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Conductive pressure-sensitive adhesive for splicing stainless steel and aluminum alloy as well as preparation and using methods thereof

A technology of stainless steel and aluminum alloy, applied in the direction of surface pretreatment bonding method, adhesive type, conductive adhesive, etc., can solve poor electrical conductivity, cannot meet the requirements of electrical conductivity and bonding at the same time, bonding Poor performance and other problems, to achieve the effect of good bonding, long-lasting bonding time, and not easy to accelerate galvanic corrosion

Active Publication Date: 2013-06-12
NORTHWESTERN POLYTECHNICAL UNIV
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  • Summary
  • Abstract
  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The conductive pressure-sensitive adhesives sold in the market either have poor conductivity, or have poor bonding performance due to the addition of too much conductive filler, and cannot meet the requirements of conductivity and bonding at the same time.

Method used

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  • Conductive pressure-sensitive adhesive for splicing stainless steel and aluminum alloy as well as preparation and using methods thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] The component of embodiment 1 is:

[0028] 40% polyacrylate, 10% conductive material and 0.6% KH570, the rest is butanone solvent;

Embodiment 2

[0029] The component of embodiment 2 is:

[0030] 40% polyacrylate, 15% conductive material and 0.6% KH570, the rest is butanone solvent;

Embodiment 3

[0031] The component of embodiment 3 is:

[0032] 40% polyacrylate, 20% conductive material and 0.6% KH570, the rest is butanone solvent;

[0033] 3. The method of using conductive pressure-sensitive adhesive to bond stainless steel and aluminum alloy:

[0034] Prepare primer:

[0035] Mix 72% methanol, 20% KH570 and 8% water to obtain primer;

[0036] Pretreatment of stainless steel and aluminum alloy materials: clean the burrs on the surface of stainless steel and aluminum alloy products, polish off the oxide layer, and then clean the surface impurities with acetone and water;

[0037] Apply the primer to the area where the stainless steel or aluminum alloy products are to be bonded, so that the surface of the product is evenly wetted, and let it dry for 10 minutes. Then apply the conductive pressure-sensitive adhesive to the surfaces of the two products, and apply force after 5 minutes to bond the two surfaces.

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Abstract

The invention relates to conductive pressure-sensitive adhesive for splicing stainless steel and aluminum alloy as well as preparation and using methods thereof. The conductive pressure-sensitive adhesive comprises a polyacrylate substrate, a conductive material, a solvent and a coupling agent. The method comprises the steps of preparing the conductive material, preparing the polyacrylate conductive pressure-sensitive adhesive, preparing the silane coupling agent, pre-processing the stainless steel and the aluminum alloy, and using the conductive pressure-sensitive adhesive. The conductive pressure-sensitive adhesive prepared by the invention is suitable for connection of the stainless steel and the aluminum alloy material, and has the advantages that repairing is easy, bonding time is long, galvanic corrosion acceleration is not easy to generate and the like in comparison with metal welding.

Description

technical field [0001] The invention belongs to conductive pressure-sensitive adhesive, in particular to a conductive pressure-sensitive adhesive for bonding stainless steel and aluminum alloy and a preparation method thereof, and also relates to a method for using the conductive pressure-sensitive adhesive to bond stainless steel and aluminum alloy. Background technique [0002] With the development of the electronics industry and transportation, stainless steel and aluminum alloy materials are used more and more widely, so higher requirements are put forward for the connection technology of these two materials. Although traditional solder has the characteristics of low cost and high strength, it cannot meet the needs of high-integration packaging technology, solder joints are prone to fatigue, soldering operations are cumbersome, and pollution endangers the environment. Therefore, it is a trend that traditional solders are replaced by new high-performance materials. [00...

Claims

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Application Information

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IPC IPC(8): C09J133/04C09J9/02C09J5/02C23C18/18C23C18/42
Inventor 齐暑华张帆史金玲张翼
Owner NORTHWESTERN POLYTECHNICAL UNIV
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