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Electronic protection glue and preparation method thereof

A technology of electronic protection and rubber mixing machine, applied in the direction of adhesives, non-polymer adhesive additives, adhesive types, etc., can solve secondary environmental pollution, high device cost, aging resistance, that is, poor stability and other problems, to achieve the effect of simple process, stable performance and low cost

Active Publication Date: 2014-12-03
东莞市瑞为电器配件有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the existing electronic protective glue usually uses polyvinyl chloride as a raw material, and the device cost is high, and the manufactured product has a pungent smell, and will cause secondary environmental pollution; and the existing product has poor aging resistance, that is, poor stability.

Method used

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  • Electronic protection glue and preparation method thereof
  • Electronic protection glue and preparation method thereof
  • Electronic protection glue and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Embodiment 1: The present invention provides an electronic protective adhesive with no peculiar smell and stable performance. The electronic protective glue mainly includes the following components by weight percentage:

[0026] Butyl rubber 5%~15%, nitrile rubber 1%~10%, polyisobutylene (Polyisobutylene) 1%~10%, talcum powder 30%~55%, light calcium carbonate 15%~40%, flame retardant 5%~15%, paraffin 0.9%~10%, naphthenic oil 10%~20%, octadecanoic acid 0.5%~2%, carbon black 1%~25%.

[0027] The present invention provides a kind of preparation method of above-mentioned electronic protective glue:

[0028] S1: Weigh each component according to the above formula of electronic protective glue;

[0029] S2: Production of masterbatch: first put butyl rubber and nitrile rubber into a sealed rubber mixer for mixing until the temperature reaches 150°C (about 25 minutes), then add polyisobutylene and octadecanoic acid and mix well , add carbon black, mix for 10 minutes into a f...

Embodiment 2

[0032] Embodiment 2: This embodiment is similar to Embodiment 1, but does not include component octadecanoic acid and carbon black, and the electronic protective adhesive of the present embodiment mainly includes the following components by weight percentage:

[0033] Butyl rubber 5%~15%, nitrile rubber 1%~10%, polyisobutylene 1%~10%, talcum powder 30%~55%, light calcium carbonate 15%~40%, flame retardant 5%~ 15%, paraffin 0.9%~10%, naphthenic oil 10%~20%.

[0034] It can be understood that, in other embodiments, the components in weight percentage of the electronic protection adhesive may also include one of stearic acid 0.5%-2% and carbon black 1%-25%.

[0035] The preparation method of the electronic protective glue of this embodiment is the same as the preparation method in Example 1, except that stearic acid and carbon black are not added in step S2, and the formula of each component is weighed according to the weight percentage of each component in this embodiment .

Embodiment 3

[0036] Embodiment 3: On the basis of Embodiment 1, preferably, the electronic protective glue of the present invention mainly includes the following components by weight percentage:

[0037] Butyl rubber 6%~9%, nitrile rubber 1%~4%, polyisobutylene 1%~4%, talcum powder 35%~50%, light calcium carbonate 20%~30%, flame retardant 5%~ 10%, paraffin 0.9%~5%, naphthenic oil 10%~15%, octadecanoic acid 0.5%~2%, carbon black 1%~5%.

[0038] The preparation method of the electronic protective adhesive in this embodiment is the same as the preparation method in Embodiment 1.

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Abstract

The invention discloses electronic protection glue and a preparation method thereof. The electronic protection glue is composed of the following components: by weight, butyl rubber 5%-15%, nitrile rubber 1%-10%, polyisobutene 1%-10%, talcum powder 30%-55%, light calcium carbonate 15%-40%, fire retardant 5%-15%, paraffin wax 0.9%-10% and naphthenic oil 10%-20%. The preparation method of the electronic protection glue includes the steps of weighing each component, producing master batch, producing refining glue, and molding, packing and shipping after weighing. The electronic protection glue and the preparation method thereof have the advantage that the electronic protection glue manufactured by the preparation method has no foreign smell, performance is stable, and the preparation method is simple in process and low in cost.

Description

technical field [0001] The invention relates to the technical fields of chemical industry and electronics, in particular to an electronic protective glue and a preparation method thereof. Background technique [0002] In order to ensure that circuit boards, electronic devices, etc. maintain good insulation performance during use, avoid external impact machine damage, will not be affected by machinery, heat, humidity, dust, oily smoke, etc., and improve performance and stability parameters, it is necessary to These devices are coated with a protective coating or packaged. Electronic protective glue is liquid before use, which is easy to pour and use. It is often used for bonding, sealing, potting and coating protection of electronic components and optoelectronic devices. It can prevent moisture, dust, corrosion and shock. effect. [0003] However, the existing electronic protective glue usually uses polyvinyl chloride as a raw material, and the device cost is high, and the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J123/22C09J109/02C09J11/04C09J11/06C09J9/00
Inventor 张瑞廷
Owner 东莞市瑞为电器配件有限公司