Electronic protection glue and preparation method thereof
A technology of electronic protection and rubber mixing machine, applied in the direction of adhesives, non-polymer adhesive additives, adhesive types, etc., can solve secondary environmental pollution, high device cost, aging resistance, that is, poor stability and other problems, to achieve the effect of simple process, stable performance and low cost
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Embodiment 1
[0025] Embodiment 1: The present invention provides an electronic protective adhesive with no peculiar smell and stable performance. The electronic protective glue mainly includes the following components by weight percentage:
[0026] Butyl rubber 5%~15%, nitrile rubber 1%~10%, polyisobutylene (Polyisobutylene) 1%~10%, talcum powder 30%~55%, light calcium carbonate 15%~40%, flame retardant 5%~15%, paraffin 0.9%~10%, naphthenic oil 10%~20%, octadecanoic acid 0.5%~2%, carbon black 1%~25%.
[0027] The present invention provides a kind of preparation method of above-mentioned electronic protective glue:
[0028] S1: Weigh each component according to the above formula of electronic protective glue;
[0029] S2: Production of masterbatch: first put butyl rubber and nitrile rubber into a sealed rubber mixer for mixing until the temperature reaches 150°C (about 25 minutes), then add polyisobutylene and octadecanoic acid and mix well , add carbon black, mix for 10 minutes into a f...
Embodiment 2
[0032] Embodiment 2: This embodiment is similar to Embodiment 1, but does not include component octadecanoic acid and carbon black, and the electronic protective adhesive of the present embodiment mainly includes the following components by weight percentage:
[0033] Butyl rubber 5%~15%, nitrile rubber 1%~10%, polyisobutylene 1%~10%, talcum powder 30%~55%, light calcium carbonate 15%~40%, flame retardant 5%~ 15%, paraffin 0.9%~10%, naphthenic oil 10%~20%.
[0034] It can be understood that, in other embodiments, the components in weight percentage of the electronic protection adhesive may also include one of stearic acid 0.5%-2% and carbon black 1%-25%.
[0035] The preparation method of the electronic protective glue of this embodiment is the same as the preparation method in Example 1, except that stearic acid and carbon black are not added in step S2, and the formula of each component is weighed according to the weight percentage of each component in this embodiment .
Embodiment 3
[0036] Embodiment 3: On the basis of Embodiment 1, preferably, the electronic protective glue of the present invention mainly includes the following components by weight percentage:
[0037] Butyl rubber 6%~9%, nitrile rubber 1%~4%, polyisobutylene 1%~4%, talcum powder 35%~50%, light calcium carbonate 20%~30%, flame retardant 5%~ 10%, paraffin 0.9%~5%, naphthenic oil 10%~15%, octadecanoic acid 0.5%~2%, carbon black 1%~5%.
[0038] The preparation method of the electronic protective adhesive in this embodiment is the same as the preparation method in Embodiment 1.
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