Adhesive for silicon rod/silicon ingot slicing and method for preparing same

An adhesive and silicon ingot technology, applied in the direction of adhesives, polyurea/polyurethane adhesives, adhesive types, etc., can solve the problems of broken silicon rods/silicon ingot slices, increased product rejection rate, and difficult to clean adhesives.

Inactive Publication Date: 2013-04-03
JIANGSU UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Generally speaking, it is best to select a certain appropriate range for the adhesive force to avoid damage to the silicon rod / silicon ingot slice. If it exceeds this range, it will easily cause damage to the silicon rod / silicon ingot slice. Difficult to clean off the adhesive on the surface of silicon rods / silicon ingot slices
At present, although the available adhesives can meet the bonding requirements of silicon rods / silicon ingots cutting, the adhesives on the surface of silicon rods / silicon ingots are difficult to clean, which leads to an increase in the reject rate of products

Method used

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  • Adhesive for silicon rod/silicon ingot slicing and method for preparing same
  • Adhesive for silicon rod/silicon ingot slicing and method for preparing same
  • Adhesive for silicon rod/silicon ingot slicing and method for preparing same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] 1. The adhesive is prepared according to the following composition ratio (mass percentage content):

[0020] 1. Group A components:

[0021] Epoxy resin E44 15%,

[0022] Epoxy resin E51 40%,

[0023] Acrylic polyurethane 30%,

[0024] Titanium dioxide 10%,

[0025] Magnesium Oxide 4.9%,

[0026] Imidazole 0.1%.

[0027] 2. Group B components:

[0028] Organotin Laurate 5%,

[0029] Polyamine 95%.

[0030] 2. Preparation method:

[0031] First mix the above-mentioned proportions of the components of Group A and Group B uniformly, and then mix the Group A and Group B uniformly in a mass ratio of 1:1 to obtain the adhesive of the present invention.

[0032] 3. The effect of the embodiment: the operating time at room temperature is 16 minutes, the initial curing time at room temperature is 5 minutes, the complete curing time is 5 hours, the bonding shear force is 18 MPa, and the cleaning time is 15 minutes.

Embodiment 2

[0034] 1. The adhesive is prepared according to the following composition ratio (mass percentage content):

[0035] 1. Group A components:

[0036] Epoxy resin E44 40%,

[0037] Epoxy resin E51 15%,

[0038] Acrylic polyurethane 30%,

[0039] Titanium dioxide 10%,

[0040] Magnesium Oxide 4.9%,

[0041] Imidazole 0.1%.

[0042] 2. Group B components:

[0043] Organotin Laurate 5%,

[0044] Polyamine 95%.

[0045] Two, this adhesive preparation method is the same as embodiment 1.

[0046] 3. The effect of the embodiment: the operating time at room temperature is 5 minutes, the initial curing time at room temperature is 52 minutes, the complete curing time is 5 hours, the bonding shear force is 19 MPa, and the cleaning time is 12 minutes.

Embodiment 3

[0048] 1. The adhesive is prepared according to the following composition ratio (mass percentage content):

[0049] 1. Group A components:

[0050] Epoxy resin E44 30%,

[0051] Epoxy resin E51 35%,

[0052] Acrylic polyurethane 25%,

[0053] Titanium dioxide 5%,

[0054] Magnesium Oxide 4.9%,

[0055] Imidazole 0.1%.

[0056] 2. Group B components:

[0057] Organotin Laurate 5%,

[0058] Polyamine 95%.

[0059] Two, this adhesive preparation method is the same as embodiment 1.

[0060] 3. The effect of the embodiment: the operating time at room temperature is 14 minutes, the initial curing time at room temperature is 53 minutes, the complete curing time is 5 hours, the bonding shear force is 17 MPa, and the cleaning time is 11 minutes.

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PUM

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Abstract

The invention discloses an adhesive for silicon rod / silicon ingot slicing and a method for preparing the same. The adhesive is composed of two components A and B, wherein the mixing mass ratio of A to B is 1: 1; the component A is composed of 15-40% of epoxy resin E44, 15-40% of epoxy resin E51, 25-30% of acrylic polyurethane, 5-10% of titanium dioxide, 1-5% of magnesium oxide and 0.1-1% of imidazole by mass; and the component B is composed of 5% of lauric acid organic tin and 95% of polyamine by mass. The method comprises the preparation steps of mixing the ingredients of the component A and the ingredients of the component B evenly according to the mixing ratio at first, respectively; and then mixing the component A with the component B in the mass ratio of 1: 1, thereby obtaining the adhesive disclosed by the invention. The adhesive disclosed by the invention is capable of meeting the binding requirement for silicon rod / silicon ingot cutting and also easy to clean.

Description

technical field [0001] The invention belongs to the technical field of adhesives, and relates to an adhesive used for slicing silicon rods / silicon ingots and a preparation method thereof. Background technique [0002] Silicon ingot is an important material for solar energy, and the formed silicon rod / silicon ingot needs to be cut into thin slices by wire cutting for the preparation of solar cells. During the cutting process, an adhesive is needed to bond and fix the silicon rod / silicon ingot before cutting, and after cutting, an adhesive that can easily clean off the surface of the silicon rod / silicon ingot slice is required. This requires that the adhesive used for silicon rods / silicon ingot slices should not only ensure that the silicon rods / silicon ingot slices have sufficient cohesion, that is, stick to them, but also allow the adhesive on the surface of the silicon rods / silicon ingot slices to be easily cleaned Lose. Therefore, bonding time, bonding strength and clean...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/02C09J175/14C09J11/06C09J11/04C08G18/67C08G18/42
Inventor 高延敏
Owner JIANGSU UNIV OF SCI & TECH
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