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An automatic control method for manufacturing circuit film

A technology of automatic control and line film, applied in special data processing applications, instruments, electrical digital data processing, etc., can solve the problems of reducing work efficiency and time-consuming, and achieve the effects of improving work efficiency, ensuring life, and shortening production time

Active Publication Date: 2016-01-06
广东依顿电子科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Multi-step complex operations, time spent on system operation, greatly reduce work efficiency

Method used

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Embodiment Construction

[0018] An automatic control method for manufacturing circuit film, the steps are as follows:

[0019] (1) Step 1, the steps for determining all parameters and layer aliases when making the line film;

[0020] (2) Step 2, a step for conceiving and designing a simplified interface to form an input interface;

[0021] (3) Step 3, for setting the programming language, automatically identifying and copying a set of outer circuit layer steps;

[0022] (4) Step 4, for setting the programming language, automatically optimize the circuit layer in the circuit duplication layer, and remove the steps of negative elements;

[0023] (5) Step 5, for setting the programming language, automatically in the line duplication layer according to the corresponding compensation step of the large line, anti-pad and copper skin according to the production capacity;

[0024] (6) Step 6, for setting the program language, automatically comparing the plug hole layer, and removing the holes that need to b...

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Abstract

The invention discloses an automatic control method for making a line film. The automatic control method comprises the steps as follows: 1, determining all parameters and layer names when the line film is made; 2, conceiving and designing a simplified interface to form an input interface; 3, identifying and copying a set of external line layers; 4, optimizing the line layers in line copying layers to remove negative elements; 5, correspondingly compensating and expanding lines, anti-welding plates and copper sheets according to the production capacity in the line copying layers; 6, comparing with plug hole layers, removing holes required to be filled with anti-welding oil in drill layers; 7, compensating and expanding the residual holes in the drill layer, and copying to the line copying layers; 8, automatically generating a set of finished line film tools; and 9, automatically repeating the steps 3 to 8 to form another set of external line films. According to the automatic control method, the tool making time is shortened to be 1-2 min, the working efficiency is greatly improved, the steps are simple and convenient, the making time is short, and the efficiency is high.

Description

【Technical field】 [0001] The patent of the present invention relates to an automatic control method for manufacturing circuit film. 【Background technique】 [0002] Customers have strict requirements on the thickness of solder resist oil for thick copper plates. A thicker copper foil on the board will make the relative height of the circuit position and the pad relatively larger. Only one screen printing of solder mask will cause false copper exposure due to too thin solder mask, which will greatly reduce the life of the circuit board. Therefore, it is necessary to make a circuit printing oil film tool, and silk screen solder resist oil once more on the circuit and copper surface. However, it takes a lot of time and professionals to make line printing ink film tools. The thick copper circuit board with extremely dense lines takes about 25 minutes to complete the entire production process, of which 15 minutes are used to manually identify positive and negative elements and c...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F17/50
Inventor 莫介云
Owner 广东依顿电子科技股份有限公司
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