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Photosensitive resin composition, method of producing cured film, cured film, organic el display device, and liquid crystal display device

A technology of photosensitive resin and composition, which is applied in the field of photosensitive resin composition to achieve the effects of high chemical resistance, small loss of transparency, and high sensitivity

Active Publication Date: 2013-04-03
FUJIFILM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

For example, Japanese Patent Application Laid-Open No. 2008-3532 discloses an invention related to the improvement of resistance to MEA (monoethanolamine) as a stripping liquid, but there is no description about the improvement of resistance to other chemical liquids, especially NMP.

Method used

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  • Photosensitive resin composition, method of producing cured film, cured film, organic el display device, and liquid crystal display device
  • Photosensitive resin composition, method of producing cured film, cured film, organic el display device, and liquid crystal display device
  • Photosensitive resin composition, method of producing cured film, cured film, organic el display device, and liquid crystal display device

Examples

Experimental program
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preparation example Construction

[0521] Preparation method of photosensitive resin composition

[0522] Component A to component C and (component D) essential components of a solvent are mixed in a predetermined ratio by any method, stirred and dissolved, and a photosensitive resin composition is prepared. For example, the photosensitive resin composition may be prepared by mixing component A, component B, or component C in advance in a solvent (component D) after each of component A, component B, or component C is mixed at a predetermined ratio. The photosensitive resin composition prepared in this way can be used after filtering using a filter etc. with a pore diameter of about 0.1 micrometer.

[0523] Formation method of hardened film

[0524] Next, the formation method of the cured film of this invention is demonstrated.

[0525] The method for forming the cured film of the present invention is not particularly limited except for using the positive photosensitive resin composition of the present inventi...

example 1～ example 11、 example 66 and example 67 and comparative example 1～ comparative example 4

[0620] (1) Preparation of photosensitive resin composition

[0621] After mixing the components shown in the following Table 3 to prepare a uniform solution, it was filtered using a filter made of polytetrafluoroethylene with a pore size of 0.1 μm, and Examples 1 to 11, Examples 66 and 67, and The solution of the photosensitive resin composition of Comparative Example 1-Comparative Example 4.

example 12～ example 28 and comparative example 7～ comparative example 14

[0667] (1) Preparation of photosensitive resin composition

[0668] After mixing the components shown in the following Table 4 to prepare a uniform solution, it was filtered using a filter made of polytetrafluoroethylene having a pore size of 0.1 μm to prepare Examples 12 to 28 and Comparative Examples 7 to Comparative Examples, respectively. 14 solution of the photosensitive resin composition. In addition, the unit of the addition amount in Table 4 is a mass part, and a ratio is a mass basis.

[0669]

[0670]

[0671]

[0672]

[0673] In addition, the abbreviations in Table 4 other than the polymer and the photoacid generator are as follows.

[0674] C'1: Duranate 17B-60PX (manufactured by Asahi Kasei Chemical Co., Ltd.)

[0675] C'2: Duranate (Duranate) 17B-60P (manufactured by Asahi Kasei Chemical Co., Ltd.)

[0676] In addition, C'1 and C'2 are blocked isocyanate compounds whose parent structure is a biuret structure and whose end-blocking structure is a...

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Abstract

The present invention provides a photosensitive resin composition, a method of producing a cured film, the cured film, an organic EL display device and a liquid crystal display device. The photosensitive resin composition provided by the invention is characterized by comprising the following components: (component A) a resin which has an ethylidene ether structure and has changeable alkali solubility through acid function; (component B) a photoacid generator, (component C) cross linker and (component D) a solvent. Furthermore the component C comprises end-capped isocyanate compound, wherein the parent structure of the end-capped isocyanate compound is a biuret structure.

Description

technical field [0001] The invention relates to a photosensitive resin composition, a method for forming a cured film, a cured film, an organic EL display device, and a liquid crystal display device, in particular to a photosensitive resin composition suitable for forming an organic EL display device, a liquid crystal display device, an integrated circuit element, a solid Positive photosensitive resin composition for flattening film, protective film, or interlayer insulating film of electronic components such as imaging devices, and method for forming a cured film using the positive photosensitive resin composition. Background technique [0002] In an organic EL display device, a liquid crystal display device, or the like, a patterned interlayer insulating film is provided. A photosensitive resin composition is widely used for forming the interlayer insulating film because the number of steps required to obtain a required pattern shape is small and sufficient flatness can be...

Claims

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Application Information

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IPC IPC(8): G03F7/004G03F7/039G03F7/00G02F1/1333H01L51/52H01L51/54
CPCH10K85/731
Inventor 柏木大助山﨑健太米泽裕之霜山达也
Owner FUJIFILM CORP
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