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Bifocus laser processing system

A laser processing and dual focus technology, applied in the laser field, can solve the problems of the laser power ratio being unchangeable and the inability to apply laser micromachining, etc., to achieve the effect of improving product quality, processing speed and wide application.

Inactive Publication Date: 2013-05-22
WUHAN DR LASER TECH CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The focal length of the second focal point obtained by using a bifocal lens cannot be changed, and the laser power ratio of the two focal points cannot be changed, so it cannot be applied to laser micromachining

Method used

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Embodiment Construction

[0021] The technical solutions of the present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments. The schematic embodiments and descriptions of the present invention are used to explain the technical solutions of the present invention, but are not intended to limit the present invention.

[0022] The dual-focus laser processing system of the present invention includes a wave plate 21, a beam splitter 22, a convex mirror 23 and a focusing mirror 24, such as figure 2 shown.

[0023] The laser beam 5 passes through the wave plate 21 to obtain the first beam 11 .

[0024] The first light beam 11 is reflected by the beam splitter 22 to obtain the second light beam 12, and the second light beam 12 is focused by the focusing mirror 24 into the first beam on the optical axis of the laser beam acting on the workpiece 4 to be processed. The focal point 31, the distance between the first focal point 31 and the center of th...

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Abstract

The invention provides a bifocus laser processing system. The bifocus laser processing system comprises a spectroscope, a convex mirror and a focusing mirror. An incident beam is reflected through the spectroscope, and a second light beam is obtained; the second light beam is focused by the focusing mirror, and a first focus is formed; the incident beam is transmitted by the spectroscope, and a third light beam is obtained; the third light beam is reflected by the convex mirror, and then is transmitted by the spectroscope, and a fourth light beam is obtained; and the fourth light beam is focused by the focusing mirror, and a second focus is formed. According to the technical scheme, the first focus and the second focus are produced by the incident beam, and a focusing system with two focuses is formed. Distance between the first focus and the second focus can be changed by changing a curvature radius of the convex mirror, an energy ratio between the first focus and the second focus can be changed by adjusting a rotation angle of a wave plate, and processing speed and product quality are improved.

Description

technical field [0001] The invention relates to the field of lasers, and discloses a dual-focus laser processing system for transparent materials such as LED wafers, ceramics, silicon wafers, and glass. Background technique [0002] Laser cutting technology has now become a mature industrial processing technology. In addition to the traditional metal as the main object of cutting, cutting technology such as LED wafers, ceramics, silicon wafers and glass as cutting objects has become an emerging research direction. [0003] In the process of research, we found that the laser cutting technology with transparent materials such as LED wafers as the cutting object is different in principle from the laser cutting of traditional technology. Such as LED wafers, its laser cutting method is a pre-cutting method. Since these materials are formed through grain crystallization, the end point pulse energy of the laser focus will disrupt the structure between the grains. Defects are forme...

Claims

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Application Information

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IPC IPC(8): B23K26/06B23K26/38B23K26/067
Inventor 李志刚
Owner WUHAN DR LASER TECH CORP LTD
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