Metal-based circuit board with ultrahigh heat-conducting property and preparation method thereof

Abstract

The invention discloses a metal-based circuit board with ultrahigh heat-conducting property. The circuit board comprises a base material layer, a composite heat-conducting insulating layer attached to the surface of the base material layer, and a conducting circuit layer printed by a printed electronics technology, wherein the composite heat-conducting insulating layer comprises a substrate layer and an insulating layer; the upper surface of the substrate layer is attached to the insulating layer; and the lower surface of the substrate layer is attached to the surface of the base material layer. The invention also discloses a preparation method for the metal-based circuit board with the ultrahigh heat-conducting property. By the metal-based circuit board with the ultrahigh heat-conducting property, the defects of low breakdown voltage resistance and peel strength, non-uniform thickness of a conducting circuit, and the like are overcome while the heat transfer requirement is met.

Description

technical field [0001] The invention relates to a metal-based circuit board with ultra-high thermal conductivity and a preparation method thereof, belonging to the technical field of electronics. Background technique [0002] With the rapid development of microelectronics technology, the miniaturization of electronic devices, the continuous increase of the main frequency of the chip, and the gradual increase of the power consumption of a single chip have all led to a sharp increase in heat flux, especially in lighting LEDs, solar cells, processors, etc. and other fields. As an important electronic component of electronic devices, circuit boards are not only the support of electronic devices, but also the provider of circuit connections for electronic components, and further serve as a direct heat conduction and heat dissipation path for packaged devices that usually generate high heat flux. Resin-free metal-based circuit boards, that is, metal-based circuit boards that intr...

AI Technical Summary

Problems solved by technology

[0008] The purpose of the present invention is to provide an ultra-high thermal conductivity metal-based circuit board that solves the above technical problems. The present invention uses printed electronic technology to print conductive circuit layers, and is especially suitable for the packaging field of high heat flux electronic components. At the same time of transfer, it overcomes the shortcomings of low breakdown voltage, low peel strength, uneven thickness of conductive lines, etc.

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