Reflection-type photoetching projection objective
A lithography projection and reflection technology, applied in microlithography exposure equipment, optics, optical components, etc., can solve the problems of increased difficulty in manufacturing objective lenses, low exposure efficiency, and increased cost, and achieves high transmittance, increased Exposure illuminance, the effect of improving productivity
Active Publication Date: 2013-06-05
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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Abstract
The invention provides a reflection-type photoetching projection objective, which orderly comprises, in a light propagation direction: a first planar reflector, a first spherical reflector with a positive focal power, a second spherical reflector with a negative focal power, a third spherical reflector with a positive focal power, and a second planar reflector; the light propagation direction orderly passes through the first planar reflector, the first spherical reflector with a positive focal power, the second spherical reflector with a negative focal power, the third spherical reflector with a positive focal power, and the second planar reflector. The reflection-type photoetching projection objective of the invention has the following advantages: the exposure field of view is large, which is 500 mm in a non-scanning direction; multi-wavelength exposure is adopted, which increases the exposure illumination, and improves the yield of the photoetching machine; a 3-face reflector pure reflection structure is adopted, which provides the objective with extremely high transmittance, obtains excellent image quality with the proviso that the focal power of each reflector is reasonably distributed, and ensures important premises such as objective manufacture, cost, weight, and the like.
Application Domain
Photomechanical exposure apparatusMicrolithography exposure apparatus +1
Technology Topic
PhysicsMulti wavelength +7
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