Waste printed circuit board non-metal powder/ABS rein composite material and its preparation method

A technology of ABS resin and printed circuit board, applied in the direction of coating, etc., to achieve the effects of reducing production costs, protecting the environment, and improving mechanical properties

Active Publication Date: 2013-05-08
TSINGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Existing research reports mainly introduce the use of waste printed circuit board non-metallic powder to prepare building materials, modified asphalt, and filling polypropylene, polyvinyl chloride and other resins to prepare composite materials or phenolic resins to prepare molding compounds. A report on the preparation of composite materials by mixing metal powder and ABS resin

Method used

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  • Waste printed circuit board non-metal powder/ABS rein composite material and its preparation method
  • Waste printed circuit board non-metal powder/ABS rein composite material and its preparation method
  • Waste printed circuit board non-metal powder/ABS rein composite material and its preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] Waste printed circuit board non-metal powder / ABS resin composite material, including 200 mesh printed circuit board non-metal powder after the crushing and sorting of printed circuit boards, ABS resin, silane coupling agent KH-560 and composite processing aids, printed circuit boards The weight ratio of non-metal powder to ABS resin is 10:90, silane coupling agent KH-560 accounts for 0.8wt% of non-metal powder in printed circuit boards, mixed raw materials composed of composite processing aids, modified non-metal powder and ABS resin The mass ratio is 2.6:97.4;

[0024] The composite processing aid consists of 5wt% of sodium stearate, 15wt% of zinc stearate, 35wt% of liquid paraffin, 20wt% of antioxidant 1010, and 25wt% of antioxidant DLTP. composition.

[0025] The preparation method of waste printed circuit board non-metal powder / ABS resin composite material includes the following steps:

[0026] Step 1. Material pretreatment:

[0027] Mix the silane coupling agent KH-560 w...

Embodiment 2

[0038] Waste printed circuit board non-metal powder / ABS resin composite material, including 200 mesh printed circuit board non-metal powder after the crushing and sorting of printed circuit boards, ABS resin, silane coupling agent KH-560 and composite processing aids, printed circuit boards The weight ratio of non-metal powder to ABS resin is 20:80, silane coupling agent KH-560 accounts for 1.0wt% of non-metal powder in printed circuit boards, and a mixed raw material composed of composite processing aids, modified non-metal powder and ABS resin The mass ratio is 2.6:97.4;

[0039] The composite processing aid is composed of 10wt% of sodium stearate, 15wt% of zinc stearate, 35wt% of liquid paraffin, 20wt% of antioxidant 1010, and 20wt% of antioxidant DLTP. composition.

[0040] The preparation method of waste printed circuit board non-metal powder / ABS resin composite material includes the following steps:

[0041] Step 1. Material pretreatment:

[0042] Mix silane coupling agent KH-...

Embodiment 3

[0053] Waste printed circuit board non-metal powder / ABS resin composite material, including 200 mesh printed circuit board non-metal powder after the crushing and sorting of printed circuit boards, ABS resin, silane coupling agent KH-560 and composite processing aids, printed circuit boards The weight ratio of non-metal powder to ABS resin is 30:70, silane coupling agent KH-560 accounts for 1.2wt% of non-metal powder in printed circuit boards, mixed raw materials composed of composite processing aids, modified non-metal powder and ABS resin The mass ratio is 2.6:97.4;

[0054] The composite processing aid is composed of 15% by weight of sodium stearate, 15% by weight of zinc stearate, 20% by weight of liquid paraffin, 25% by weight of antioxidant 1010, and 25% by weight of antioxidant DLTP. composition.

[0055] The preparation method of waste printed circuit board non-metal powder / ABS resin composite material includes the following steps:

[0056] Step 1. Material pretreatment:

[...

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Abstract

The invention relates to a waste printed circuit board non-metal powder/ABS rein composite material and its preparation method. The preparation method comprises the following steps: carrying out alcoholysis of a silane coupling agent KH-560, adding the obtained silane coupling agent KH-560 into printed circuit board non-metal powder, mixing the obtained modified printed circuit board non-metal powder, an ABS resin and a processing assistant in a high-speed mixer, putting the obtained mixture in a screw extruder, extruding, granulating through a granulator, and molding the extruded granules in an injection molding machine to prepare the waste printed circuit board non-metal powder/ABS rein composite material. The method has the advantages of reduction of the product production cost, certain economic values, recovery of the non-metal powder in a waste printed circuit board, prevention of the potential risk of the release of pollutants in randomly-stacked waste printed circuit board non-metal powder to the environment, and strong environment protection.

Description

Technical field [0001] The present invention mainly relates to the technical field of recycling and utilization of renewable resources, and a processing method for recycling waste printed circuit boards and ABS plastics; in particular, it relates to a waste printed circuit board non-metal powder / ABS resin composite material and a preparation method. Background technique [0002] Since the 1990s, the amount of waste of electrical and electronic products has increased rapidly, resulting in a large number of printed circuit boards, the core components of which are also discarded. At the same time, a large number of scraps and defective products produced by printed circuit board companies in the production process have made it necessary to dispose of printed circuits. The number of boards continues to increase. At present, after the waste printed circuit boards are crushed and sorted out of the metal powder with high recovery value, about 60% of the remaining non-metal powder is disc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L55/02C08L63/00C08K13/06C08K9/06C08K11/00C08K7/14C08K5/098C08K5/134B29B7/28B29B9/06B29C45/00B29C45/77B29C45/78
Inventor 李金惠只艳朱剑锋曾现来刘丽丽董庆银
Owner TSINGHUA UNIV
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