Adhesive for silicon rod/silicon ingot slicing and method for preparing same
An adhesive and silicon ingot technology, applied in the direction of adhesives, polyurea/polyurethane adhesives, adhesive types, etc., can solve the problems of broken silicon rods/silicon ingot slices, increased product rejection rate, and difficult to clean adhesives.
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Embodiment 1
[0019] 1. The adhesive is prepared according to the following composition ratio (mass percentage content):
[0020] 1. Group A components:
[0021] Epoxy resin E44 15%,
[0022] Epoxy resin E51 40%,
[0023] Acrylic polyurethane 30%,
[0024] Titanium dioxide 10%,
[0026] Imidazole 0.1%.
[0027] 2. Group B components:
[0028] Organotin Laurate 5%,
[0029] Polyamine 95%.
[0030] 2. Preparation method:
[0031] First mix the above-mentioned proportions of the components of Group A and Group B uniformly, and then mix the Group A and Group B uniformly in a mass ratio of 1:1 to obtain the adhesive of the present invention.
[0032] 3. The effect of the embodiment: the operating time at room temperature is 16 minutes, the initial curing time at room temperature is 5 minutes, the complete curing time is 5 hours, the bonding shear force is 18 MPa, and the cleaning time is 15 minutes.
Embodiment 2
[0034] 1. The adhesive is prepared according to the following composition ratio (mass percentage content):
[0035] 1. Group A components:
[0036] Epoxy resin E44 40%,
[0037] Epoxy resin E51 15%,
[0038] Acrylic polyurethane 30%,
[0039] Titanium dioxide 10%,
[0041] Imidazole 0.1%.
[0042] 2. Group B components:
[0043] Organotin Laurate 5%,
[0044] Polyamine 95%.
[0045] Two, this adhesive preparation method is the same as embodiment 1.
[0046] 3. The effect of the embodiment: the operating time at room temperature is 5 minutes, the initial curing time at room temperature is 52 minutes, the complete curing time is 5 hours, the bonding shear force is 19 MPa, and the cleaning time is 12 minutes.
Embodiment 3
[0048] 1. The adhesive is prepared according to the following composition ratio (mass percentage content):
[0049] 1. Group A components:
[0050] Epoxy resin E44 30%,
[0051] Epoxy resin E51 35%,
[0052] Acrylic polyurethane 25%,
[0053] Titanium dioxide 5%,
[0055] Imidazole 0.1%.
[0056] 2. Group B components:
[0057] Organotin Laurate 5%,
[0058] Polyamine 95%.
[0059] Two, this adhesive preparation method is the same as embodiment 1.
[0060] 3. The effect of the embodiment: the operating time at room temperature is 14 minutes, the initial curing time at room temperature is 53 minutes, the complete curing time is 5 hours, the bonding shear force is 17 MPa, and the cleaning time is 11 minutes.
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Abstract
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