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Highly efficient thermoelectric material

A thermoelectric material, high-efficiency technology, applied in the direction of thermoelectric device junction lead-out material, thermoelectric device, circuit, etc., can solve the problem of hot end solder temperature limitation, thermal expansion difference between cold and hot solder ends, and inability to increase the temperature difference range, etc. Solving the limitation of temperature, the effect of high thermoelectric figure of merit

Inactive Publication Date: 2013-05-08
廖建能
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Problems solved by technology

[0002] Commonly used thermoelectric materials mainly convert heat energy into electrical energy, which is more suitable for refrigeration and temperature difference power generation. However, the bottleneck encountered in the development of thermoelectric technology at present is that the energy conversion efficiency of thermoelectric materials is low, and the thermoelectric conversion efficiency and the thermoelectric performance of materials are relatively low. value (ZT=α 2 T / κρ) is closely related, where α represents the seebeck coefficient, which refers to the voltage that can be generated by maintaining a temperature difference of 1 degree between the two ends of commonly used thermoelectric materials. Therefore, the higher the thermoelectric figure of merit, the better the energy conversion efficiency , but commonly used thermoelectric materials are all homogeneous thermoelectric materials, and it is relatively difficult to obtain a high thermoelectric figure of merit
[0003] In addition, a commonly used thermoelectric component is made of a commonly used thermoelectric material, and a commonly used thermoelectric component generates electric energy through a temperature difference. The lowest temperature end and the highest temperature end, because the temperature of the hot end of the commonly used thermoelectric components is limited by the lower liquefaction temperature of the metal solder joint, and the temperature difference between the cold and hot ends of the commonly used thermoelectric components causes the difference in volume thermal expansion and increases the stress of the solder. It is easy to cause damage to the solder joints and make the components fail, but the temperature difference range cannot be increased, and the efficiency of the components is not easy to optimize
[0004] Therefore, how to improve commonly used thermoelectric materials, so that commonly used thermoelectric materials can obtain a higher thermoelectric figure of merit, and improve the use efficiency of commonly used thermoelectric components is limited by the temperature of the solder, so as to solve the limitation of the solder temperature at the hot end, and Problems with differences in thermal expansion of hot and cold solder terminations

Method used

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Embodiment Construction

[0024] Please also see Figure 1a to Figure 1b As shown, the high-efficiency thermoelectric material provided by the present invention is firstly selected from a thermoelectric substrate 11 (such as Figure 1a shown), which includes a high carrier concentration region and a low carrier concentration region (not shown in the figure), and then the silver element is made into a silver glue 12, and then the silver glue 12 is coated on the thermoelectric substrate 11, and use a high-temperature furnace (not shown in the figure) to carry out a heating and diffusion program on the thermoelectric substrate 11 coated with the silver glue 12, and the heating and diffusion program is applied at a temperature of 250° C. to 350° C. The thermoelectric substrate 11 of the silver paste 12 is continuously heated for two hours, so that the silver paste 12 can be doped into one end of the thermoelectric substrate 11 to make a heterogeneous thermoelectric substrate 14, and the anisotropic thermoel...

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Abstract

A highly efficient thermoelectric material with one end coated in silver adhesive and placed in a high temperature furnace to heat and diffuse the silver adhesive into the homogeneous thermoelectric material, thereby producing an non-uniform thermoelectric material one-side doped thermoelectric material. The non-uniform thermoelectric material one-side doped thermoelectric material is able to achieve a high thermoelectric figure of merit.

Description

technical field [0001] The present invention relates to a high-efficiency thermoelectric material, especially a kind of one end of a thermoelectric material coated with a silver glue, and heated to form a non-uniform thermoelectric substrate, which is a high-efficiency thermoelectric material with a high thermoelectric value. thermoelectric materials. Background technique [0002] Commonly used thermoelectric materials mainly convert heat energy into electrical energy, which is more suitable for refrigeration and temperature difference power generation. However, the bottleneck encountered in the development of thermoelectric technology at present is that the energy conversion efficiency of thermoelectric materials is low, and the thermoelectric conversion efficiency and the thermoelectric performance of materials are relatively low. value (ZT=α 2 T / κρ) is closely related, where α represents the seebeck coefficient, which refers to the voltage that can be generated by mainta...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L35/28H01L35/00H10N10/10H10N10/00
CPCH01L35/28H01L35/12H01L35/00H10N10/85
Inventor 廖建能黄泓宪吴历杰林幸娴卢孟珮邱建豪
Owner 廖建能
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