How to make a circuit structure

Abstract

The invention discloses a method for manufacturing a circuit structure. It includes laminating a dielectric layer with a second surface on a first surface of a circuit substrate and a first patterned circuit layer. Form at least one blind hole extending from the second surface to the first patterned circuit layer and an indented pattern. A patterned photoresist layer having at least one opening exposing the blind hole and the recessed pattern is formed on the second surface. The area where the patterned photoresist layer is located is defined as the first area, and the area outside the first area is defined as the second area. An activation layer is formed in the first and second regions. The patterned photoresist layer and the activation layer located in the first area are removed to leave the activation layer located in the second area. A conductive material is formed on the activation layer located in the second region. Remove part of the conductive material and part of the activation layer located in the second area.

Description

technical field [0001] The invention relates to a method for manufacturing a circuit structure, and in particular to a method for manufacturing a circuit structure with thin circuits. Background technique [0002] Generally speaking, the circuit structure of the circuit board is usually formed by photolithography and etching processes or laser ablation. Taking the existing manufacturing process of the buried circuit structure formed by laser ablation as an example, it includes the following steps. First, a dielectric layer is provided. Then, a laser beam is irradiated on the surface of the dielectric layer to form an intaglio pattern and a blind hole connected to the circuit layer. Then, a pre-treatment is performed to remove the smear or residue left after the laser (especially the surface of the circuit layer exposed at the bottom of the blind hole). Then, a palladium layer is formed on the surface of the dielectric layer and in the formed concave patterns and blind hol...

AI Technical Summary

Problems solved by technology

Therefore, the material cost and time cost of longer electroplating time to form a thicker conductive copper layer, the material cost and time cost of removing the conductive copper layer on the surface of the dielectric layer, and the excessive and unnecessary The production cost and time cost of the by-products and waste derived from the production conditions are a waste

Furthermore, the conductive copper layer increased by prolonging the electroplating time may also have uneven thickness distribution, which will not be conducive to the subsequent production of build-up circuit layers on it, let alone the production of stacked hole design or higher wiring. The problem of low production process yield of density circuit board and low reliability circuit structure

In addition, if photolithography and etching are used to form the circuit structure, it will face problems such as the use of a large amount of chemical liquid, which will cause environmental pollution and increase production costs.

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