A Control System of Automatic Chemical Etching Machine for Silicon Wafer
Patent Information
- Authority / Receiving Office
- CN ยท China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- ZHONGHUAN ADVANCED SEMICON MATERIALS CO LTD
- Publication Date
- 2016-05-25
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Abstract
Description
technical field
[0001] The invention relates to the technical field of silicon wafer manufacturing equipment, in particular to a control system for an automatic chemical etching machine for silicon wafers. Background technique
[0002] Chemical etching is a very important process in the manufacturing process of silicon wafers today. The mainstream equipment used in production today is all produced in Japan, which can basically meet the needs of production. But as the equipment is used in daily life, some deficiencies in the power control part and some unreasonable problems in the program will gradually appear.
[0003] The handling system of the original rot machine is cylinder drive. The movement of the cylinder piston is controlled by controlling the on-off of the air valve, and the movement of the thread and the nut is used to achieve the effect of the movement of the mechanical arm. The braking part adopts optocoupler limit switches and safety hard limit blocks, and t...