Copper alloy and fabrication method thereof

A copper alloy and processing rate technology, applied in the field of Cu-Ni-Si alloys, can solve the problems of not meeting the technical requirements of high-grade lead frames, heavy mold load, cracking residual stress, etc., so as to reduce the porosity of products and improve Casting quality, eliminating the effects of work hardening

Active Publication Date: 2013-04-03
山西春雷铜材有限责任公司
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Problems solved by technology

The existing problems of copper alloys for lead frames are: 1. The tensile strength of existing Cu-Fe-P alloy products (C19400, C19210) is 420-500 MPa, which cannot meet the technical requirements of high-grade lead frames
2. Some alloys have low elongation, poor plasticity, and are not easy to form when stamping, and the

Method used

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Embodiment Construction

[0028] The present invention will be further described in conjunction with specific embodiments. In this embodiment, in addition to the necessary steps and processes, additional steps and processes are carried out according to the production and preparation of better copper alloys for lead frames, which are not necessary steps and processes for implementing this embodiment. At the same time, in this embodiment, a copper alloy sheet for a lead frame of a size is produced and prepared, and the dimensions involved are for distance description. Those skilled in the actual implementation of the present invention can convert the specific dimensions into corresponding specific dimensions for processing according to the specific dimensions and the processing rate disclosed by the present invention.

[0029] An embodiment of a copper alloy preparation method, comprising: A) melting and casting, B) hot rolling, C) face milling and D) four passes of cold rolling and annealing. in:

[0...

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Abstract

The invention relates to the field of a metal alloy, in particular to a Cu-Ni-Si alloy. A fabrication method of a copper alloy comprises the steps as follows: A) casting, B) hot rolling, C) face milling and D) cold rolling and annealing. The copper alloy comprises the following chemical components by mass percent: 1.8-2.1% of nickel, 0.4-0.68% of silicon, 0-0.2% of iron, 0-0.1% of manganese, 0-0.2% of zinc, 0-0.005% of cadmium, 0-0.02% of lead, 0-0.3% of other impurities and the balance of cooper, wherein iron, manganese, zinc, cadmium and lead are all impurities; the tensile strength Rm of the copper alloy is greater than or equal to 600MPa; the broken elongation A11.3 is greater than or equal to 8%; the Vickers hardness HV is greater than or equal to 180; and the electrical conductivity is greater than or equal to 46% IACS (International Annealed Copper Standard). The ideal performance of a copper alloy material for a lead frame can be obtained by the fabrication method for the copper alloy.

Description

technical field [0001] The invention relates to the field of metal alloys, in particular to Cu-Ni-Si alloys. Background technique [0002] With the rapid development of electronic chips, the requirements for the tensile strength and hardness of the copper alloy material used in the lead frame of the chip are getting higher and higher. At present, the desired tensile strength Rm of the copper alloy for the lead frame is ≥ 600MPa , Elongation after breaking A11.3 ≥ 8%, Vickers hardness HV ≥ 180 (Vickers hardness value, no unit). [0003] At present, the main materials used for lead frames in China are Cu-Fe-P alloys (C19400, C19210) and Cu-Ni-Si alloys (C7025). The existing problems of copper alloys for lead frames are: 1. The tensile strength of existing Cu-Fe-P alloy products (C19400, C19210) is 420-500 MPa, which cannot meet the technical requirements of high-grade lead frames. 2. Some alloys have low elongation and poor plasticity during stamping, and are not easy to fo...

Claims

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Application Information

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IPC IPC(8): C22C9/06C22C1/02C22F1/08C21D8/02
Inventor 陈清香汪洋张晓敏王少华王全仁张淑琴朱占国姚军周萌陈婷
Owner 山西春雷铜材有限责任公司
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