Preparation method of modified epoxy resin/flame-retardant glass cloth paper composite-base copper clad plate

Abstract

The invention relates to the field of application of electronic materials, and aims to provide a preparation method of a modified epoxy resin / flame-retardant glass cloth paper composite-base copper clad plate. The preparation method of the resin comprises the following steps: adding cardanol, triglycidyl isocyanurate and low-toxicity alkali catalyst into a reactor according to the formula proportion, heating, controlling the temperature, keeping the temperature, testing the epoxide number to control the reaction end point, cooling to room temperature, and adding a solvent according to the formula proportion to obtain the epoxy resin solution with a certain solid content. The preparation technique is simple; and the product has favorable properties and wide applicability. The produced modified epoxy resin has the advantages of low molecular weight, no volatile micromolecular substance, favorable permeability for groundwood paper and high crosslinking density, and has excellent high temperature resistance, chemical stability, ultraviolet aging resistance, weather resistance, mechanical properties and electric properties. Compared with the existing secondary sizing technique, the invention has the advantages of energy saving, less production waste and lower equipment investment, and greatly shortens the production time.

Description

technical field [0001] The invention relates to the application field of electronic materials, in particular to the preparation of modified epoxy resin and its application in flame-retardant epoxy paper-cored glass-cloth-covered composite substrate copper-clad boards. Background technique [0002] Copper-clad epoxy paper core glass-cloth composite substrate laminate is a widely used PCB substrate, and its corresponding NEMA model is CEM-1, which has good flatness, thickness accuracy and dimensional stability . Its mechanical strength, dielectric properties and water absorption are superior to ordinary paper-based copper clad laminates. Compared with FR-4 epoxy glass cloth-based copper clad laminate, CEM-1 copper clad laminate has excellent drilling and punching processability, and the drill bit wear rate is low when drilling. In addition, CEM-1 copper clad laminates are also light in weight and low in price, and have obvious performance and price advantages compared with o...

AI Technical Summary

Problems solved by technology

As a result, the copper-clad laminate production enterprises with no or little waste water and liquid discharge have been transformed into chemical enterprises with more phenol-containing waste water pollution, which increases the difficulty and harm of environmental protection and increases safety hazards.

From another point of view, due to the limitations of the synthesis process of resole thermosetting phenolic resin, the content of free phenol in the synthesized tung oil modified phenolic resin will inevitably be high, and the content of free phenol in the resin actually produced in the factory often reaches 10wt% or higher

More free phenols will lead to low cross-linking density of the final CEM-1 board, decreased heat resistance, poor water absorption and electrical properties; at the same time, the synthesized tung oil-modified phenolic resin is difficult to penetrate into wood pulp due to its large molecular weight Paper will also lead to high water absorption and poor electrical properties of CEM-1 sheets

It can be seen that the current manufacturing of glass cloth paper composite based copper clad laminates based on tung oil modified phenolic resin has great limitations in process environmental protection and product performance. These shortcomings seriously restrict the application and development of this type of board.

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