein, the mass content of Si is 15%, then pu...

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Abstract

The invention belongs to the field of electronic packaging materials and relates to a preparation method of a high-thermal conductivity diamond / aluminum composite material. The preparation method comprises the following steps: preparing diamond particles into preform; putting the diamond preform to a mould, putting Al-Si alloy, the size of which is 1.3-1.8 times of that of the diamond preform, to the preform, wherein the mass content of the Si is 15%; putting the mixture to a heating furnace for keeping the temperature of 900 DEG C to 950 DEG C for 30-60 minutes under the protection of pure nitrogen gas to obtain the high-thermal conductivity diamond / aluminum composite material. The diamond / aluminum composite material prepared by a pressure impregnation technology has excellent thermal conductivity and can satisfy the requirements of a large-power electronic packaging material.

Description

technical field [0001] The invention belongs to the field of electronic packaging materials and relates to a method for preparing a high thermal conductivity diamond / aluminum composite material. Background technique [0002] With the development of microelectronics today, the computing speed of chips is getting faster and faster. Microprocessors and semiconductor devices often fail to work properly due to high temperatures in applications. Heat dissipation has become a major technical bottleneck in the development of the electronic information industry. The performance of the first and second generation electronic packaging materials can no longer meet the current demand. [0003] Diamond has good physical properties, its thermal conductivity at room temperature is 600-2200W / (m K), and its thermal expansion coefficient is 0.8×10 -6 / K, and there is no anisotropy. Combining diamond with aluminum with good thermal conductivity, high-performance thermal control composite ma...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C21/00C22C1/00C22C1/10
Inventor 刘永正
Owner AVIC BEIJING INST OF AERONAUTICAL MATERIALS